• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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• v.11 no.1
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• pp.33-40
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• 2005

This study was carried out for effective utilization of recycling resources to investigate the repulping conditions of car air filter waste paper and to evaluate the application into corrugating medium papermaking by blending these repulped pulps. Car air filter waste paper was made of virgin BKP and it was dipped into phenol resin solution. It was well disintegrated by laboratory Valley beater with 10%(basis on oven-dried pulp weight) NaOH addition and defoamer usage. The optimal temperature, beating consistency and treatment time were mainly $40^{\circ}C$, 1% and $30{\sim}40$ minutes, respectively. Handsheets were prepared with various blending ratios between air filter recycled pulp and KOCC. In the case of $10{\sim}20%$ substitution with air filter recycled pulp, physical properties reductions as compressive strength and burst strength of sheets were lower than others. These results showed more favour than the partial substitution of KOCC for corrugating medium even though some strength reduction of paper. It was also observed that the waste water of air filter recycling was not affective to environmental problems.

• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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• v.28 no.2
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• pp.133-142
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• 2022

Korean enoki mushrooms are exported to Southeast Asia and the United States, where there are complaints due to quality deterioration during the distribution process. In this study, we evaluated the efficacy of vacuum film packaging on quality maintenance in Korean enoki mushrooms during simulated vessel export to Vietnam using selected film, which was developed with vacuum packaging machine and oxygen absorber. We selected two MA film, one was 2-layerd 30 ㎛ CPP film (control) and the other was 3-layered 30 ㎛ CPP film (treatment) which is optimized film of higher gas and moisture permeability. The Korean enoki mushrooms were packaged with these two films using PAC-2000 or PAC-3000 vacuum packaging machine which was improved vacuuming of higher speed. Packed mushrooms were stored at 1℃ for 2 weeks and distributed at 20℃ for 2 days or 8℃ for 6 days. The efficiency of the film packaging was analyzed by vacuum maintaining index, and overall the quality characteristics such as off odor, color, cap cleavage, stem elongations and sensory evaluation were evaluated during storage and distribution. Results suggest that postharvest loss of fresh enoki mushroom could be reduced by packaging mushroom with 3-layered 30 ㎛ CPP films packaged using PAC-3000 machine during simulated vessel export to Vietnam due to vacuum maintaining. Oxygen absorber promoted off-odor at 20℃ distribution temperature, and did not affect storability at 1℃ storage compared to treated group without oxygen absorber treatment.

• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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• v.26 no.2
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• pp.99-103
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• 2020

The volume of parcel delivery is steadily increasing with the rapid growth of the global online e-commerce market. However, a large amount of packaging materials used for these parcel delivery is finally causing environmental problems as waste. In this study, we have taken a pilot test on the returnable parcel delivery packaging & service, which is one of various ways to reduce the generation of the distribution packaging waste raised by e-commerce-based parcel delivery. For the purpose of this project, we made 300 boxes of returnable & foldable delivery packaging(415 mm × 280 mm × 160 mm) and have cooperated with e-commerce company(CJ ENM) & logistics company(LogisAll). Consequently, about 50% of the delivered packages was returned because of the lack of consumer's understanding on the returnable packaging system. We finally have suggested the policy strategy to get over problems derived from the experiment, like the retrieval rate and cost of the returnable packaging, economic efficiency and so on.

• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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• v.28 no.1
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• pp.67-73
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• 2022

The food cold chain refers to a technology and distribution supply chain applied to maintain a constant temperature suitable for the product from production (harvest) to delivery to consumers. In particular, in Korea, the insulation material used in the food cold chain is mostly EPS (Expanded Polystyrene), which is used as a transport container for various food cold chains. However, according to the government's eco-friendly policy, companies charge environmental contributions to the use of EPS, but due to its low price and convenience of handling, it is still used as a container for delivering food. In this study, in order to measure the domestic delivery environment of general refrigerated foods, changes in impact, temperature, and humidity during transport of the EPS packaging system containing foods and ice pack refrigerants were measured. As a result, there were 2?3 sections in which a high impact force of 40 G or more was generated during transport. This can cause damage to the product and EPS container. The difference in temperature and humidity changes by parcel transport routes is more than 30%, so it is necessary to present accurate standards for the domestic cold chain distribution environment. As a result of microbial experiments. the transportation period had a dominant effect on the increase in total viable count and E. coli count.

