• Proceedings of the KSME Conference
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• 2001.06a
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• pp.286-291
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• 2001

Applications of bonded dissimilar materials such as IC package, ceramic/metal and resin/metal bonded joints, are very increasing in various industry fields. It is very important to analyze the thermal stress and stress singularity at interface edges in bonded joints of dissimilar materials. In orer to understand the package crack emanating from the edge of Die pad and Resin, fracture mechanics of bonded dissimilar materials and material properties are obtained. In this paper, the thermal stress and its singularity index for the IC package were analyzed using 2-dimensional elastic boundary element method. Crack propagation angle and path by thermal stress were numerically simulated with boundary element method.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.15 no.10
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• pp.889-895
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• 2002

Wafer level packaging is gain mote momentum as a low cost, high performance solution for RF-MEMS devices. In this work, the flip-chip method was used for the wafer level packaging of RF-MEMS devices on the quartz substrate with low losses. For analyzing the EM (electromagnetic) characteristic of proposed packaging structure, we got the 3D structure simulation using FEM (finite element method). The electric field distribution of CPW and hole feed-through at 3 GHz were concentrated on the hole and the CPW. The reflection loss of the package was totally below 23 dB and the insertion loss that presents the signal transmission characteristic is above 0.06 dB. The 4-inch Pyrex glass was used as a package substrate and it was punched with air-blast with 250${\mu}{\textrm}{m}$ diameter holes. We made the vortical feed-throughs to reduce the electric path length and parasitic parameters. The vias were filled with plating gold. The package substrate was bonded with the silicon substrate with the B-stage epoxy. The loss of the overall package structure was tested with a network analyzer and was within 0.05 dB. This structure can be used for wafer level packaging of not only the RF-MEMS devices but also the MEMS devices.

• The monthly packaging world
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• s.173
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• pp.85-89
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• 2007

• The monthly packaging world
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• s.107
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• pp.170-174
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• 2002

• The monthly packaging world
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• s.245
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• pp.91-95
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• 2013

• The monthly packaging world
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• s.174
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• pp.52-55
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• 2007

• Electrical & Electronic Materials
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• v.16 no.7
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• pp.14-20
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• 2003

• The monthly packaging world
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• s.347
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• pp.65-68
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• 2022

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.35 no.6
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• pp.556-561
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• 2022

Computational material science as an application of Density Functional Theory (DFT) to the discipline of material science has emerged and applied to the research and development of energy materials and electronic materials such as semiconductor. However, there are a few difficulties, such as generating input files for various types of materials in both the same calculating condition and appropriate parameters, which is essential in comparing results of DFT calculation in the right way. In this tutorial status report, we will introduce how to create crystal structures and to prepare input files automatically for the Vienna Ab initio Simulation Package (VASP) and Gaussian, the most popular DFT calculation programs. We anticipate this tutorial makes DFT calculation easier for the ones who are not experts on DFT programs.

• Korean Journal of Optics and Photonics
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• v.18 no.4
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• pp.235-240
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• 2007

A ceramic stem based TO package incorporating a coplanar waveguide feed-line has been proposed allowing for 10 Gbps grade data transmission. The frequency response of a cylindrical feed-line fer a conventional metal based TO package was first analyzed, and compared with that of the CPW feed-line used for a ceramic based package such as a butterfly package. For the case where a DFB LD chip is packaged to an LD module, the measured 3 dB frequency bandwidths for the conventional and proposed packages were 3.5 GHz and 7.8 GHz respectively, which agree well with the theoretical results obtained from the modeling based on the small signal equivalent circuits. Consequently, we proposed a novel ceramic based TO package with a CPW feed-line in ceramic material as a stem to improve the frequency characteristics of the conventional one. And, its performance was theoretically observed to confirm that the proposed package provides even wider frequency bandwidth compared to the conventional one.