• 제목/요약/키워드: packaging materials

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LTCC/LTCC-M Technologies for Packaging and Module Fabrication

  • Moon, Je-Do
    • 한국마이크로전자및패키징학회:학술대회논문집
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    • 한국마이크로전자및패키징학회 2002년도 International Symposium
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    • pp.33-49
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    • 2002
  • $\Box$ LTCC/LTCC-M technologies are a cost-effective SOP technology $\Box$ LTCC/LTCC-M materials have good RF characteristics and the materials can be used as excellent substrates for high band width applications $\Box$ Reliability of LTCC/LTCC-M package or module can be greatly improved by embedded passive technology and CTE control of the substrates $\Box$ To expand the application area, more development is needed in realization of embedded passives with tight tolerance

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RFID의 패키징 적용에 관한 연구 (A Study on RFID Applications to Packaging)

  • 이수용;김재능
    • 한국포장학회지
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    • 제14권1호
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    • pp.15-22
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    • 2008
  • The excitement over radio frequency identification (RFID) technology has gained momentum in the last five years, with a diversification in the range of applications. Besides academic research into radio frequency identification (RFID) has proliferated over the last few years, however there is much to be desired on Packaging industry. In this paper, we present a literature reviews of researches of RFID system on Packaging, especially focused on RFID system standardization into packaging. There is not any packaging standard or guidance about tag locations, classification with the materials and so on. Therefore it hampers reduction of the distribution costs on political and corporate sides, and lack consistency of applying RFID system. The main focus of this review paper is to establish a constituency about legislating RFID system standard on packaging. It is hoped that the review will be a good resource for future research in order to applly RFID system to Packaging industry effectively.

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화장품의 친환경적인 포장개발에 관한 연구 (A Study on the Development of the Environmental Friendly Packaging of Cosmetic Products)

  • 김재능
    • 한국포장학회지
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    • 제9권1호
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    • pp.25-32
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    • 2003
  • Packaging has been regarded as a environmental problem because of its relatively high portion of municipal solid wastes. Especially, cosmetic packaging has been focused because of characteristics of cosmetic packaging. Cosmetic products are highly sensitive products that pursue the beauty differently from other products. Cosmetic packaging materials are difficult to be recycled. Purpose of this study is to suggest the method to improve the environmental friendly packaging of cosmetic products. This study contains the major governmental policies on the cosmetic packaging in terms of environment issues in Korea, and suggested methods to develop the environmental friendly packaging of cosmetic products.

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한국의 플라스틱포장재의 재활용 기술 동향 (Recycling Facts and Technical Trends of Plastic Packaging Materials in Korea)

  • 하영선;김종경;김수일
    • 한국포장학회지
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    • 제8권2호
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    • pp.44-48
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    • 2002
  • 플라스틱 포장재는 소비자들이 생각하는 것보다 환경에 미치는 영향이 적으나 플라스틱 제조업체들에게는 플라스틱 폐기물을 위한 재활용시장을 어떻게 활용화하는가는 매우 중요하다. 이것을 위하여 정부는 충분한 규모의 재활용시장을 키워나갈 수 있도록 MRF 등 각종 설비를 지원해야 하며 성공적인 재활용정책을 개발해야 한다. 경제적이고 다양한 재활용기술이 소개되고 있지만 이것은 반드시 잘 정비된 재활용정책이 우선되어야 성공할 수 있다.

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바이오매스 기반 종이 플라스틱의 제조 및 응용에 대한 고찰 (A Study on Manufacturing of Paper Plastics Based on Biomass and Their Applications)

  • 윤광식;이동은;조대명
    • 한국포장학회지
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    • 제26권1호
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    • pp.25-31
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    • 2020
  • Recently, applications of biomass-based plastics have increased according to the eco-friendly policy of the reduction of carbon dioxide emissions in domestic and foreign government. In this study, a paper plastic composite was produced by compounding polypropylene and micronized paper powder that was prepared using dry pulverization technology. Subsequently, the specimen of paper plastic was verified with mechanical properties, formability and product safety test to confirm the suitable packaging materials for food packaging. Paper plastics showed slightly lower mechanical properties than currently commercialized PP composites. However, paper plastics are valuable materials as environmentally friendly carbon-reducing material because of high biocarbon content, light weight features and applicability of existing manufacturing machines or system.

