• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.24 no.3
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• pp.234-239
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• 2011

In this study, the heat transfer capability have been improved by using via-holes in FR4 PCB, when the LED lighting is designed to solve the thermal problem. The thermal resistance and junction temperature were measured by changing the dimension of FR4 PCB and size of via hole. As a result, when the dimension was increased initially, the thermal resistance and junction temperature was decreased rapidly, the ones was stabilized after the dimension of 200 $[mm^2]$. Also, the light output was improved up to maximum 17% by formation of via-hole and expansion of dimension in FR4 PCB. Therefore, the thermal resistance and junction temperature could be improved by expansion of PCB dimension and configuration of via-hole ability.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.27 no.10
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• pp.673-677
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• 2014

In this paper, thermal analysis of HDU (Heat Dissipation Unit) for infrared CCTV is performed by using SolidWorks Simulation (Thermal analysis) package, in order to change the part materials and HDU shape is optimized. Furthermore, HDU disperses the aggregated heat around the LED inside the housing. The junction temperature of infrared LED checked by HDU check was $65.83^{\circ}C$, $42.02^{\circ}C$, respectively. In addition, the Thermoelement by changing the shape of the HDU was possibly designed and equipped with. Comparison with simulation and prototype measurement results, without HDU model was $65.83^{\circ}C$, $61.99^{\circ}C$, respectively. In addition to with HDU model was $42.02^{\circ}C$, $39.01^{\circ}C$, respectively. Only HDU mounted into infrared CCTV is usable in the ordinary house or outdoors. Also HDU with thermal element, fan mounted into infrared CCTV is usable in a blast furnace workplace or high temperature workplace.

• Structural Engineering and Mechanics
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• v.82 no.3
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• pp.401-416
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• 2022

The aim of this study is to examine the frictionless double receding contact problem for two functionally graded (FG) layers pressed with a uniformly distributed load and resting on a homogeneous half plane (HP) using analytical and numerical methods. The FG layers are made of a non-homogeneous material with an isotropic stress-strain law with exponentially varying properties. It is assumed that the contact at the FG layers and FG layer-HP interface is frictionless. The body force of the FG layers and homogeneous HP are ignored in the study. Firstly, an analytical solution for the contact problem has been realized using the theory of elasticity and the Fourier integral transform techniques. Then, the problem modeled and two-dimensional analysis was carried out by using the ANSYS package program based on FEM. Numerical results for contact lengths and contact pressures between FG layers and FG layer-HP were provided for various dimensionless quantities including material inhomogeneity, distributed load width, the shear module ratio, and the heights of the FG layers for both methods. The results obtained using FEM were compared with the results found using the analytical formulation. It was found that the results obtained from analytical formulation were in perfect agreement with the FEM study.

• Journal of the Microelectronics and Packaging Society
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• v.20 no.4
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• pp.47-52
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• 2013

Gold wire has long been used as a proven method of connecting a silicon die to a substrate in wide variety of package types, delivering high yield and productivity. However, with the high price of gold, the semiconductor packaging industry has been implementing an alternate wire material. These materials may include silver (Ag) or copper (Cu) alloys as an alternative to save material cost and maintain electrical performance. This paper will analyze and compare the electrical characteristics of several wire types. For the study, typical 0.6 mil, 0.8 mil and 1.0 mil diameter wires were selected from various alloy types (2N gold, Palladium (Pd) coated/doped copper, 88% and 96% silver) as well as respective pure metallic wires for comparison. Each wire model was validated by comparing it to electromagnetic simulation results and measurement data. Measurements from the implemented test boards were done using a vector network analyzer (VNA) and probe station setup. The test board layout consisted of three parts: 1. Analysis of the diameter, length and material characteristic of each wire; 2. Comparison between a microstrip line and the wire to microstrip line transition; and 3. Analysis of the wire's cross-talk. These areas will be discussed in detail along with all the extracted results from each type the wire.

• Journal of the Institute of Convergence Signal Processing
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• v.10 no.2
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• pp.120-126
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• 2009

There are many different types of surface defects on semiconductor Integrated Chips (IC's) caused by various factors during manufacturing process, such as cracks, foreign materials, chip-outs, chips, and voids. These defects must be detected and classified by an inspection system for productivity improvement and effective process control. Among defects, in particular, foreign materials and chips are the most difficult ones to classify accurately. A vision system composed of a carefully designed optical system and a processing algorithm is proposed to detect and classify the defects on QFN(Quad Flat No-leads) packages. The processing algorithm uses features derived from the defect's position and brightness value in the Maximum Likelihood classifier and the optical system is designed to effectively extract the features used in the classifier. In experiments we confirm that this method gives more effective result in classifying foreign materials and chips.

