• 제목/요약/키워드: package material

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A Case Study for Manufacturing System Design on the Introduction of ERP System (ERP 시스템 도입과정에서의 생산시스템 설계방안에 관한 사례연구)

  • 윤영도;강경식;김귀남
    • Proceedings of the Safety Management and Science Conference
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    • 2000.11a
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    • pp.307-310
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    • 2000
  • The target company of this study goes ahead with plan to adopt ERP systems. Hereupon, I want to present the issues which should be considered in the process of ERP system implementation. This study focuses on the manufacturing system, but it also discusses important issues on the selected business area. This study covers the material benefits and functionalities of ERP package, as well as the Importance of studying and understanding on business process, organization change management, and information technology And this case study start with a long-term plan and consider its own unique characteristics and environmental factors.

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1Monitoring system for the subway structures using pre-strain controllable FBG sensors (프리스트레인 가변형 광섬유센서를 이용한 지하철 구조 모니터링시스템)

  • Kim, Ki-Soo
    • Proceedings of the Korean Geotechical Society Conference
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    • 2009.09a
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    • pp.700-709
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    • 2009
  • FBG sensor system is applied to the concrete lining structure in Taegu subway. Near the structure, the power cable tunnel construction started. We wanted to measure the deformation of the structure due to the construction by the FBG sensor. The applied sensor has the gauge length of 1 meter to overcome the inhomogeneity of the concrete material with enough length. In order to fix tightly to the structure, the partially stripped parts of the sensor glued to the package and slip phenomenon between fiber and acrylate jacket was prevented. Prestrain of the sensor was imposed by controlling the two fixed points with bolts and nuts in order to measure compressive strain as well as tensile strain. The behavior of subway lining structure could be monitored very well.

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A Simulation Study for Detailed Design of A-Mart Logistics Center for General Products (A-마트 상온 제품 종합물류센터 실시설계를 위한 시뮬레이션)

  • Jeon, Byoung-Hack;Jang, Seong-Young
    • IE interfaces
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    • v.20 no.1
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    • pp.21-32
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    • 2007
  • This paper deals with the simulation model for A-Mart logistic center design and operations. In developed simulation model, receiving docks, conveyor sorter, conveyor system, shipping docks, material handling devices and manual sorting stations are considered. Three types of cargo such as transfer center cargo, distribution center cargo and supermarket cargo are considered. The simulation model and process animation are developed using the simulation package ARENA. Among various design and operation alternatives consisting of the number of workers of receiving dock, allocation of receiving docks by cargo types, conveyor sorter velocity, the number of folk-lift, the number of manual sorting operators and overall layout, the best alternatives of each subsystem are selected by simulation analysis. The major performance measures such as sorter throughput, utilization of operators at each station, receiving docks utilization and folk-lift utilization are considered for the alternative evaluation.

Flexible Ultra-high Gas Barrier Substrate for Organic Electronics

  • Yan, Min;Erlat, Ahmet Gun;Zhao, Ri-An;Scherer, Brian;Jones, Cheryl;Smith, David J.;McConnelee, Paul A.;Feist, Thomas;Duggal, Anil
    • 한국정보디스플레이학회:학술대회논문집
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    • 2007.08a
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    • pp.445-446
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    • 2007
  • The use of plastic substrates enables new applications, such as flexible display devices, and other flexible electronic devices, using low cost, rollto-roll (R2R) fabrication technologies. One of the limitations of polymeric substrate in these applications is that oxygen and moisture rapidly diffuse through the material and subsequently degrade the electro-optical devices. GE Global Research (GEGR) has developed a plastic substrate technology comprised of a superior high-heat polycarbonate (LEXAN(R)) substrate film and a unique transparent coating package that provides the ultrahigh barrier (UHB) to moisture and oxygen, chemical resistance to solvents used in device fabrications, and a high performance transparent conductor. This article describes the coating solutions for polycarbonate (LEXAN(R)) films and its compatibility with OLED device fabrication processes.

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A Study of the Upper Bound Analysis of Extrusion Process with Torsion (토션을 이용한 압출공정의 상계해석에 관한 연구)

  • Park, Chul-Woo
    • Journal of Advanced Marine Engineering and Technology
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    • v.32 no.4
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    • pp.578-584
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    • 2008
  • In this study, a extrusion process with torsion of the bottom die is investigated to improve the forming performance of conventional extrusion process. In the experiment, plasticine is used as a model material. The results of experiments are compared with the two numerical methods, the Experiment and the Finite Element Method(FEM). An attempt is made to link programs incorporating with the process variables obtained by commercial FEM software, DEFORM-3D a useful package. Numerical result is compared with experimental one. These results show that the torsional extrusion process is very useful process because this process can obtain the homogenous deformations.

