• 제목/요약/키워드: packaging materials

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Constrained Sintering 공정에 의한 K7.6/K65 이종접합 Embedded Capacitor의 제조 및 특성 (Fabrication and Properties of Heterostructure (K7.6/K65) Embedded Capacitor by Constrained Sintering Process)

  • 조태현;조현민;김준철;김동수;강남기
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2006년도 추계학술대회 논문집 Vol.19
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    • pp.194-195
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    • 2006

  • 개인 휴대 통신 기기의 급속한 발달로 인해 부품의 소형화, 고집적화가 중요한 요소로 대두되고 있으며 이를 위해서는 모듈내부에 3차원적인 수동소자의 내장이 가능한 LTCC (Low Temperature Co-fired Ceramics) 공정이 각광받고 있다. Embedded Capacitor를 제조하기 위해 유전율이 7.6과 6.5인 LTCC 재료를 이종접합 하여 제조하였으며 이종재료의 수축거동 차이에 의한 camber가 발생하였다. 이를 해결하고 또한 고주파 부품용 정밀회로 패턴을 구 현하기 위해 PLAS 방식의 Constrained Sintering 공정을 적용하여 camber 문제를 해결하였으며 capacitance 값이 두 이종재료의 유전율과 1:1로 비례하지 않았는데 이는 유전율 65 tape에 잔존하는 기공 때문으로 판단되며 미세구조로써 확인하였다.

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SoP-L 공정을 이용한 DPDT 스위치를 임베딩 할 경우 스위치 특성에 영향을 주는 Via의 loss 분석 (Analysis of Via Loss Characteristic in Embedded DPDT Switch Using SoP-L Fabrication)

  • 문종원;권은진;류종인;박세훈;김준철
    • 대한전자공학회:학술대회논문집
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    • 대한전자공학회 2008년도 하계종합학술대회
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    • pp.557-558
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    • 2008

  • This paper presents the effects of via losses to be connected with an embedded DPDT(Double Pole Double Thru) in a substrate. The substrate consists of two ABF(Ajinomoto Bonding Film) and a Epoxy core. In order to verify and test effects of via, via chains in a substrate using SoP-L process are proposed and measured. Via loss can be calculated as averaging the total via holes. The exact loss of a DPDT switch embedded in substrate are extracted by using the results of via chain and measured data from embedded DPDT. The calculated one via insertion loss is about 0.0005 dB on basis of measured via chains. This result confirms very low loss in via. So the inserti on loss of the embedded switch is confirmed only switch loss as loss is 0.4 dB.

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Screening of Agricultural and Food Processing Waste Materials as New Sources for Biodegradable Food Packaging Application

  • Wang, Long-Feng;Reddy, Jeevan Prasad;Rhim, Jong-Whan
    • 한국포장학회지
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    • 제20권1호
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    • pp.7-15
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    • 2014

  • Agar-based composite films were prepared with variety of food processing and agricultural processing waste materials in order to screen natural lingo-cellulosic resources for the value-added utilization of the under-utilized materials. The effect of these waste materials (10 wt% based on agar) on mechanical properties, moisture content (MC), water vapor permeability (WVP), water absorption behavior of biocomposite films were investigated. Biocomposite films prepared with various fibers resulted in significant increase or decrease in color and percent transmittance. The MC, WVP, and surface hydrophobicity of biocomposite films increased significantly by incorporation of fibers, while the water uptake ratio and solubility of the film decreased. SEM images of biocomposite film showed better adhesion between the fiber and agar polymer. Among the tested cellulosic waste materials, rice wine waste, onion and garlic fibers were promising for the value-added utilization as a reinforcing material for the preparation of biocomposite food packaging films.

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Vacuum Packaging and Operating Properties of Micro-Tunneling Sensors

  • Park, H.W.;Lee, D.J.;Son, Y. B.;Park, J.H.;Oh, M. H.;Ju, B. K.
    • 한국마이크로전자및패키징학회:학술대회논문집
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    • 한국마이크로전자및패키징학회 2000년도 Proceedings of 5th International Joint Symposium on Microeletronics and Packaging
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    • pp.110-110
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    • 2000

  • Cantilever-shaped lateral field emitters were fabricated and their electrical characteristics were tested. As shown in Fig.1, poly-silicon cantilevers were fabricated by the surface micromachining and they were used to the vacuum magnetic field sensors. The tunneling devices were vacuum sealed with the tubeless packaging method, as shown in Fig.2 and Fig.3. The soda-lime glasses were used for better encapsulation, so the sputtered silicon and the glass layers on the soda-lime glasses were bonded together at 1x10$^{-6}$ Torr. The getter was activated after the vacuum sealing fur the stable emissions. The devices were tested outside of the vacuum chamber. Through vacuum packaging, the tunneling sensors can be utilized. Fig.4 shows that the sensor operates with the switching of the magnetic field. When the magnetic field was applied to the device, the anode currents were varied by the Lorentz force. The difference of anode currents can be varied with the strength of the applied magnetic field.

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