• 월간포장계
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• 통권205호
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• pp.76-80
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• 2010

• 대한기계학회:학술대회논문집
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• 대한기계학회 2007년도 춘계학술대회A
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• pp.1673-1678
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• 2007

The use of flip-chip type electronic package offers numerous advantages such as reduced thickness, improved environmental compatibility, and downed cost. Despite numerous benefits, flip-chip type packages bare several reliability problems. The most critical issue among them is their electrical performance deterioration upon consecutive thermal cycles attributed to gradual delamination growth through chip and adhesive film interface induced by CTE mismatch driven shear and peel stresses. The electronic package in use is heated continuously by itself. When the crack at a weak site of the electronic package occurs, thermal deformationon the chip side is changed. Therefore, we can measure these micro deformations by using Moire interferometry and find out the crack length.

• 한국포장학회지
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• 제26권2호
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• pp.71-76
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• 2020

CO₂ concentration in kimchi package has emerged recently as a potential index of product ripening to be monitored or sensed in intelligent packaging. Considering that addition of CO₂ absorber into the flexible kimchi package changes behavior of its CO₂ concentration, ripening of kimchi in total acidity, package CO₂ concentration in partial pressure (P_CO2) and package volume at 10℃ were estimated by mathematical model for two size packages included with different CO₂ absorbers. In small size package containing 0.5 kg of kimchi, relatively less gas permeable low density polyethylene (LDPE) sachet of the absorber was found to give rise of P_CO2 linearly correlated with acidity at acceptable conditions of absorber amount and size. The levels of P_CO2 at optimum ripening were different with absorber amount. However, highly gas permeable microporous spunbonded film (Tyvek) sachet did not show the linear relationship except a condition of 1.5 g of CO₂ absorbent. In large size package containing 2.0 kg, absorber sachets of LDPE and Tyvek could give the linear relationship between product acidity and package P_CO2 but at different levels (P_CO2 of package with LDPE sachet: 0.46~0.79 bar, P_CO2 of package with Tyvek sachet: 0.00~0.75 bar). The P_CO2 at optimal ripening was found to be less variable with LDPE sachets than with Tyvek ones. Use of package CO₂ concentration as an indicator of kimchi ripening was shown to be possible on the limited conditions where the linear relationship between them is established or confirmed.

• 한국포장학회지
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• 제28권1호
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• pp.9-14
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• 2022

Packages of different atmospheres (air (control), 100% CO₂, vacuum, and vacuum + O₂ absorber) were prepared for 0.4 kg rice cake (ddukgukdduk) using gas-barrier plastic film and stored at 10℃ for 11 days. The stored products were evaluated in their packages atmosphere, total aerobic bacteria, yeast and molds, texture and sensory quality during storage period. In the air package, the O₂ concentration decreased from initial 21% to 16% on storage 4 days and the CO₂ concentration increased to 23% on storage of 11 days, which resulted from the growth of microorganisms. CO₂ concentration decreased from initial 98% to 36% on storage 11 days in the 100% CO₂ package. It is reasoned that CO₂ was dissolved into the product reducing the volume of the package. Vacuum and vacuum +O₂ absorber package maintained shrunk vacuum condition until 11 days of storage. Total aerobic bacteria count increased significantly in the control package (6.41 log (cfu/g) after 11 days) compared to the 100% CO₂ package (4.96 log (cfu/g) after 11 days). Yeast and molds were 6.66 in control package, 3.43 in 100% CO₂ package, 4.66 in vacuum package, and 3.78 in vacuum + O₂ absorber package after 11 days. There was no significant difference between control and the other treatments for the texture of the stored products. Sensory quality was the worst in control package on the storage of 8 days. All treatment groups except control improved the quality preservation, but vacuum and vacuum + O₂ absorber packages suffered from cracking of the product. Thus 100% CO₂ flushing is suggested as a desired packaging condition.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2002년도 하계학술대회 논문집
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• pp.32-35
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• 2002