• Korean Journal of Construction Engineering and Management
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• v.2 no.2 s.6
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• pp.47-58
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• 2001

Of all the site logistics technologies in high-rise building construction, both vertical and horizontal move plan, are the most imperative factors. And the horizontal plan follows lift-up plan as of the vertical plan. However though it may be, temporary lifts on site are numbered by heuristic formulas. The quantity of finishing material cannot be converted into lift-up load per finishing material. The lift-up plan cannot be evaluated the feasibility for finishing material move plan by a reasonable evaluation methodology. The horizontal plan is far from the vertical one. And the information as an input data for the horizontal plan is devoid of package unit size, length, and volume per finishing material. These can hardly result in reasonable and detail decision on how much to use temporary lifts, how long to use these, and where to deposit each finishing material. Therefore, this study is to suggest a decision-making model that can integrate vertical and horizontal material move plan in high-rise building construction and make a decision the plans systematically. And the study is to explain the concept, methodology, and contents of the model applied to a virtual project, named as MT 130 (Millennium Tower 130). By the model, the planner can shift his/her thinking framework on site logistics management products-oriented Into process-oriented. He/she can manage a project by the framework as system thinking, evaluate the feasibility of a lift-up plan, and decide the horizontal plan integrated with the lift-up.

• Preventive Nutrition and Food Science
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• v.14 no.4
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• pp.349-353
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• 2009

The effects of packaging materials on preserving the functional component of pine bud beverage stored under UV (ultraviolet) light exposure conditions were studied. The order of UV light blocking properties of the selected packages was: opaque can> opaque PET (polyethylene terepthalate) with green lamination=transparent PET with 10% PEN (polyethylene naphthalate) blending> transparent PET, and did not depend on film thickness in specified range. At 20${^{\circ}C}$, the order of preserving degree of original color and endobornyl acetate, which is quality index of pine bud beverage, was the same as above. Exposure to UV light can cause of deterioration of functional food components, but green color lamination and blending of PEN materials with transparent PET help to preserve the UV sensitive pine bud beverage components. However, the treated PET bottles have poorer preservation capabilities than the opaque cans. Transparent PET with PEN blending, in particular, will be very useful packaging material for colorful functional beverage preservation by helping to protect the ingredients while attracting consumer attention.

• Fashion & Textile Research Journal
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• v.9 no.6
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• pp.637-644
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• 2007

The purposes of this study were to classify adolescents by their lifestyles and to investigate the differences in clothing purchase behavior among lifestyle groups. The data were obtained from questionnaire completed 341 adolescents in Daegu area. The SPSS package was used for data analysis which included frequency, factor analysis, cluster analysis, ${\chi}^2$ test, ANOVA, and Scheffe test. Lifestyles of adolescents were categorized into five factors such as clothing hedonic shopping orientation, positive activity, material orientation, frugality, digital orientation. Three clusters (achievement orientation group, ordinary group, economic orientation group) were developed by five factors of lifestyles. While the achievement orientation group had the highest purchase motives and used the most information sources, the economic orientation group had the lowest purchasing motives and used the least information sources. There were significant differences in clothing purchase frequency and average clothing expenditure among three clusters.

• Journal of the Korean Society for Advanced Composite Structures
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• v.6 no.1
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• pp.45-50
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• 2015

This study performed a finite element crash analysis of support structures made of various composite materials for road facilities. The effects of different material properties of composites for various parameters are studied using the finite element commercial package for this study. In this study, the existing finite element analysis of composite post structures using the LS-DYNA program is further extended to compare dynamic behaviors against car crash of the structures made of various composite materials. The several numerical examples show the comparison of the nonlinear dynamic effects for different materials.

• Journal of Welding and Joining
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• v.35 no.1
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• pp.49-54
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• 2017

In this study, the volumetric heat source in electron beam welding (EBW) is modeled through finite element method taking advantage of ABAQUS software package. Since this welding method is being applied in plates with different thicknesses and also considering that residual stresses reduce the strength of these weldments, the effect of thickness in the distribution and magnitude of residual stresses after welding is studied. Regarding the vast application of Inconel 706 super-alloy in aerospace industries, this material was selected in the current research. In order to validate the finite element model, the obtained results were compared to those of other researchers in this area, and good agreement was observed. The simulation results revealed that increase in the plate thickness leads to increase in the residual stresses. In addition heat treatment in the base metal (before welding) increases the residual stresses significantly.