• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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• v.14 no.2
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• pp.53-56
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• 2008

Polyvinylchloride(PVC) is variously used to produce food packaging, wrap film, sealing compound of drinking bottle cap. Safety of these PVC food package is controlled by Food Code, PVC regulation. This study was carried out researches on manufacture process, physical, chemical properties and monomer(CAS No., common name, molecular structure) of PVC to help the understanding of PVC material. Also, this study helps us the understanding of regulation through researches on the foundation of PVC regulation, the purpose of test and the comment of test method. It is considered that these informations of material properties and explanations of test method are very useful to PVC producers, users and analyzers of them.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.13 no.10
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• pp.805-811
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• 2000

Reliability of PBGA(plastic ball grid array) package is weak compared with normal plastic packages. The low reliability is caused by low resistance to the popcorn cracking, which is generated by moisture absorption in PCB(prited circuit board). In this paper, plasma treatment process was used and we analyzed its effects to interface adhesion. The contents of C and Cl decrease after plasma treatment but those of O, Ca, N relatively increase. The plasma treatment improves the adhesion between EMC(epoxy molding compound) and PCB(solder mask). The grade of improvement was over 100% Max, which depends on the properties of EMC. The RMS(root mean square) roughness value of the solder mask surface increases to plasma treatment. There is little difference of adhesion in RF power and treatment time.

• Journal of the Microelectronics and Packaging Society
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• v.17 no.2
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• pp.21-28
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• 2010

Creep behaviors of the solder balls in a flip chip package assembly during thermal cycling test is investigated.. A material models used in the finite element analysis are viscoplastic model introduced by Anand and creep model called partitioned model. Experiment of two temperature cycles using moir$\acute{e}$ interferometry is conducted to verify the reliability of material models for the analysis of thermo-mechanical behavior. Bending deformations of the assemblies and average strains of the solder balls due to temperature change and dwell time are investigated. The results show that time-dependent shear strain of solder by the partitioned model is in excellent agreement with those by moir$\acute{e}$ interferometry, while there is considerable difference between results by Anand model and experiment. In this paper, the partitioned model is employed for the time-dependent creep analysis of the FC-PBGA package. It is also shown that the thermo-mechanical stress becomes relaxed by creep behavior at high temperature during temperature cycles.

• Journal of the Microelectronics and Packaging Society
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• v.15 no.1
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• pp.7-18
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• 2008

This paper reviews the current development of an ultra-slim SiP for Radio Frequency (RF) application, in which three flip chips, additional passive components and Surface Acoustic Wave (SAW) filters are integrated side-by-side. A systematic investigation is carried out for the design optimization, process and reliability improvement of the package, which comprises several aspects: a design study based on the 3D thermo-mechanical finite element analysis of the packaging, the determination of stress, warpage distribution, critical failure zones, and the figuration of the effects of material properties, process conditions on the reliability of package. The optimized material sets for manufacturing process were determined which can reduce the number of testing samples from 75 to 2. In addition the molded underfilling (MUF) process is proposed which not only saves one manufacturing process, but also improves the thermo-mechanical performance of the package compared with conventional epoxy underfilling process. In the end, JEDEC's moisture sensitivity test, thermal cycle test and pressure cooker tests have also been carried out for reliability evaluation. The test results show that the optimized ultra-slim SiP has a good reliability performance.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.06a
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• pp.183-184
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• 2007

A 40 Gb/s transimpedance amplifier IC was designed and fabricated with a InP/InGaAs HBTs technology. In this study, we interconnect 40Gbps trans impedance amplifier IC to a duroid substrate by a flip chip bonding instead of conventional wire bonding for interconnection. For flip chip bonding, we developed fine pitch bump with the $70{\mu}m$ diameter and $150{\mu}m$ pitch using WLP process. To study the effect of WLP, electrical performance was measured and analyzed in wafer and package module using WLP. The Small signal gains in wafer and package module were 7.24 dB and 6.93dB respectively. The difference of small signal gain in wafer and package module was 0.3dB. This small difference of gain is due to the short interconnection length by bump. The characteristics of return loss was under -10dB in both wafer and module. So, WLP process can be used for millimeter wave GaAs MMIC with the fine pitch pad and duroid substrate can be used in flip chip bonding process.