• Journal of the Microelectronics and Packaging Society
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• v.22 no.1
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• pp.27-34
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• 2015

The correlation between crack propagation and localized recrystallization are compared in a series of cross section analyses on thermal cycled edgebond and underfilm material applied wafer level chip scale package (WLCSP) components with a baseline of no-material applied WLCSP components. The results show that the crack propagation distribution and recrystallization region correlation can explain potential degradation mechanisms and support the damage accumulation history in a more efficient way. Edgebond material applied components show a shift of damage accumulation to a more localized region, thus potentially accelerated the degradation during thermal cycling. Underfilm material applied components triggered more solder joints for a more wider distribution of damage accumulation resulting in a slightly improved thermal cycling performance compared to no-material applied components. Using an analysis on localized distribution of recrystallized areas inside the solder joint showed potential value as a new analytical approach.

• Journal of the Microelectronics and Packaging Society
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• v.24 no.3
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• pp.1-6
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• 2017

As the performance and density of IC devices increase, especially the clock frequency increases, power grid network integrity problems become more challenging. To resolve these power integrity problems, the use of passive devices such as resistor, inductor, and capacitor is very important. To manage the power integrity with little noise or ripple, decoupling capacitors are essential in electronic packaging. The decoupling capacitors are classified into voltage regulator capacitor, board capacitor, package capacitor, and on-chip capacitor. For next generation packaging technologies such as 3D packaging or wafer level packaging on-chip MIM decoupling capacitor is the key element for power distribution and delivery management. This paper reviews the use and necessity of on-chip decoupling capacitor.

• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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• v.11 no.2
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• pp.75-79
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• 2005

With three kinds of agricultural products such as perilla leaves, this research is focussed on how to keep a freshness of agricultural products during long time transport by sea. In case of export fresh agricultural products by sea, research on products loading method onto the pallet is very important factor for keeping effective cold air circulation inside the freezing marine container. Details are as follows: Clear examination of palletization for cold air ventilation inside the container. Optimization of package dimension for best loading efficiency onto the standard pallet. Best layout of palletized products inside the container. Research for the change of circumstance and product quality inside the pack.

• Journal of Korea Technical Association of The Pulp and Paper Industry
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• v.39 no.2 s.120
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• pp.45-53
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• 2007

When micro flute corrugated paperboards are used for food packaging, they necessarily need to meet the requirements for the distribution, transportation, and storage of food. The requirements could vary ac-cording to the contents in the packaging boxes. Microflute corrugated packaging paperboard for hot foods such as just-made coffee and hamburger requires to have a decent resistance property against high temperature. Along with a recent trend for small-quantity-multi-item upgraded packaging, semiconductor products and consumer-electronic appliances become to be packed using the environmental friendly micro flute corrugated paperboard. In this case, the electric resistance property of the microflute corrugated paperboard becomes important. This study was carried out to investigate on the thermal conductivity and electric resistance properties of micro flute corrugated paperboard.

• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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• v.8 no.1
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• pp.23-26
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• 2002

This study was carried out to investigate vibration shock and dropping shock of refrigerator during physical distribution. The values of vibration shock were measured to be ${\sim}3G$ for up and down direction, ${\sim}0.8G$ for right and left direction and ${\sim}0.5G$ for back and forth direction on the national road. There was no damage during transport. From the results of dropping test by KS A 1026(General Rules of Performance Testing for Packaged Freights), relative equations were gained as follow : y = 0.12x + 7.63(where y is G-factor and x is Dropping height). The maximum values of dropping shock during materials handling were measured to be 11G. This shock value was corresponding to dropping shocks of dropping height 28.3cm by KS A 1026.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2003.09a
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• pp.93-100
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• 2003

The continuing scaling trend in microelectronic circuit technology has a significant impact on the different IC interconnection and packaging technologies. These latter technologies have not kept pace with the IC scaling trends, resulting in a so-called“interconnect technology gap”. Multilayer thin film technology is proposed as a“bridge”- technology between the very high density IC technology and the coarse standard PCB technology. It is also a key enabling technology for the realisation of true“System-in-a-Package”(SIP) solutions, combining multiple“System-on-a-Chip”(SOC) IC's with other components and also integrating passive components in its layers. A further step is to use this technology to realise new functionalities on top of active wafers. These additional“above-IC”processed layers may e.g. be used for low loss, high speed on chip interconnects, clock distribution circuits, efficient power/ground distribution and to realize high Q inductors on chip.