• Proceedings of the Materials Research Society of Korea Conference
• /
• 1998.08a
• /
• pp.97.2-97
• /
• 1998

• Proceedings of the Materials Research Society of Korea Conference
• /
• 1998.08a
• /
• pp.98.4-98
• /
• 1998

• Transactions on Electrical and Electronic Materials
• /
• v.2 no.3
• /
• pp.28-32
• /
• 2001

It was studied in the present work how the thermal cycling performance of LOC (lead on chip) packages depends on the package construct or leadframe materials. First, package body thickness and Au wire diameter were manipulated for the selection of proper package design. Secondly, two different types of leadframe materials (i.e. copper and 52%Fe-48%Ni alloy) were tested to determine the better material for improved reliability margin of plastically encapsulated microelectronic packages. This work shows that manipulating package body thickness was more effective than an increase of Au wire from 23$\mu\textrm{m}$ to 33$\mu\textrm{m}$ for the prevention of wire debonding failure. Further, this work indicates that the LOC packages including the copper leadframes can be more susceptible to thermal cycling reliability degradation due to chip cracking than those including the alloy leadframes.

• The Korea Journal of Herbology
• /
• v.24 no.1
• /
• pp.9-14
• /
• 2009

Objectives : The purpose of this study is to investigate on storage characteristics of flavouring oriental medicine materials according to Packaging method(Aluminum package, PP). Methods : This experiments were carried out by field survey and storage characteristics were carried out by physicochemical determination. Results : Flavouring oriental medicine materials were used to in aluminum package to keep original flavour in Japan and Chinese by field and study survey. In view of this survey results, it is very desirable to use zipper Aluminum package in flavouring oriental medicine materials(Perilla perfrutescens var. acuta, Mentha arvensis L. var. piperascens malinvaud). Conclusions : This study results revealed that Aluminum package were superior to any other package method on the basis of keeping original flavour and to reduce microbial contamination in oriental medicine materials.

• Proceedings of the Materials Research Society of Korea Conference
• /
• 1998.08a
• /
• pp.98.3-98
• /
• 1998

• Proceedings of the Materials Research Society of Korea Conference
• /
• 1999.11a
• /
• pp.108-108
• /
• 1999

• Proceedings of the Materials Research Society of Korea Conference
• /
• 2007.05a
• /
• pp.15.2-15.2
• /
• 2007

• Proceedings of the Materials Research Society of Korea Conference
• /
• 1998.08a
• /
• pp.138.2-138
• /
• 1998

• Journal of the Microelectronics and Packaging Society
• /
• v.20 no.3
• /
• pp.63-69
• /
• 2013

The warpage of a bottom package of Package on Package(PoP) where a chip was mounted to a substrate by flip chip process was compared to that of a bottom package for which a chip was bonded to a substrate using die attach film(DAF). At the solder reflow temperature of $260^{\circ}C$, the packages processed with flip chip bonding and DAF bonding exhibited warpages of $57{\mu}m$ and $-102{\mu}m$, respectively. At the temperature range between room temperature and $260^{\circ}C$, the packages processed with flip chip bonding and DAF bonding exhibited warpage values ranging from $-27{\mu}m$ to $60{\mu}m$ and from $-50{\mu}m$ to $-15{\mu}m$, respectively.

• Transactions of the Korean Society of Mechanical Engineers
• /
• v.18 no.3
• /
• pp.729-737
• /
• 1994

A three-dimensional finite element model of a 20-pin plastic dual-in-line package(PDIP) plugged into a PCE has been developed by using the finite element code ANSYS. The model has been used for thermal characterization of the package during its normal operation under natural convection cooling. Temperature distributions in the package and PCB are obtained from numerical analysis and compared with experimentally measured data. Various cases are assumed and analyzed to study the effects of package and PCB materials on thermal characteristics of PDIP with and without aluminum heatspreader. Thermal dissipation capability of PDIP is greatly increased due to copper die pad/lead frame and heatspreader. However, thermally induced stresses in the package and fatigue life of chip are improved for PDIP with Alloy 42 die pad/lead frame and no heatspreader. It is also found that the role of PCB on thermal characteristics of PDIP is very imporatant.