• Journal of the Korea Academia-Industrial cooperation Society
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• v.19 no.4
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• pp.111-116
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• 2018

This research examines the drop impact of an external cooling unit package of an air conditioner system. The packaging is composed of a shock-absorbing material, which protects the package contents by absorbing the impact energy and other parts for fixture. Accurate quantification of the impact acceleration experienced by the package contents is necessary to design an effective packaging with minimal volume and sufficient shock absorbing capacity. Explicit time integration was used for the drop impact analyses. A finite element model of the package was constructed, material testing and material model selection were carried out, and sensors for data acquisition were modeled to obtain accurate simulation results. The results were compared with real physical test data. Due to imprecise modeling of the damping, the acceleration and strain values predicted by the simulation were larger than those from physical test. However, the trend of the history data and the peak deceleration value in the direction of impact showed good agreements. Thus, the analysis model and scheme are suitable for the design of an air conditioner cooling unit package.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.23 no.11
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• pp.1228-1238
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• 2012

In this paper, we design, fabricate and measure two kinds of high-frequency packages for K-band CMOS FMCW radar chips using RF via structures. The packages are fabricated with the conventional PCB process and LTCC process. The design centering of the packages is performed at 24 GHz and impedance variation caused by the wire bonding and RF via structure is fully evaluated using 3D electromagnetic simulation. The RF via structure with characteristic impedance of $50{\Omega}$ is used to reduce impedance mismatch loss. Two kinds of test packages with back-to-back connected RF paths are fabricated and measured for the design verification of the PCB-based package and LTCC package. Their measured results show an insertion loss of less than 0.4 dB at 24 GHz and less than 0.5 dB for 20~29 GHz. The measured return loss is less than -13 dB for the PCB-based package and less than -15 dB for the LTCC package in the frequency band, but the return loss of the package itself is predicted to be better than that of the test package by about 5 dB, because the ripples of the back-to-back connection typically degrade the return loss by 5 dB or more.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.32 no.9
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• pp.712-719
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• 2008

Light Oil Flow Standard System(LOFSS), as a national oil flow standard system, in Korea Research Institute of Standards and Science(KRISS) was developed for oil flowmeter calibration, and the expanded uncertainty of flow quantity determination was estimated within 0.04 %. In order to improve the reliability of the LOFSS measurement, a proficiency test was carried out in the flow range of 20 and $240\;m^3/h$ (Reynolds number $20,000{\sim}900,000$). A turbine flowmeter was used as a transfer package in round robin test. The water flow standard system of KRISS, the pipe prover of the national calibration and test organization and the master meter calibrator of the turbine flowmeter supplier, which used the different working fluid respectively, were compared with the turbine flowmeter measurement. The maximum difference of measurement was 0.15 % between the LOFSS and the pipe prover. The En numbers of the each system measurement were evaluated at the same Reynolds number. It was found that the En numbers were less than 1 in the comparison, which means the procedures of the uncertainty estimation of the each calibrators were reasonable and reliable.

• Journal of Integrative Natural Science
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• v.15 no.1
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• pp.9-18
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• 2022

This research examines the power of bootstrap two-sample test, and compares it with the powers of two-sample t-test and Wilcoxon rank sum test, through simulation. For simulation work, a positively skewed and heavy tailed distribution was selected as a population distribution, the chi-square distributions with three degrees of freedom, χ²₃. For two independent samples, the fist sample was selected from χ²₃. The second sample was selected independently from the same χ²₃ as the first sample, and calculated d+ax for each sampled value x, a randomly selected value from χ²₃. The d in d+ax has from 0 to 5 by 0.5 interval, and the a has from 1.0 to 1.5 by 0.1 interval. The powers of three methods were evaluated for the sample sizes 10,20,30,40,50. The null hypothesis was the two population medians being equal for Bootstrap two-sample test and Wilcoxon rank sum test, and the two population means being equal for the two-sample t-test. The powers were obtained using r program language; wilcox.test() in r base package for Wilcoxon rank sum test, t.test() in r base package for the two-sample t-test, boot.two.bca() in r wBoot pacakge for the bootstrap two-sample test. Simulation results show that the power of Wilcoxon rank sum test is the best for all 330 (n,a,d) combinations and the power of two-sample t-test comes next, and the power of bootstrap two-sample comes last. As the results, it can be recommended to use the classic inference methods if there are widely accepted and used methods, in terms of time, costs, sometimes power.

