• Korean Journal of Metals and Materials
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• v.46 no.2
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• pp.80-87
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• 2008

Many researches related to the reliability of Pb-free solder joints with PCB (printed circuit board) surface finish under thermal or vibration stresses are in progress, because the electronics is operating in hash environment. Therefore, it is necessary to assess Pb-free solder joints life with PCB surface finish under thermal and mechanical stresses. We have investigated 4-points bending fatigue lifetime of Pb-free solder joints with OSP (organic solderability preservative) and ENIG (electroless nickel and immersion gold) surface finish. To predict the bending fatigue life of Sn-3.0Ag-0.5Cu solder joints, we use the test coupons mounted 192 BGA (ball grid array) package to be added the thermal stress by conducting thermal shock test, 500, 1,000, 1,500 and 2,000 cycles, respectively. An 4-point bending test is performed in force controlling mode. It is considered that as a failure when the resistance of daisy-chain circuit of test coupons reaches more than $1,000{\Omega}$. Finally, we obtained the solder joints fatigue life with OSP and ENIG surface finish using by Weibull probability distribution.

• Proceedings of the KWS Conference
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• 2009.11a
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• pp.80-80
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• 2009

패키징 구조의 발전이 점차 중요한 문제로 대두되어, 칩의 집적 기술의 발전에 따라 실장기술에서도 고속화, 소형화, 미세피치화, 고정밀화, 고밀도화가 요구되고있다. 최근 선진국을 중심으로 전자 전기기기 및 부품의 실장기술에서도 환경 친화적인 기술을 요구함에 따라, 저에너지 공정 및 무연 실장 기술에 대한 연구가 활발하게 진행되고 있다. 기존의 SOP(Small Out-line Package), QFP(Quad Flat Package) 등은 소형화, 다핀화, 고속화, 실장성에 한계가 있기 때문에, SMT(Surface Mount Technology) 형식으로 된 BGA(Ball Grid Array)가 휴대형 전화를 비롯한 기타 전자 부품 실장에 널리 사용되고 있다. BGA ball shear 법은 BGA 모듈의 생산 및 취급 중에 발생할지도 모르는 기판에 수평으로 작용하는 기계적인 전단력에 BGA solder ball이 견딜 수 있는 정도를 측정하기 위해 사용되는 시험법이다. 전단 시험에 의한 전단 강도의 측정 외에 전기전도도 측정, 파면 관찰, 이동거리(displacement), 유한요소 해석법 등을 병행하여 시험법의 신뢰성 향상에 대한 연구가 이루어지고 있다. 본 실험에서는 지름이 $500{\mu}m$인 Sn-3.5Ag 솔더볼을 이용하여 세라믹 기판을 접합하여 BGA 패키지를 완성하였다. 상부 기판에 솔더볼을 정렬시켜 리플로우 방법으로 접합 한 후 솔더볼이 접합된 상부 기판과 하부 기판을 접합 하여 시편을 제작하였다. 접합된 시편들은 $150^{\circ}C$에서 0~800시간 열처리를 실시하였고, 열처리를 하면서 각각 $3{\times}10^2A/cm^2,\;5{\times}10^3A/cm^2$의 전류를 인가하였다. 시편들을 전단 시험기를 이용하여 솔더볼의 기계적 특성 평가를 하였으며, 계면 반응을 관찰하였다.

• The Korea Journal of Herbology
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• v.24 no.1
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• pp.1-7
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• 2009

Objectives : The purpose of this study is to investigate on storage characteristics of Herbal materials treated with Gamma-irradiation(10 KGy). Methods : This experiments were carried out by field survey and storage characteristics were carried out by physicochemical determination. Results : Antimicrobial activity of oriental medicine materials(Angelica dahurica Radix, Glehnia littoralis Radix) were examined, together with investigation of effects on gamma-irradiation. Oriental medicine materials contaminated in microbial cell were tend to be pinhole in packaging materials(polypropylene) by bug and Larva. At the same time, PVDC (polyvinylldichloride) package also was founded in bug and Larva by microbial contamination during storage in room temperature. Conclusions : In conclusion, it is very desirable to dose gamma-irradiation(10 KGy) in these oriental medicine materials in order to prevent microbial activity.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.06a
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• pp.315-316
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• 2009

본 논문에서는 1W 급 이상의 고출력 LED 용 패키지로서 세라믹 LTCC 적층 패키지의 방열 특성을 평가하고 열해석 결과와의 차이에 대해 고찰하였다. 특히, 세라믹 패키지의 방열 특성을 향상시키기 위해 Thermal Via와 Heat slug를 LED Chip 하단부에 위치시켰을 때 방열 특성을 평가하기 위해 Transient Thermal Test를 이용하여 각각의 경우에 대한 열저항을 평가하여 방열 특성의 항상 정도를 확인하였으며, 열해석 시뮬레이션을 통해 얻은 결과와 비교하였다. 평가 결과 Heat slug를 배치한 패키지가 열저항이 $8^{\circ}C/W$로서 가장 우수한 특성을 보여주었으며, 열해석 결과와의 차이에 대해서는 광출력으로 방출된 전력을 계산하여 보정함으로써 $1^{\circ}C$ 이하의 편차를 보여주는 결과를 얻을 수 있었다.