• Transactions of the Korean Society of Automotive Engineers
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• v.16 no.3
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• pp.15-22
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• 2008

Applications of bonded dissimilar materials such as integrated circuit(IC) packages, ceramics/metal and resin/metal bonded joints, are very increasing in various industry fields. It is very important to analyze the thermal stress and stress singularity at interface edge in bonded joints of dissimilar materials. In order to investigate the IC package crack propagating from the edge of die pad and resin, the fracture parameters of bonded dissimilar materials and material properties are obtained. In this paper, the thermal stress and its singularity index for the IC package were analyzed using 2-dimensional elastic boundary element method(BEM). From these results, crack propagation direction and path by thermal stress in the IC package were numerically simulated with boundary element method.

• Journal of Welding and Joining
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• v.18 no.2
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• pp.222-222
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• 2000

PBGA(Plastic Ball Grid Array) is composed of some materials such as PCB(Printed Circuit Board), epoxy molding compound, die attach and so on. Reliability of PBGA package is weak compared with plastic packages. The weak points of reliability are the lower resistance to popcorn cracking, which is induced by moisture absorption in PCB, and the pressure cooker test corrosion, which is the basic problem due to the material characteristics of PCB. Introducing the PCB baking and the plasma treatment cleared the popcorn cracking phenomenon. The PCB baking and plasma treatment reduced the epoxy void by eliminating the source of moisture vaporization during the epoxy curing and enhanced the adhesion between PCB and epoxy. Also, plasma treatment enhanced the wettability of epoxy on PCB. The problem of corrosion is cleared using multi-functional epoxy. This type of EMC(Epoxy Molding Compound) is recommended in package using PCB as a substrate. (Received November 19, 1999)

• Journal of Welding and Joining
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• v.18 no.2
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• pp.95-99
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• 2000

PBGA(Plastic Ball Grid Array) is composed of some materials such as PCB(Printed Circuit Board), epoxy molding compound, die attach and so on. Reliability of PBGA package is weak compared with plastic packages. The weak points of reliability are the lower resistance to popcorn cracking, which is induced by moisture absorption in PCB, and the pressure cooker test corrosion, which is the basic problem due to the material characteristics of PCB. Introducing the PCB banking and the plasma treatment cleared the popcorn cracking phenomenon. The PCB banking and plasma treatment reduced the epoxy void by eliminating the source of moisture vaporization during the epoxy curing and enhanced the adhesion between PCB and epoxy. Also, plasma treatment enhanced the wettability of epoxy on PCB. The problem of corrosion is cleared using multi-functional epoxy. This type of EMC(Epoxy Molding Compound) is recommended in package using PCB as a substrate.

• Journal of the Korean Society of Industry Convergence
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• v.26 no.2_2
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• pp.265-272
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• 2023

In this paper, we directly implemented the Line Tracer ROS package that can detect and follow lines drawn on the map on Gazebo, an open-source that is widely used in autonomous driving research. For line detection, the cv_bridge package was used to enable OpenCV's image processing tools, and parameters such as robot speed, line color and ground material could be changed. In addition, proportional (P) and PID controls could be implemented using the color centroid obtained through image processing. Through this approach, the effect of proportional and differential coefficients on the robot's line tracer motion could be analyzed effectively. In addition, by displaying robot simulation results using various tools of ROS, an efficient development for control nodes could be established in ROS.

• Journal of the Korea Fashion and Costume Design Association
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• v.13 no.4
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• pp.153-165
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• 2011

The purpose of this study is to take into consideration the package products of wedding miniature dress. The method of the research was mainly focused on precedent research data and general references. Furthermore the data on wedding dresses was mainly collected from internet sites. Ai; reflection customer's demands, more personal and distinctive design was planned reflecting trend in the sector of wedding dress. The results of the research is the following. First, the first consideration for designing product in wedding miniature was designed with the focus on what consumers are easy to make and on brilliance when having made. 8 pairs for barbie miniature and 2 pairs for ball joints were designed. Among these things, it designed colorfully with 6 pairs for wedding dress and 4 pairs for shooting, which are used in the right size. Second, as a result of seeing consumers' response by up-loading totally 10 pieces of miniature clothes on wedding miniature. com site, and were the most popular products. The aim is to suggest package product based on these two works. The design-based pattern, the fabric of being used, lace material, beads, and several trimmings are offered to 2 wedding miniature package products. Consumers can make own collection with a handicraft-based feeling by using this.