• 마이크로전자및패키징학회지
• /
• 제12권1호
• /
• pp.77-85
• /
• 2005

Impedance spectroscopy was applied to low temperature polycrystalline Si in order to investigate the electrical/dielectric information in polycrystalline Si. By combined microstructure and impedance spectroscopy works, it was shown that the electrical information is sensitive to the corresponding microstructure, i.e., the grain size and distribution, judged from the capacitance vs. grain size relationship. At $360 mJ/cm^2$, the maximum in capacitance and the minimum in resistance correspond to the largest grain sizes of unimodal distribution in polycrystalline Si. The electrical/dielectric characterization is compared with Raman spectroscopic characterizations in terms of microstructure.

• 마이크로전자및패키징학회지
• /
• 제12권3호
• /
• pp.219-226
• /
• 2005

When a ferroelectric film has an inhomogeneous distribution of charged defects, a voltage shift in the polarization curve is induced by the internal field generated in the film. The direction and the magnitude of voltage shift in the P-V hysteresis curves obtained by the Sawyer-Tower method are different from those obtained by the virtual ground method. In this study, the asymmetric behavior in the P-V hysteresis curves of inhomogeneous ferroelectric films was investigated with a physical model and the polarization curves obtained by the Sawyer-Tower and the virtual ground methods are compared.

• 한국마이크로전자및패키징학회:학술대회논문집
• /
• 한국마이크로전자및패키징학회 2003년도 기술심포지움 논문집
• /
• pp.270-277
• /
• 2003

Thermal performance of flip chip bonding with Sn-3.5Ag solder ball was studied. The temperature distribution was measured with IR(InfraRed) camera of 25 urn resolution. The measurement shows that most of the samples had much higher maximum temperature than average temperature. With central heater and 2.5 (W), the difference between maximum and average temperature is over $80^{\circ}C$. The distribution was influenced by the location of heater, the distance from heater to flip chip bonding, and the passivation opening of solder bumps. To reduce the maximum temperature, the bigger passivation opening, the smaller chip size, and the closer location of heater to flip chip bumps are preferrable.

• 한국마이크로전자및패키징학회:학술대회논문집
• /
• 한국마이크로전자및패키징학회 2002년도 춘계 기술심포지움 논문집
• /
• pp.198-202
• /
• 2002

$HfO_2$films were grown on Si substrate in the temperature range $250~550^{\circ}C$ using metal organic chemical vapor deposition (MOCVD) technique for a gate dielectric. Hafnium tart-butoxide and Oxygen gas were used as precursors and N2 was used as carrier gas. Impurity distribution and film structure(including interfacial layer) were studied at the deposition temperature range between 25$0^{\circ}C$ and $550^{\circ}C$. The growth rate and impurty distribution decreased with increasing temperature. The electrical properties of $HfO_2$were investigated with C-V, 1-V method and showed it has a good properties as a gate dielectric.

• 한국포장학회지
• /
• 제23권1호
• /
• pp.47-53
• /
• 2017

최근 화훼 산업의 활성화를 위하여 정부 주도의 캠페인, 꽃 문화 확산 운동 등 화훼 소비 증대를 위한 활동들이 꾸준히 진행되고 있다. 절화류 상품은 MA 포장, 기능성 포장 개발 등 다양한 방법을 통하여 상품의 품질 유지를 위한 연구가 진행되고 있으나, 국내 분화류 제품의 경우 품질 개선 및 포장 디자인 등에 대한 연구가 여전히 미비한 실정이다. 또한 소형 분화류의 온라인 마켓 유통량이 점차 증가되고 있음에 따라, 산지에서 소매점, 소비자에게 이르기까지 제품의 품질 유지를 위한 다양한 구조 형태의 포장 개발이 요구되고 있다. 본 조사 연구는 소형 분화류 제품에 대한 소비자의 요구에 적합한 포장을 고려하기 위하여 기존 포장을 개선하는 목적으로 포장 소재 및 형태, 투명도, 편리성, 및 기타 포장 선호도 등에 대한 조사를 실시하였다. 결과로 플라스틱 포장 소재, 분리형 포장, 투명 포장 그리고 상품의 안정성 및 품질 유지를 위한 포장을 선호하는 것으로 파악되었다. 따라서 국내 소비자의 소형 분화류 상품 선호도 조사 연구를 바탕으로 향후 다양한 분화류 제품 및 제품 크기에 따른 상품화 가능성, 가격 변화 요인 등을 고려한 연구가 추가적으로 진행되어야 될 것으로 판단된다.