• Fire Protection Technology
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• s.14
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• pp.5-12
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• 1993

This report is explained about test results of carbon dioxide extinguiching system components and pack-age type system (Kits) for automatic fire extinguishing system. A carbon dioxide system may be used to protect one or more hazards or hazards by menas of directional valves. Package system shall be installed to protect hazards within the limitations. The testing program was progressed by three items, external oppearance test, performance test and Total Flooding Fire Extinguishing System test. The object of this report is present the problem which apperar from the analysis of test results.

• The Journal of Korean Association of Computer Education
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• v.6 no.3
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• pp.75-85
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• 2003

This study develops the System(MetaGene) to create meta-data for learning object based on SCORM including meta-data of Assets. SCO, Contents Aggregation and metadata of Contents Package. API function cocle is embeded in Learning Object for interfacing API adopter in LMS to support SCORM and for tracking on learning process based on data models. Also, the learning objects are packaged the PIF(Packaged Interchange File) to transmit with LMS. MetaGene is verified by $SCORM^{(TM)}$ Conformance TestSuite for meta-data of learning objects, manifest file of Contents Packaging.

• Communications for Statistical Applications and Methods
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• v.22 no.6
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• pp.665-674
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• 2015

Lack of a general matrix formula hampers implementation of the semi-partial correlation, also known as part correlation, to the higher-order coefficient. This is because the higher-order semi-partial correlation calculation using a recursive formula requires an enormous number of recursive calculations to obtain the correlation coefficients. To resolve this difficulty, we derive a general matrix formula of the semi-partial correlation for fast computation. The semi-partial correlations are then implemented on an R package ppcor along with the partial correlation. Owing to the general matrix formulas, users can readily calculate the coefficients of both partial and semi-partial correlations without computational burden. The package ppcor further provides users with the level of the statistical significance with its test statistic.

• Journal of the Korean Society for Precision Engineering
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• v.26 no.3
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• pp.113-121
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• 2009

Behavior of a package of a microwave oven under the clamping condition is evaluated by tests and the finite element analyses. PAM-CRASH software is used for the finite element analyses. Results of the analyses are compared with those of the tests and accuracy is shown to be favorable. Under the clamping condition of the original design, severe deformation occurs and an improved design of the outer case and upper EPS(Expandable Poly Styrene) is proposed to reduce it. Face beads of the outer case are introduced and shape of the upper EPS is modified to reduce the deformation resulting from the clamping load. The improved design model is analyzed and its deformation is shown to be satisfactory. A prototype is produced according to the improved design and tests are performed. Results of the clamping test of the prototype show that the plastic deformation is removed totally.

• Journal of Welding and Joining
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• v.18 no.2
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• pp.222-222
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• 2000

PBGA(Plastic Ball Grid Array) is composed of some materials such as PCB(Printed Circuit Board), epoxy molding compound, die attach and so on. Reliability of PBGA package is weak compared with plastic packages. The weak points of reliability are the lower resistance to popcorn cracking, which is induced by moisture absorption in PCB, and the pressure cooker test corrosion, which is the basic problem due to the material characteristics of PCB. Introducing the PCB baking and the plasma treatment cleared the popcorn cracking phenomenon. The PCB baking and plasma treatment reduced the epoxy void by eliminating the source of moisture vaporization during the epoxy curing and enhanced the adhesion between PCB and epoxy. Also, plasma treatment enhanced the wettability of epoxy on PCB. The problem of corrosion is cleared using multi-functional epoxy. This type of EMC(Epoxy Molding Compound) is recommended in package using PCB as a substrate. (Received November 19, 1999)

• Journal of Welding and Joining
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• v.18 no.2
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• pp.95-99
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• 2000

PBGA(Plastic Ball Grid Array) is composed of some materials such as PCB(Printed Circuit Board), epoxy molding compound, die attach and so on. Reliability of PBGA package is weak compared with plastic packages. The weak points of reliability are the lower resistance to popcorn cracking, which is induced by moisture absorption in PCB, and the pressure cooker test corrosion, which is the basic problem due to the material characteristics of PCB. Introducing the PCB banking and the plasma treatment cleared the popcorn cracking phenomenon. The PCB banking and plasma treatment reduced the epoxy void by eliminating the source of moisture vaporization during the epoxy curing and enhanced the adhesion between PCB and epoxy. Also, plasma treatment enhanced the wettability of epoxy on PCB. The problem of corrosion is cleared using multi-functional epoxy. This type of EMC(Epoxy Molding Compound) is recommended in package using PCB as a substrate.