• Korean Journal of Oriental Medicine
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• v.13 no.2 s.20
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• pp.121-125
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• 2007

Background and Purpose : The purpose of this study was done to investigate what kinds of statistical techniques have been used to analyze data from oriental medicine research Methods : 135 original articles which used statistical techniques in their data analysis were selected from the articles published in The Journal of Korea Institute of Oriental Medicine(JKIOM) between 1995 to 2007. Results : Among 135 articles, 59 articles used descriptive statistics while 76 articles used inferential statistics for data analysis. For that 76 articles, two-sample t-test(33 articles), analysis of variance(29 articles), regression(9 articles), chi-square test(5 articles), nonparametic test(4 articles), Fisher's exact test(3 articles), and other test(9 articles) were chosen to analyze the data. SAS and SPSS statistical softwares(82.50%) were mostly used to analyze the data. Nonparametic tests were used to 4 articles(6.97%) of 67 articles and parametic tests were used to 63 articles(93.03%) of 67 articles. Among 29 articles used analysis of variance, duncan(8 articles), dunnet(4 articles), bonferroni(4 articles), turkey(3 articles), scheff(1 article) were used to do multiple comparison. 9 articles did not carry out the multiple comparison. Conclusions : It was found that the frequencies of statistical package used and statistical analysis used were not much by now. High level statistical analyses were not used most for oriental medicine research.

• Journal of IKEEE
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• v.25 no.3
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• pp.578-583
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• 2021

This paper describes acceleration tests for reliability of semiconductors. It also describes AEC-Q100, international test standard for reliability of automotive semiconductors. Semiconductors can be used for dozens of years. So acceleration tests are essential to test potential problems over whole period of product where test time is minimized by applying intensive stresses. AEC-Q100 is a typical acceleration test in automotive semiconductors, and it is designed to find various failures in semiconductors and to analyze their causes of occurance. So it finds many problems in design and fabrication as well as it predicts lifetime and reliability of semiconductors. AEC-Q100 consists of 7 test groups such as accelerated environmental stress tests, accelerated lifetime simulation tests, package assembly integrity tests, die fabrication reliability tests, electrical verification tests, defect screening tests, and cavity package integrity tests. It has 4 grades from grade 0 to grade 3 based on operational temperature. AEC-Q101, Q102, Q103, Q104, and Q200 are applied to discrete semiconductors, optoelectronic semiconductors, sensors, multichip modules, and passive components, respectively.

• Journal of the Microelectronics and Packaging Society
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• v.27 no.1
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• pp.55-65
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• 2020

The use of underfill materials in semiconductor packages is not only important for stress relieving of the package, but also for improving the reliability of the package during shock and vibration. However, in recent years, as the size of the package becomes larger and very thin, the use of the underfill shows adverse effects and rather deteriorates the reliability of the package. To resolve these issues, we developed the package using a solid epoxy material to improve the reliability of the package as a substitute for underfill material. The developed solid epoxy was applied to the package of the application processor in smart phone, and the reliability of the package was evaluated using thermal cycling reliability tests and numerical analysis. In order to find the optimal solid epoxy material and process conditions for improving the reliability, the effects of various factors on the reliability, such as the application number of solid epoxy, type of PCB pad, and different solid epoxy materials, were investigated. The reliability test results indicated that the package with solid epoxy exhibited higher reliability than that without solid epoxy. The application of solid epoxy at six locations showed higher reliability than that of solid epoxy at four locations indicating that the solid epoxy plays a role in relieving stress of the package, thereby improving the reliability of the package. For the different types of PCB pad, NSMD (non-solder mask defined) pad showed higher reliability than the SMD (solder mask defined) pad. This is because the application of the NSMD pad is more advantageous in terms of thermomechanical stress reliability because the solderpad bond area is larger. In addition, for the different solid epoxy materials with different thermal expansion coefficients, the reliability was more improved when solid epoxy having lower thermal expansion coefficient was used.

• Journal of Korean Academy of Fundamentals of Nursing
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• v.14 no.3
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• pp.351-360
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• 2007

Purpose: The purpose of this study was to develop a Problem-Based Learning (PBL) package, test its application and evaluate students' recognition of the effectiveness of PBL in nursing colleges. Method: Thirteen steps were used in the process developing the PBL package. After its application, the first questionnaire for self-evaluation and satisfaction with PBL class was given to 94 nursing students in December, 2005. To further evaluate the students' recognition of the effectiveness of PBL, a second questionnaire was given to 83 nursing students out of the 96 in May, 2007 after clinical practice. Data analysis was conducted using means with standard deviation. Results: The results of students' self-evaluation showed high achievement in learning outcome and process using the PBL method. Also, they expressed satisfaction with the subject management, the lecturer and their peers after the PBL class. Students recognized that the PBL class had positive effectiveness in clinical practice and wanted more PBL classes and the inclusion of complex cases from well designed packages. Conclusion: PBL class could be considered as an opportunity to fortify student nurses' abilities to adjust to the real clinical situation.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.13 no.12
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• pp.5716-5720
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• 2012

To expand the use of three dimensional(3D) product modelling in the army, we have analyzed military technical data management system, as well as the military guidelines for the unique format and content of technical data package. Because traditional munition sector is based on the machinery and equipment industry, they have usually applied two dimensional(2D) drawings to prepare a design and to make a product. For that reason, there is no provision for 3D product modelling as a technical data package in the military guideline. In this study, we proposed an improvement scheme for the vitalization of 3D product modelling in the army not only in terms of related guideline but also military technical data management system.