• The Journal of Asian Finance, Economics and Business
• /
• 제8권1호
• /
• pp.985-996
• /
• 2021

While green packaging related concerns are mainly studied in developed countries, there is a lack of knowledge to observe purchase behavior toward green packaging in developing countries, especially in Vietnam. Buying green packaged products in FMCG is not required to trade-off between sustainability and product performance. Hence, this present research aims to understand the gap attitude - behavior existing on FMCG green packaged products among Vietnamese young consumers with psychosocial factors (environmental concern, environmental knowledge of green packaging and green trust) and contextual factors (availability of desired green packaging and product attributes). With a sample size of 396 respondents, data was collected by convenient sampling method and then was analyzed using structural equation modeling. The results reveal that all psychosocial factors are positive related to attitudes while purchase behavior is positively influenced. The findings also report that contextual factors have positive impacts on purchase behavior, which proves the important role of contextual factors in influencing consumer choices. It suggests that green packaging is receptive to Vietnamese young consumers but it should be considered within product-related context to enhance the difference in sustainability among similar FMCG products. Practical implications for marketers and future researches have also been discussed at the end of study.

• The Journal of Asian Finance, Economics and Business
• /
• 제10권2호
• /
• pp.281-300
• /
• 2023

Recently, the call for better accountability and social responsibility from corporations has been regularly voiced, both in the academic literature and in public discussions. This poses a challenge to the existing literature in understanding consumption behaviors to direct them toward sustainable development. This study investigates the purchase intention of Gen Z consumers in Vietnam with green packaging products. Data were collected from 914 respondents by online questionnaire and then analyzed using OLS. The results suggest the significant influence of customers' income and packaging in driving customers' intention to use environmentally-friendly products. Specifically, consumers in a higher income class participate more actively in green purchases. However, problems associated with inadequate packaging are also illustrated, resulting in the poor perception of green messages and poor practice of ecological actions. Besides, subjective norms and green trust are found to be adversely related to green consumer intention. In addition, gender disparity in green behavior is reported, where female consumers show a higher tendency to ecological consumption than their male counterparts. Other demographic factors are also included in the model as control variables, which are age, education, price, environmental literacy, environmental concern, and psychological awareness, but they do not have a significant impact on green purchase intention.

• ETRI Journal
• /
• 제25권6호
• /
• pp.423-436
• /
• 2003

This paper describes our design of a contents distribution framework that supports transparent distribution of digital contents on the Internet as well as copyright protection of participants in the contents distribution value chain. Copyright protection must ensure that participants in the distribution channel get the royalties due to them and that purchasers use the contents according to usage rules. It must also prevent illegal draining of digital contents. To design a contents distribution framework satisfying the above requirements, we first present four digital contents distribution models. On the basis of the suggested distribution models, we designed a contract system for distribution of royalties among participants in the contents distribution channel, a license mechanism for enforcement of contents usage to purchasers, and both a packaging mechanism and a secure client system for prevention of illegal draining of digital contents.

• 한국전자통신학회논문지
• /
• 제8권6호
• /
• pp.923-931
• /
• 2013

RFID(Radio Frequency Identification)는 버스카드, 출입문 카드, 물류유통, 건축자재 관리 등 일상생활에서 다양하게 사용되는 태그의 일종으로 ID정보를 무선 주파수(RF, Radio Frequency)를 사용하여 인식하는 무선인식장치이다. RFID는 투과성과 인식률, 메모리 크기, 다중태그 인식률, 외부 오염 먼지, 외부 충격 등에 따라 크기와 성능이 달라지고, 이와 같은 요소들을 고려한 RFID 보호를 위한 패키징이 필요하다. 현재 RFID는 건축자재의 효과적인 관리를 위해서도 다양하게 사용되고 있는데, 건축자재에 RFID를 부착하기 위해서는 외부로 부터의 충격에 강건한 건축자재용 RFID 패키징 제작이 요구되고 있다. 본 논문에서는 외부 충격에 강하고, 고장 시 RFID의 교체가 가능하도록 패키징 틀과 본체를 분리하여 설계된 건축자재용 RFID 패키징을 제안한다. 제안된 RFID 패키징을 위한 상세한 설계도를 제시하였으며, 3D 프린터를 사용하여 설계된 패키징을 직접 제작하여 성능 평가를 실시하였다.

• 한국포장학회지
• /
• 제13권1호
• /
• pp.19-23
• /
• 2007

Shock and vibration inputs are transmitted from the transporting vehicle through the packaging to the fruit. The vibration causes sustained bouncing of fruits against each other and the container wall. The steady state vibration input may cause serous fruit injury, and the damage is particularly severe if the fruits are bounced at its resonance frequency. The determination of the resonance frequencies of the fruits and vegetables may help the packaging designer to determine the proper packaging system providing adequate protection for the fruits, and to understand the complex interaction between the components of the fruits when they relate to expected transportation vibration inputs. To analyze the vibration properties of the apples for optimum packaging design during transportation, random vibration tests were carried out. In the random vibration test, the resonance frequency and PSD of the packaged freight of apples in the test were in the range of 82 to 97 Hz and 0.0013 to $0.0021G^2/Hz$ respectively and the resonance frequency and PSD of the packaged apples in the test were in the range of 13 to 71 Hz and 0.0143 to $0.0923G^2/Hz$.