The research on wear simulation between wheel and rail for Korea High Speed Railway (고속철도 차량의 차륜과 레일간의 마모 예측)

  • Choi Jeung-Hum;Moon Tai-Seon;Kim Ki-Hwan;Han Dong-Chul
    • Proceedings of the KSR Conference
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    • 2003.10c
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    • pp.369-376
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    • 2003
  • The purpose of this work is to general approach to numerically simulating wear in rolling and sliding contact area between wheel and rail interface based on the analysis of dynamics characteristics with general MBS package. A simulation scheme is developed that calculates the wear at a detailed and various level. The estimation of material removal follows Archard's wear equation which states that the reduction of volume is linearly proportional to the sliding distance, the normal applied load and the wear coefficient and inverse proportional to hardness. The main research application is the wheel-rail contact of Korea High Speed Railway.

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3-Dimensional Finite Element Method Analysis of Blanking Die for Lead Frame (리드프레임의 전단용 금형에 대한 3차원 FEM 해석)

  • Choi, Man-Sung
    • Journal of the Semiconductor & Display Technology
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    • v.10 no.3
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    • pp.61-65
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    • 2011
  • The capabilities of finite elements codes allow now accurate simulations of blanking processes when appropriate materials modelling are used. Over the last decade, numerous numerical studies have focused on the influence of process parameters such as punch-die clearance, tools geometry and friction on blanking force and blank profile. In this study, three dimensional finite element analysis is carried out to design a lead frame blanking die using LS-Dyna3D package. After design of the blanking die, an experiment is also carried out to investigate the characteristics of blanking for nickel alloy Alloy42, a kind of IC lead frame material. In this paper, it has been researched the investigation to examine the influence of process parameters such as clearance and air cylinder pressure on the accuracy of sheared plane. Through the experiment results, it is shown that the quality of sheared plane is less affected by clearance and air cylinder pressure.

Nonlinear Earthquake Response Analysis of 2-D Underground Structures with Soil-Structure Interaction Including Separation and Sliding at Interface (지반-구조물 상호작용계의 경계면에서 미끄러짐과 분리현상을 고려한 이차원 지하구조물의 비선형 지진응답해석)

  • 최준성;이종세;김재민
    • Proceedings of the Computational Structural Engineering Institute Conference
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    • 2002.04a
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    • pp.174-181
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    • 2002
  • The paper presents an effective analytical method for SSI systems which can have separation or sliding at the soil-structure interface. The method is based on a hybrid approach which combines a linear SSI code KIESSI-2D in frequency domain with a commercial finite element package ANSYS to obtain nonlinear dynamic responses in time domain. The method is applied to a 2-D underground box structure which experiences separation and sliding at the soil-structure interface. Material nonlinearity of the concrete structure is also included in the analysis. Effects of the interface conditions are examined and some critical factors affecting the seismic performance of underground structures are identified.

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Analysis of Consumer Behavior on Using Food Label (식품표시에 대한 소비자 행동연구)

  • 이경희
    • Journal of the Korean Home Economics Association
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    • v.34 no.5
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    • pp.235-248
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    • 1996
  • The purpose of this study was to search for new food labeling system that would support effective consumer decision-making, by examining consumer behavior of food labels and its' related factors. The survey was conducted on 410 housewives under 60-year-old who live in Seoul or Metropolitan area, using questionnaires and the illustrated material of labels. Respondents generally considered food labels very important as devices. Among 12 items of label which are required to disclose, they evaluated circulation period, and nutritional information. Among 12 items of label, housewives read manufacture date, circulation period, and price more often than business admission number and self standard number. The respondents preferred the format of marking both manufacture date and expiration date on the same side, the format of printing both price and weight on the same side of package, the diagramatic type, and the format represented by ration graph per daily value.

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Investigation on Hermeticity of Liquid Crystal Polymer Package for MEMS Based Safety Device (MEMS 기반 안전 소자에 대한 액정 폴리머 패키지의 밀폐도 연구)

  • Choi, Jinnil;Kim, Yong-Kook;Ju, Byeong-Kwon
    • Journal of Sensor Science and Technology
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    • v.24 no.5
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    • pp.287-290
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    • 2015
  • Liquid crystal polymer (LCP) is a thermoplastic polymer with superior mechanical and thermal properties. In addition, its characteristics include very low water absorption rate and possibility to apply bonding process under low temperature. In this study, LCP is utilized as a packaging material for a microelectronic system (MEMS) based safety device with suggestion of a low temperature packaging process. Highly sensitive and stable capacitive type humidity sensor is fabricated to investigate hermeticity of the packaged MEMS device.