• Journal of the Computational Structural Engineering Institute of Korea
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• v.14 no.2
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• pp.143-150
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• 2001

원자력발전소의 1차 계통에서 오염된 장비들을 취급이 용이하고 안전하게 운반하기 위한 운반용기는 내부의 방사성 물질에 대한 방사능 평가에 의하여 방사성물질 A형 운반용기로 분류된다. 방사성물질 A형 운반용기는 IAEA Safety Standard Series No. ST-1 및 국내 원자력법 등 관련규정의 기술기준을 만족하여야 하는데, 운반용기는 중량에 따라 0.3∼1.2m의 높이에서 소성이 일어나지 않는 단단한 바닥면으로 가장 심각한 손상을 주는 방향으로 낙하시키는 정상운반조건(normal transport conditions)에 대하여 구조적 건전성을 유지하여야 한다. 여기서는 ABAQUS/Explicit 코드를 이용하여 컨테이너형태의 A형 운반용기에 대하여 최대손상이 야기되는 0.9m 경사낙하조건에 대한 3차원 충격해석을 수행하고 구조적 건전성을 평가하였는데, 운반용기는 경사낙하시 코너피팅(corner fitting)의 분쇄(crush)에 의하여 대부분의 충격을 흡수하였으며 운반용기의 격납경계는 구조적 건전성을 유지하였다.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2000.11a
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• pp.661-665
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• 2000

In this study, the control of mounting system for MLGA package was developed using machine vision for the control of rotating position compensation and mounting position of X-Y table. Two type of material (polymer, alumina )were used for the dielectric insulator of the MLGA. And the illumination system and the algorithm of position compensation that be suitable for these materials was developed. Also, the position control order that compensated by machine vision actuated to micro stepping motor and X-Y servo motor by controlled PC and mounted the MLGA on PCB in resolution to$\pm10\mum$ .

• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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• v.23 no.2
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• pp.109-117
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• 2017

Due to the rise of customer's alertness about fresh foods to health, in the past few years, the consumption of fresh food has increased sturdily. The use of gas scavengers is the most appropriate packaging technologies for fresh, fresh-cut produces and in ready to eat products. The gas absorber/scavenger has ability to protect or stabilize the wanted properties and shelf life of food. The success of gas absorbers in food depends on many parameters such as types of foods, storage temperature, relative humidity, initial gas concentration, and the characteristics of package materials. In this review article, we focus on the most recent research trends in gas scavenging systems used in food packaging, future trends. Intense research from industry and engineers remains important to the development of gas scavenging package that fulfill consumer requirements, enhance product quality, and offer environmentally friendly design and cost-effective application.

• Journal of the Korean Ceramic Society
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• v.26 no.6
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• pp.829-835
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• 1989

Devitrifing solder glasses in a specific group of glass ceramic materials are extensively used in hermetically sealing alumina electronics packages. Preferred frit glass compositions of this study consist of 37~40wt% PbO, 35~40wt% ZnO, 18~20wt% B2O3, 1~3wt% SiO2, 0~6wt% TiO2. The coated frit glasses crystallize during firing and form a strong hermetic seal. DTA and X-ray diffraction were used to characterize crystallization of the glass frit. Frit seal containing 2wt% TiO2 has crystallization temperature of 550~57$0^{\circ}C$ with surface nucleation. Frit seal containing 6wt% TiO2 has crystallization temperature of 515~5$25^{\circ}C$ with bulk nucleation, and the main crystalline phase was perovskite lead titanate having minus expansion coefficient. The average activation energy for the crystallization calculated from Ozawa equation was 65$\pm$10kcal/mol.

• Computers and Concrete
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• v.9 no.4
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• pp.293-310
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• 2012

This paper discusses a new constitutive model called the high-rate brittle microplane (HRBM) model and also presents the details of a new software package called the Virtual Materials Laboratory (VML). The VML software package was developed to address the challenges of fitting complex material models such as the HRBM model to material property test data and to study the behavior of those models under a wide variety of stress- and strain-paths. VML employs Continuous Evolutionary Algorithms (CEA) in conjunction with gradient search methods to create automatic fitting algorithms to determine constitutive model parameters. The VML code is used to fit the new HRBM model to a well-characterized conventional strength concrete called WES5000. Finally, the ability of the new HRBM model to provide high-fidelity simulations of material property experiments is demonstrated by comparing HRBM simulations to laboratory material property data.

• Journal of the Korean Society for Precision Engineering
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• v.29 no.5
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• pp.563-571
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• 2012

In 3D integration package using TSV technology, bonding is the core technology for stacking and interconnecting the chips or wafers. During bonding process, however, warpage and high stress are introduced, and will lead to the misalignment problem between two chips being bonded and failure of the chips. In this paper, a finite element approach is used to predict the warpages and stresses during the bonding process. In particular, in-plane deformation which directly affects the bonding misalignment is closely analyzed. Three types of bonding technology, which are Sn-Ag solder bonding, Cu-Cu direct bonding and SiO2 direct bonding, are compared. Numerical analysis indicates that warpage and stress are accumulated and become larger for each bonding step. In-plane deformation is much larger than out-of-plane deformation during bonding process. Cu-Cu bonding shows the largest warpage, while SiO2 direct bonding shows the smallest warpage. For stress, Sn-Ag solder bonding shows the largest stress, while Cu-Cu bonding shows the smallest. The stress is mainly concentrated at the interface between the via hole and silicon chip or via hole and bonding area. Misalignment induced during Cu-Cu and Sn-Ag solder bonding is equal to or larger than the size of via diameter, therefore should be reduced by lowering bonding temperature and proper selection of package materials.