• Journal of Engineering Education Research
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• v.5 no.2
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• pp.22-35
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• 2002

The main purpose of this study is to prepare an outline for developing the Contents Systems that achieve self-study systems to make the students adopt themselves into new study atmosphere and maximize the result of study on technical college in Electric-Electronic field. Questionnaire posed to analyze the demand of teaching materials to the students, and professors and also to find characteristics of students in technical college. The SPSSWIN/PC+ statistics Package was used to assay the collected answers. And simple frequency with percentage, average, and standard deviation were calculated to check the entire trend and actual state of each question. The primary outcomes of this study are as follows i) The students in the technical college prefer self-directed learning to lecturer-oriented teaching. ii) It is difficult to offer the technical college students normal education systems since the students?interest and motivation towards study are very low. iii) The lack of capability of foreign language and basic mathematics are considered as obstacles for many students technical college to study. iv) The professors in technical college still depend on traditional method to teach the students without organized research of the intellectual levels and attitude the students. v) Teaching materials in currently use are not appropriated to induce the motivation and interest of study from the students. Also, the teaching materials in use now were discovered not to have enough originality, practical application, andwere text based. Therefore, the improvement of the existing teaching materials was demanded while the fundamental ability to study of general students is declining. Consequently, it is necessary to introduce new teaching materials which are simple, easy, and organized to offer the studen ts study desire and interest.

• Elastomers and Composites
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• v.59 no.2
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• pp.73-81
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• 2024

In the field of electronic components, the potting material, which is a part of the electronic circuit package, plays a significant role in protecting circuits from the external environment and reducing signal interference among electronic devices during operation. This significantly affects the reliability of the components. Therefore, the accurate prediction and assessment of the lifespan of a material are of paramount importance in the electronics industry. We conducted an accelerated thermal aging evaluation using the Arrhenius technique on elastic potting material developed in-house, focusing on its insulation, waterproofing, and contraction properties. Through a comprehensive analysis of these properties and their interrelations, we confirmed the primary factors influencing molding material failure, as increased hardness is related to aggregation, adhesion, and post-hardening or thermal-aging-induced contraction. Furthermore, when plotting failure times against temperature, we observed that the hardness, adhesive strength, and water absorption rate were the predominant factors up to 120 ℃. Beyond this temperature, the tensile properties were the primary contributing factors. In contrast, the dielectric constant and loss tangent, which are vital for reducing signal interference in electric devices, exhibited positive changes(decreases) with aging and could be excluded as failure factors. Our findings establish valuable correlations between physical properties and techniques for the accurate prediction of failure time, with broad implications for future product lifespans. This study is particularly advantageous for advancing elastic potting materials to satisfy the stringent requirements of reliable environments.

• Journal of the Microelectronics and Packaging Society
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• v.18 no.4
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• pp.19-25
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• 2011

The size reduction of the semiconductor chip and the improvement of the electrical performance have been enabled through the introduction of the Cu/Low-K process in modern electronic industries. However, Cu/Low-K has a disadvantage of the physical properties that is weaker than materials used for existing semiconductor manufacture process. It causes many problems in chip manufacturing and package processes. Especially, the delamination between the Cu layer and the low-K dielectric layer is a main defect after the temperature cycles. Since the Cu/Low-K layer is located on the top of the pad of the flip chip, the stress on the flip chip affects the Cu/Low-K layer directly. Therefore, it is needed to improve the underfill process or materials. Especially, it becomes very important to select the underfill to decrease the stress at the flip-chip and to protect the solder bump. We have solved the delamination problem in a 90 nm Cu/Low-K flip-chip package after the temperature cycle by selecting an appropriate underfill.

• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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• v.21 no.1
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• pp.27-34
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• 2015

Heating patterns depending on the packaging materials were examined in order to investigate the causes of thermal deformation of packages used for ready-to-eat foods for microwave heating due to the non-uniformity of microwaves. Physical properties including tensile strength, heat-resistance and elongation of four different CPP grades were compared. High retortable CPP had higher sealing strength and heat resistance compared to the conventional CPPs. All CPP samples tested were proved to have melting temperatures around $160^{\circ}C$. However, they were all thermally deformed by microwave heating due to a limited penetration of microwave and non-uniform heating within the spicy sauce of high viscosity contained high salt, especially on the above the filling line and sealing edge of pouches. When the laminated stand-up pouches composed of G-PET/PET/PET/CPP and G-PET/PET/NY/CPP were retorted and microwaved, significant deformations were noticed in both samples after retorting. Besides, pouches contained titanium dioxide showed more intense thermal deformation than the control. When the $10{\mu}m$ aluminium foil was affixed on the pouch, small thermal deformation was observed only in the bottom layer. More studies are required to prevent the thermal deformation of packaging materials used for RTE foods during microwave heating by developing the technologies to increase the thermal stability of CPP layer and the modification of packaging design to modify the microwave access into the package.

