• 제목/요약/키워드: package method

검색결과 1,412건 처리시간 0.018초

A visualizing method for investigating individual frailties using frailtyHL R-package

  • Ha, Il Do;Noh, Maengseok
    • Journal of the Korean Data and Information Science Society
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    • 제24권4호
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    • pp.931-940
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    • 2013
  • For analysis of clustered survival data, the inferences of parameters in semi-parametric frailty models have been widely studied. It is also important to investigate the potential heterogeneity in event times among clusters (e.g. centers, patients). For purpose of this analysis, the interval estimation of frailty is useful. In this paper we propose a visualizing method to present confidence intervals of individual frailties across clusters using the frailtyHL R-package, which is implemented from h-likelihood methods for frailty models. The proposed method is demonstrated using two practical examples.

경계요소법을 이용한 반도체 패키지의 응력특이성 해석 (Analyses of Stress Singularities on Bonded Interfaces in the IC Package by Using Boundary Element method)

  • 박철희;정남용
    • 한국공작기계학회논문집
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    • 제16권6호
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    • pp.94-102
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    • 2007
  • Applications of bonded dissimilar materials such as large scale integration (LSI) packages, ceramics/metal and resin/metal bonded joints, are very increasing in various industry fields. It is very important to analyze the thermal stress and stress singularity at interface edge in LSI. In order to investigate stress singularities on the bonded interface edges and delamination of die pad and resin in the IC package. In this paper, stress singularity factors(${\Gamma}_i$) and stress intensity factors($K_i$) considering thermal stress in the IC package were analyzed by using the 2-dimensional elastic boundary element method(BEM).

품질기능전개 기법을 이용한 패키지 소프트웨어의 품질 평가 (Quality Evaluation of Package Software using QFD)

  • 유영관;이종무
    • 대한안전경영과학회:학술대회논문집
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    • 대한안전경영과학회 2001년도 춘계학술대회
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    • pp.167-171
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    • 2001
  • In this paper, the QFD(quality function deployment) technique is used to acquire the quality requirements of package software which is sold in a commercial software shop. To select the principal quality characteristics of package software, an user survey was conducted for a quality model developed based on the international standards and the previous research. The software user is divided into three groups:the general user, the expert, and the developer. The method of QFD is applied to choose the software quality attributes which have strong correlation with the selected quality characteristics.

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Development of the SAR Data Processing Package

  • Kim Kwang-Yong;Jeong Soo;Kim Kyoung-Ok
    • 대한원격탐사학회:학술대회논문집
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    • 대한원격탐사학회 2004년도 Proceedings of ISRS 2004
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    • pp.526-528
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    • 2004
  • This paper describes the SAR data processing S/W package it will be able to process the SAR image. This package constructs the several modules: SAR Image processing module, measuring module of surface displacement using differential interferometric SAR method, classification module using the POLSAR data, SAR Focusing module. In this paper, briefly describe the algorithm that is adopted to the functions, and module architecture.

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밀리미터파 대역 세라믹 패키지 설계에 관한 연구

  • 서재옥;김진양;박성대;이우성;강남기;이해영
    • 한국마이크로전자및패키징학회:학술대회논문집
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    • 한국마이크로전자및패키징학회 2002년도 춘계 기술심포지움 논문집
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    • pp.259-263
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    • 2002
  • We design and characterize a millimeter-wave ceramic package in a frequency range from DC to 300Hz using the FEM(Finite Element Method) calculation. From these calculation results, the designed feed-through structure achieved 0.32 dB, 16.8 dB of the insertion loss and the return loss at 30 GHz respectively. This ceramic package will be useful for MMIC(Monolithic Microwave Integrated Circuit) modules.

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30 GHz 세라믹 패키지의 제작 및 측정

  • 서재옥;김진양;박성대;이우성;강남기;이해영
    • 한국마이크로전자및패키징학회:학술대회논문집
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    • 한국마이크로전자및패키징학회 2002년도 추계기술심포지움논문집
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    • pp.147-151
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    • 2002
  • We fabricated and characterized a millimeter-wave ceramic package in a frequency range from 6 to 40㎓ using the LTCC(Low Temperature Cofired Ceramic) Technology and TRL(Thru-Reflect-Line) calibration method. From these measurement results, the fabricated feed-through structure achieved 0.5 dB, 14 dB of the insertion loss and the return loss at 30 GHz respectively. This ceramic package will be useful for MMIC(Monolithic Microwave Integrated Circuit) modules.