• Journal of Pharmaceutical Investigation
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• v.8 no.4
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• pp.23-36
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• 1978

Since the active center of digestive enzymetic preparations, while under storage, lose their activity and potency by the exposure to moisture, colorization, solidifying and other physical changes. It is more important than beautiful package form that protected packaging form from moisture to get a pharmaceutical safety preparations and to maintain a definite potency. Then, in order to get a desirable conditions of storage and packaging, we used shellac and $AEA^{\circledR}$ as a coating base, and blister package, foil and bottle container as a packaging material. Temperature were set on room temperature and $37^{\circ}C$, moisture was adjusted to 40% RH and 80 % RH as a accelerated conditions. Accelerated test was carried out 6 times. The results are as follows: 1) The effect of packaging conditions give great influence on the maintenace of the stable potency. 2) Best result was produced with bottle container package. 3) $AEA^{\circledR}$ is more useful than shellac as a coating base of prevention from moisture. 4) Absorption of moisture gave considerable effects on potency and it has a limited point. 5) Difference in potency between optimal and worst condition is 472 u/2T, and difference in effective period is about 44 months.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2002.07a
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• pp.32-35
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• 2002

The work focuses on the development of a Cu lead-frame with a single-sided adhesive tape for cost reduction and reliability improvement of LOC (lead on chip) package products, which are widely used for the plastic-encapsulation of memory chips. Most of memory chips are assembled by the LOC packaging process where the top surface of the chip is directly attached to the area of the lead-frame with a double-sided adhesive tape. However, since the lower adhesive layer of the double-sided adhesive tape reveals the disparity in the coefficient of thermal expansion from the silicon chip by more than 20 times, it often causes thermal displacement-induced damage of the IC pattern on the active chip surface during the reliability test. So, in order to solve these problems, in the resent work, the double-sided adhesive tape is replaced by a single-sided adhesive tape. The single-sided adhesive tape does net include the lower adhesive layer but instead, uses adhesive materials, which are filled in clear holes of the base film, just for the attachment of the lead-frame to the top surface of the memory chip. Since thermal expansion of the adhesive materials can be accommodated by the base film, memory product packaged using the lead-flame with the single-sided adhesive tape is shown to have much improved reliability. Author allied this invention to the Korea Patent Office for a patent (4-2000-00097-9).

• The Transactions of The Korean Institute of Electrical Engineers
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• v.56 no.12
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• pp.2217-2220
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• 2007

In this paper, we propose a new wafer level package (WLP) for the RF MEMS applications. The Film Bulk Acoustic Resonator (FBAR) are fabricated and hermetically packaged in a new wafer level packaging process. With the use of Au-Sn eutectic bonding method, we bonded glass cap and FBAR device wafer which has groove-shaped via formed in the backside. The device wafer includes a electrical bonding pad and groove-shaped via for connecting to the external bonding pad on the device wafer backside and a peripheral pad placed around the perimeter of the device for bonding the glass wafer and device wafer. The glass cap prevents the device from being exposed and ensures excellent mechanical and environmental protection. The frequency characteristics show that the change of bandwidth and frequency shift before and after bonding is less than 0.5 MHz. Two packaged devices, Tx and Rx filters, are attached to a printed circuit board, wire bonded, and encapsulated in plastic to form the duplexer. We have designed and built a low-cost, high performance, duplexer based on the FBARs and presented the results of performance and reliability test.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.11 no.5
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• pp.353-357
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• 1998

Cracking problem of Epoxy Molding Compound(EMC) is critical for the reliability of the plastic package during temperature cycling and IR-reflow condition. Fracture toughness of EMC, which is defined as the resistance of EMC to the crack propagation, is a useful factor in ht estimation of EMC against package crack. Thus, development of EMC having high fracture toughness at a given loading condition would be important for confirming the integrity of package. In this study, toughness of several EMC was measured by varying the test conditions such as temperature, loading speeds, and weight percent of filler in order to quantify the variation of toughness of EMC under various applicable conditions. It was found from the experiments that toughness of all EMC has following trends, i.e., it rapidly decreases over the glass transition temperature, remains almost same or little decreases below $0^{\circ}C$. It decreases with the growth of cross head speed in EMC and the weight percent of filler as the degree of brittleness of EMC increases with the amount of filler content.

• Nuclear Engineering and Technology
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• v.53 no.7
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• pp.2151-2161
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• 2021

Nuclear data (ND) sensitivity and uncertainty (S/U) quantification in shielding applications is performed using deterministic and probabilistic approaches. In this paper the validation of the newly developed deterministic program package ASUSD (ADVANTG + SUSD3D) is presented. ASUSD was developed with the aim of automating the process of ND S/U while retaining the computational efficiency of the deterministic approach to ND S/U analysis. The paper includes a detailed description of each of the programs contained within ASUSD, the computational workflow and validation results. ASUSD was validated on two shielding benchmark experiments from the Shielding Integral Benchmark Archive and Database (SINBAD) - the fission relevant ASPIS Iron 88 experiment and the fusion relevant Frascati Neutron Generator (FNG) Helium Cooled Pebble Bed (HCPB) Test Blanket Module (TBM) mock-up experiment. The validation process was performed in two stages. Firstly, the Denovo discrete ordinates transport solver was validated as a standalone solver. Secondly, the ASUSD program package as a whole was validated as a ND S/U analysis tool. Both stages of the validation process yielded excellent results, with a maximum difference of 17% in final uncertainties due to ND between ASUSD and the stochastic ND S/U approach. Based on these results, ASUSD has proven to be a user friendly and computationally efficient tool for deterministic ND S/U analysis of shielding geometries.