• Journal of the Microelectronics and Packaging Society
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• v.16 no.2
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• pp.43-50
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• 2009

Although thin PCBs(Printed Circuit Boards) have recently been required for high density interconnection, high electrical performance, and low manufacturing cost, the utilization of thin PCBs is severely limited by warpage and reliability issues. Warpage of the thin PCB leads to failure in solder-joints and chip. The $B^2it$(Buried Bump Interconnection Technology) for PCB has been developed to achieve a competitive manufacturing price. In this study, chip temperature, package warpage, chip stress and solder-joints stress characteristics of the PCB prepared with $B^2it$ process have been calculated using thermo-mechanical coupled analysis by the FEM(Finite Element Method). FEM computation was carried out with the variations in bump shapes and kinds of materials under 1.5W power of chip and constant convection heat transfer. The results show that chip temperature distribution reached more quickly steady-state status with PCB prepared with $B^2it$ process than PCB prepared with conventional via interconnection structure. Although $B^2it$ structures are effective on low package warpage and chip stress, with high strength bump materials arc disadvantage for low stress of solder-joints. Therefore, it is recommended that optimized bump shapes and materials in PCB design should be considered in terms of reliability characteristics in the packaging level.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2004.09a
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• pp.233-241
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces strictly related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2004.09a
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• pp.211-219
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces stric시y related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials. In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

• Journal of the East Asian Society of Dietary Life
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• v.23 no.4
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• pp.461-469
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• 2013

This research is performed to investigate the changes in the physicochemical properties and microbial growths of seasoned anchovies with various packaging materials (PET/CPP : polyethylene terephthalate/cast polypropylene, PET/EVOH : polyethylene terephthalate/ethylene-vinyl alcohol, PET/AL/LDPE: polyethylene terephthalate/aluminum/low density polyethylene), which are stored at various temperatures (25, 35, $45^{\circ}C$) for 60 days. Generally, it is being observed that changes in physicochemical properties (i.e., moisture content, color, brown intensity, TBA value, TMA, VBN etc) of seasoned anchovies are significant when stored at higher temperatures. Particularly, the packaging materials are found to influence substantially on the physicochemical properties of seasoned anchovies. With packaging materials of high oxygen transmission rates and moisture vapor transmission rates (i.e., PET/CPP), the changes in physicochemical properties of seasoned anchovies are significant, while being low with low oxygen transmission rates and low moisture vapor transmission rates (i.e., PET/EVOH). In addition, results of microbial growths in seasoned anchovies show that significant increases in total aerobic bacteria counts (about 100-fold after 60 day of storage) are observed in samples with packaging materials of high oxygen transmission rates and moisture vapor transmission rates (i.e, PET/CPP), while with only small increases for samples of low oxygen transmission rates and low moisture vapor transmission rates (i.e., PET/EVOH). Based on the changes in the physicochemical properties and results of microbial growths, it is being concluded that PET/EVOH film is suitable for the packaging of seasoned anchovies.

• Journal of the Korean Society for Nondestructive Testing
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• v.31 no.5
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• pp.522-528
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• 2011

Artificial basilar membranes made of PVDF(polyvinylidene fluoride) are manufactured using microfabrication processes. The mechanical behavior of PVDF artificial basilar membrane was measured to evaluate its performance as a mechanical frequency analyzer using scanning LDV(laser Doppler vibrometer). The experimental setup consists of the microfabricated artificial basilar membrane, a loud speaker connected to an amplifier for generating acoustic pressure of specific spectral pattern, and a scanning LDV with controlling unit for measuring the displacement of the membrane on the incoming acoustic stimulation. The microfabricated artificial basilar membrane was attached tightly upon a package containing a chamber which can be filled with silicone oil before placed on the experimental setup stage. The experiment results showed that the microfabricated artificial basilar membrane has a property as a mechanical frequency analyzer.

• Transactions of Materials Processing
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• v.6 no.3
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• pp.239-249
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• 1997

The behaviour of alloys in the semi-solid state strongly depends on the imposed stress state and on the morphology of the phase which can vary from dendritic to globular. To optimal net shape forging of semi-solid materials, it is important to investigate for filling phenomena in forging process of arbitrarily shaped dies. To produce a automotive part which has good mechanical property, the filling pattern according to die velocity and solid fraction distribution has to be estimated for arbitrarily shaped dies. Therefore, the estimation of filling characteristic in the forging simulation with arbitrarily shaped dies of semi-solid materials are calculated by finite element method with proposed algorithm. The proposed theoretical model and a various boundary conditions for arbitrarily shaped dies is investigated with the coupling calculation between the liquid phase flow and the solid phase deformation. The simulation process with arbitrarily shaped dies is performed to the isothermal conditions of two dimensional problems. To analysis of forging process by using semi-solid materials, a new stress-strain relationship is described, and forging analysis is performed by viscoelastic model for the solid phase and the Darcy's law for the liquid flow. The calculated results for forging force and filling limitations will be compared to experimental data. The filling simulation of simple products performed with the uniform billet temperature(584$^{\circ}C$) from the induction heating by the commercial package MAGMAsoft. The initial step of computation is the touching of semi-solid material with the end of die gate and the initial concept of proposed system just fit with the capability of MAGMAsoft.