• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2001.11b
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• pp.205-208
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• 2001

Steady state and transient thermal analysis has been done by a finite element method in a diode of 12kV blocking voltage for microwave oven. The diode was fabricated by soldering ten pieces of 1200V diodes in series, capping a dummy wafer at the far end of diode series, and finally copper wire bonded for building anode and cathode terminal. In order to achieve high voltage and reliability, the edge of each diode was beveled and passivated by resin and epoxy with a thickness of $25{\mu}m$ and $3700{\mu}m$, respectively. The chip size, thickness and material properties were very important factor for high voltage diode package. And also, thermal stress value was highest in the edge of diode and solder. So, design of edge in silicon was very important to thermal stress.

• Journal of Welding and Joining
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• v.16 no.4
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• pp.92-97
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• 1998

Because of the low melting temperature of solder, each temperature cycle initiates an irrecoverable creep deformation at the solder interconnection which connects the package body with the PCB. The crack starts and propagates from the position where the creep deformation is maximized. This work has tried to compare and analyze the thermal fatigue life of solder interconnection which is affected by the lead material, the size of die pad, chip thickness, and interface delamination of 48-Pin TSOP under the temperature cycle ($0^{\circ}C$~1$25^{\circ}C$). The crack initiation position and thermal fatigue life which are calculated by using FEA method are well matched with the results of experiments. The thermal Fatigue life of copper lead frame is extended around 3.6 times longer than that of alloy 42 lead frame. It is maximized when the chip size is matched with the length of the lead. It tends to be extended as the thickness of chip got thinner. As the interfacial delamination between die pad and EMC is increased, the thermal fatigue life tends to decrease in the beginning of delamination, and increase after the delamination grew after 45% of the length of die pad.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2001.11a
• /
• pp.205-208
• /
• 2001

Steady state and transient thermal analysis has been done by a finite element method in a diode of 12kV blocking voltage for microwave oven. The diode was fabricated by soldering ten pieces of 1200V diodes in series, capping a dummy wafer at the far end of diode series, and finally copper wire bonded for building anode and cathode terminal. In order to achieve high voltage and reliability, the edge of each diode was beveled and passivated by resin and epoxy with a thickness of 25$\mu\textrm{m}$ and 3,700$\mu\textrm{m}$, respectively. The chip size, thickness and material properties were very important factor for high voltage diode package. And also, thermal stress value was highest in the edge of diode and solder. So, design of edge in silicon was very important to thermal stress.

• Culinary science and hospitality research
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• v.3
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• pp.83-122
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• 1997

The purpose of this study is to inquire management satisfaction factors of cook, and to grope for the correlation of career, number of cook, income, and education. To attain the purpose of this study, questionnaire was developed through pilot test. Questionnaire scale was adopted 5 point. The SPSS package was utilized for the analyses of questionnaire. The method was Frequency analysis and Chi Square analysis. The results obtained from the above data-based analysis are concentrated on management satisfaction to cook, and management recruiting method.

• Journal of KSNVE
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• v.4 no.3
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• pp.327-335
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• 1994

In this paper, to identify the dynamic characteristics of antenna system, the antenna is divided into 4 components and those were analyzed with a conventional FEM package MSC/NASTRAN. Using a Component Mode Synthesis Method, dynamic characteristics of total system is also identified. The Coherence of each component to total system is evaluated by using strain and kinetic component to total system is evaluated by using strain and kinetic energy. The improving strategy of dynamic characteristics is suggested by changing mass and stiffness of large coherence components.

• Journal of the Korean Magnetic Resonance Society
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• v.10 no.1
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• pp.1-37
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• 2006

General expressions for solid state NMR lines are described for transitions under static, magic angle spinning, and variable angle spinning conditions in the case where the principal axis system for the anisotropic chemical shift tensor is noncoincident with that of the quadrupole coupling tensor. It is demonstrated that solid state NMR powder pattern simulation program VMAS based on the conventional grid point method of integrating over the Euler angle space is fast enough in comparison with the POWDER simulation package and Gauss-point method.

• Journal of the korean Society of Automotive Engineers
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• v.14 no.5
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• pp.107-116
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• 1992

Recently, it is gradually raised necessity that interface is measured accurately and managed in industrial circle and medical world. An Ultrasonic wave transmitted from a focused beam tranducer is being expected as a powerful tool for NDE of the delamination. The Ultrasonic NDE of the delamination is based on the form of the wave reflected from the interface. In this study results, automatically repeated discrimination analysis method can be devided in the category of all kinds of defects on semiconductor package, and also can be possible to have a sampling of partial delamination.

• Journal of applied mathematics & informatics
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• v.5 no.2
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• pp.293-300
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• 1998

The numerical method is used to solve the Fredholm integral equation of the second kind with weak singular kernels using the Toeplitz matrices. The solution has a computing time requir-ment of O(N2) where 2N+1 is the number of discretization points used. Also the error estimate is computed. Some numerical Exam-ples are computed using the Mathcad package.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.20 no.11
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• pp.3538-3548
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• 1996

In this study, as a part of basic study for developing the simulation program for the assemssment of reliability of electronic EMC packaging which covers from EMC mixing step to thermal analysis, comparison between a measured and predicted values of material properties of EMC and finitde element analysis of thermal stress are performed. For the experimental testing specimens of fifty, sixty hive and eighty percent filler($13\mu m$, spherical silica) weight fraction are fabricated using tranfer molding. Coefficient of thermal expansion, elastic modulus and thermla conductivity are measured using these specimens and then these measured values are compared with the predicted values by various equations ( such as dilute suspension method. self consistent method, generalized self consistent method, Hashin-Shtrikman's bounds. Shapery's bounds, Nielsen's method and others). Measured values are distributed within the upper and lower bounds of equations. Measured elastic modulus and coefficient of thermal expansion approaches closely the perdicted values with self consisten mehtod and upper bound of Shaperys equation respectively. However small differences of thermal conductivity between the different filler volume fraction are obserbed. FEM analysis indicates that firstly stress is concentrated at the corner section of EMC and secondly EMC with eighty percent filler weight fraction shows less thermal stress when package is cooling down and relatively high thermal stress when package is heating up.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2021.05a
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• pp.463-465
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• 2021

Currently, the inspection method printed on food packages and boxes is to sample only a few products and inspect them with human eyes. Such a sampling inspection has the limitation that only a small number of products can be inspected. Therefore, accurate inspection using a camera is required. This paper proposes a deep learning object recognition technology model, which is an artificial intelligence technology, as a method for detecting the defects of expiration date printed on the product packaging. Using the Faster R-CNN (region convolution neural network) model, the color images, converted gray images, and converted binary images of the printed expiration date are trained and then tested, and each detection rates are compared. The detection performance of expiration date printed on the package by the proposed method showed the same detection performance as that of conventional vision-based inspection system.