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한지를 이용한 전통식품 포장재 디자인에 관한 연구(제1보) - 한과류 포장재 디자인 - (A Study on the Design of Traditional Food Package Under the Use of Hanji(I) - Design of Korean dried confectionary package -)

  • 이유라;김혜원;임현아
    • 펄프종이기술
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    • 제39권2호
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    • pp.68-77
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    • 2007
  • It is necessary to recognize philosophical and scientific depth, contained in traditional culture in a correct fashion, in order to succeed and develop our excellent traditional culture. Some studies on storage, circulation, and package design of traditional food will multiple the added value of traditional culture. So this research was carried out for making packing cases of kinds of Korean dried confectionery using Hanji by traditional manufacturing method, Hanji textile, charcoal Hanji and jade Hanji, and for developing environmental-friendly Korean dried confectionery package as more luxurious packaging papers by putting an exterior design on the surface. The results measured physical properties, air permeability and anti-mold activity of Hanji, and designing Korean dried confectionery are as follows. The physical properties and air permeability used to manufacture Korean dried confectionery package, turned out to be no affection to the food packaging Hanji. In order to avoid the monotonousness of Korean dried confectionery package, it was designed with Hanji textile together with elegant traditional pattern. It is estimated to increase the value of Korean dried food and to make the anti-mold activity of Hanji added charcoal and jade effective. In conclusion, by developing individual properties of traditional food and proper packaging paper as well as packaging design according to circulating situation, it is considered that the taste and the fancy can be maximized. After all, by applying excellent traits contained in our race's culture, it is possible to develop the package cases into competitive ones. And it would be able to increase utilization of Hanji. Namely, production of high quality traditional food package with Hanji is expected for new valuable industry of Hanji.

대용량 파일 전송 소프트웨어의 동일성 감정 방법 (Appraisal Method for Similarity of Large File Transfer Software)

  • 전병태
    • 한국소프트웨어감정평가학회 논문지
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    • 제17권1호
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    • pp.11-16
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    • 2021
  • 정보통신의 발달로 인하여 소프트웨어의 중요성이 증대되고 있으며, 이에 따른 소프트웨어 저작권 분쟁도 증가하는 추세에 있다. 본 논문은 제출된 프로그램들의 소스와 관련하여 프로그램 수행에 필요한 파일들을 감정범위로 하였다. 분석 대상인 대용량 파일 전송 솔루션 프로그램은 데이터에 대한 전자서명 및 암호화를 통하여 기밀성, 무결성, 사용자 인증, 부인방지 기능 등의 부가 기능을 제공하고 있다. 본 논문에서는 프로그램 A, 프로그램 B, 프로그램 C 3개에 대하여 분석을 수행한다. 프로그램 유사율을 산출하기 위하여 다음과 같은 내용을 분석한다. 패키지의 구조, 패키지 이름, 각 패키지 내 소스파일 이름, 소스파일 내 변수명, 함수명, 함수구현 소스코드, 제품의 환경변수 정보에 대하여 유사 여부를 분석하고 프로그램의 전체 유사율을 산출한다. 패키지 구조 및 패키지 이름이 일치되는 정도를 확인하기 위해, 폴더 구조를 비교하여 유사도 판단을 하였다. 또한 패키지 구조 및 패키지 이름이 어느 정도 일치하는지와 각 패키지 내 소스 파일(클래스) 이름이 어느 정도 일치하는지에 대한 분석을 하였다.

반도체패키지에서의 층간박리 및 패키지균열에 대한 파괴역학적 연구 (2) - 패키지균열- (A Fracture Mechanics Approach on Delamination and Package Crack in Electronic Packaging(ll) - Package Crack -)

  • 박상선;반용운;엄윤용
    • 대한기계학회논문집
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    • 제18권8호
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    • pp.2158-2166
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    • 1994
  • In order to understand the package crack emanating from the edge of leadframe after the delamination between leadframe and epoxy molding compound in an electronic packaging of surface mounting type, the M-integral and J-integral in fracture mechanics are obtained. The effects of geometry, material properties and molding process temperature on the package crack are investigated taking into account the temperature dependence of the material properties, which simulates a more realistic condition. If the temperature dependence of the material properties is considered the result of analysis conforms with observations that the crack is kinked at between 50 and 65 degree. However, in case of constant material properties at the room temperature it is found that the J-integral is underestimated and the kink crack angle is different form the observation. The effects of the material properties and molding process temperature on J-integral and crack angle are less significant that the chip size for the cases considered here. It is suggested that the geometric factors such as ship size, leadframe size are to be well designed in order to prevent(or control) the occurrence and propagation of the package crack.

마케팅 환경변화에 따른 패키지디자인 개발 프로세스에 관한 연구 (A Study On The Development Process Of The Package design Under The Changable Marketing Enveronments)

  • 김정욱
    • 디자인학연구
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    • 제11권2호
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    • pp.179-188
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    • 1998
  • 현재 사회는 커뮤니케이션(communication)의 과잉의 시대로 보여진다. 다양화된 상품과 정보통신의 발달로 언어적 특성의 사회는 시각적 환경으로 변화되었다. 이런 변화의 시대 속에 패키지가 소비자와 올바른 커뮤니케이션을 하기 위해서는 마케팅계획과 마케팅전략의 분석을 통해 소비자가 원하는 요구(needs)를 파악하고 형상화시켜 전달해야 된다고 보여진다. 이러한 올바른 커뮤니케이션 방법을 제시하기 위하여 본고에서는 마케팅 개념과 환경의 변화를 살펴보았으며, 마케팅 활동과 패키지 활동의 유기적 관계에 대해서 연구하여 패키지 프로세스로의 도입을 시도하였다. 본고의 목적은 현재 소비자 기호 변화에 따른 마케팅 환경 변화에 대응하는 커뮤니케이션 도구로서의 패키지 디자인을 개발함에 있어 마케팅 전략을 도입하여 이론적 프로세스를 개발하고, 또 시각화시키는데 있다.

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