Comparison of the Power Consumption between the Ceramic and Wire Bonding Packaging Methods for Solid State Electrochemical Carbon dioxide Sensors

  • Kim, Tae Wan;Park, Chong-Ook
    • 센서학회지
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    • 제25권3호
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    • pp.173-177
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    • 2016
  • Tape casting ceramics technology has been adopted for the fabrication of solid state electrochemical $CO_2$ sensors and the packaging substrates. The fabricated $CO_2$ sensors exhibit a fast response and a good recovery with the almost theoretical sensitivity of 37 mV/decade, corresponding to a sensor operating temperature of 373 K. The two packaging methods, the wire bonding package and the surface- mounted on the ceramic package, were compared with respect to their power consumption and mass production feasibility. In terms of the ease of fabrication, the surface mount packaging technology is superior to the wire bonding technology but its power consumption is approximately twice that of the wired package.

파워모듈의 TLP 접합 및 와이어 본딩 (TLP and Wire Bonding for Power Module)

  • 강혜준;정재필
    • 마이크로전자및패키징학회지
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    • 제26권4호
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    • pp.7-13
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    • 2019
  • Power module is getting attention from electronic industries such as solar cell, battery and electric vehicles. Transient liquid phase (TLP) boding, sintering with Ag and Cu powders and wire bonding are applied to power module packaging. Sintering is a popular process but it has some disadvantages such as high cost, complex procedures and long bonding time. Meanwhile, TLP bonding has lower bonding temperature, cost effectiveness and less porosity. However, it also needs to improve ductility of the intermetallic compounds (IMCs) at the joint. Wire boding is also an important interconnection process between semiconductor chip and metal lead for direct bonded copper (DBC). In this study, TLP bonding using Sn-based solders and wire bonding process for power electronics packaging are described.

문화와 과학의 융합적 관점에서 본 전통음식의 역사 및 미래 (Traditional Foods: Historical Perspectives and Future Prospects)

  • 김희섭
    • 한국식생활문화학회지
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    • 제30권1호
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    • pp.1-7
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    • 2015
  • Traditional cuisine reflects cooking traditions shaped by political, economic, social, cultural, and environmental conditions characterized by authenticity and uniqueness. Traditional food is not only a part of our cultural heritage but also a knowledge resource. Application of food science and technology in Korean traditional foods was reviewed from six points of view, including food preservation, fermentation, changes in food materials, utilization of food functionality, and packaging and development of cooking appliances. Books from disparate times were chosen in order to cover a wide range of materials from the past to the present. Food preservation and fermentation techniques were applied to various food materials. Combination of science and skills contributes to the accessibility of diverse food materials and better quality foods. Koreans use assorted and resilient plants, which have an abundance of functional substances such as food materials. Among cooking appliances, microwave oven and refrigerator are the most innovative products with huge influences on food eating patterns as well as lifestyle. Packaging effectively reduces post-harvest preservation losses, and better packaging has technical improvements for storage and distribution. Kimchi was chosen as an example in order to study technology from the past to the present. Availability of Kimchi cabbage, enrichment of functional ingredients, identification of useful microbial species, standardization of recipe for commercialization, prevention of texture softening, introduction of salted Kimchi cabbage and Kimchi refrigerators, and packaging were reviewed. The future of traditional foods in the market will be competitive. First, traditional foods market should be maintained to protect the diversity of food materials. Secondly, tailored foods for individuals should be considered using foods with functional properties. Information on health benefits would provide insights into health and traditional food products. Third, speedy transfer of new technology to the traditional food industry is needed to ensure food quality production and new opportunities in the market. Fourth, safety of traditional foods should be ensured without sacrificing the essential characteristics of culturally important foods. Improvement of logistics, distribution, and facility should be carried out. As demand for convenience foods increases, traditional foods should be developed into products.

Review on the Lead-Free Solder Technology

  • Lee, Hyuck-Mo
    • 한국마이크로전자및패키징학회:학술대회논문집
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    • 한국마이크로전자및패키징학회 2001년도 3rd Korea-Japan Advanced Semiconductor Packaging Technology Seminar
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    • pp.21-50
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    • 2001
  • EC's/Japanese environmental regulation drive the Pb-free/Halogen-free application. Most Japanese electronics companies are preparing the green products. All items concerning to Pb-free/Halogen-ree technology should be coparallely designed and developed. More works need to clear the unknowns on Pb-free materials. Need of consensus on materials and standards. EBM (Environmental Benign Manufacturing)

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