The work focuses on the development of a Cu lead-frame with a single-sided adhesive tape for cost reduction and reliability improvement of LOC (lead on chip) package products, which are widely used for the plastic-encapsulation of memory chips. Most of memory chips are assembled by the LOC packaging process where the top surface of the chip is directly attached to the area of the lead-frame with a double-sided adhesive tape. However, since the lower adhesive layer of the double-sided adhesive tape reveals the disparity in the coefficient of thermal expansion from the silicon chip by more than 20 times, it often causes thermal displacement-induced damage of the IC pattern on the active chip surface during the reliability test. So, in order to solve these problems, in the resent work, the double-sided adhesive tape is replaced by a single-sided adhesive tape. The single-sided adhesive tape does net include the lower adhesive layer but instead, uses adhesive materials, which are filled in clear holes of the base film, just for the attachment of the lead-frame to the top surface of the memory chip. Since thermal expansion of the adhesive materials can be accommodated by the base film, memory product packaged using the lead-flame with the single-sided adhesive tape is shown to have much improved reliability. Author allied this invention to the Korea Patent Office for a patent (4-2000-00097-9).

• 전기학회논문지
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• 제56권12호
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• pp.2217-2220
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• 2007

In this paper, we propose a new wafer level package (WLP) for the RF MEMS applications. The Film Bulk Acoustic Resonator (FBAR) are fabricated and hermetically packaged in a new wafer level packaging process. With the use of Au-Sn eutectic bonding method, we bonded glass cap and FBAR device wafer which has groove-shaped via formed in the backside. The device wafer includes a electrical bonding pad and groove-shaped via for connecting to the external bonding pad on the device wafer backside and a peripheral pad placed around the perimeter of the device for bonding the glass wafer and device wafer. The glass cap prevents the device from being exposed and ensures excellent mechanical and environmental protection. The frequency characteristics show that the change of bandwidth and frequency shift before and after bonding is less than 0.5 MHz. Two packaged devices, Tx and Rx filters, are attached to a printed circuit board, wire bonded, and encapsulated in plastic to form the duplexer. We have designed and built a low-cost, high performance, duplexer based on the FBARs and presented the results of performance and reliability test.

• 전자공학회논문지A
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• 제32A권12호
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• pp.149-158
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• 1995

This paper describes the development of a software tool LCD FRAME that may guide the analyzing process for the electrical characteristics and the design procedure for constructing the thin film transistor liquid crystal display(TFT/LCD) packages. LCD FRAME can analyze its electrical characteristics from the TFT/LCD system package configuration, and provide the design variables to meet the user's requirements. These analysis and design procedure can be done in real time according to the model at simplified package level of TFT/LCD. LCD_FRAME is an object-oriented expert system which considers package elements as objects. With this LCD_FRAME software tool, we analyzed the I-V characteristics of a-Si TFT and its signal distortion which has maximum 1.58 $\mu$s delay along the panel scan line of the package containing 480 ${\times}$ 240 pixels. We designed the package structure of maximum 6.35 $\mu$s signal delays and 3360 ${\times}$ 780 pixels, and as a result we showed that the proper structure of 20 $\mu$m scan line width, 60$\mu$m panel TFT gate width and 8 $\mu$m gate length. This LCD_FRAME software tool provides results of the analysis and the design in the form of input files of the SPICE program, text data files, and graphic charts.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2003년도 International Symposium
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• pp.93-100
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• 2003

The continuing scaling trend in microelectronic circuit technology has a significant impact on the different IC interconnection and packaging technologies. These latter technologies have not kept pace with the IC scaling trends, resulting in a so-called“interconnect technology gap”. Multilayer thin film technology is proposed as a“bridge”- technology between the very high density IC technology and the coarse standard PCB technology. It is also a key enabling technology for the realisation of true“System-in-a-Package”(SIP) solutions, combining multiple“System-on-a-Chip”(SOC) IC's with other components and also integrating passive components in its layers. A further step is to use this technology to realise new functionalities on top of active wafers. These additional“above-IC”processed layers may e.g. be used for low loss, high speed on chip interconnects, clock distribution circuits, efficient power/ground distribution and to realize high Q inductors on chip.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2013년도 춘계학술대회 논문집
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• pp.1097-1098
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• 2013

• 한국버섯학회지
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• 제11권4호
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• pp.292-296
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• 2013

주요 수출버섯인 큰느타리버섯의 신선도유지에 적합한 포장량 및 포장재 산소투과도를 설정하기 위해 저온 저장기간 중 품질변화를 분석한 결과, 포장량 및 포장재 산소투과도에 따른 저장기간 중 중량감모율 변화는 차이없었으며, 갓신장율은 포장량 200 g일 경우 산소투과율이 높을수록 저장기간이 길수록 증가하였으나, 400 g 처리는 산소투과도 3,000 $cc/m^2$, 24 h, atm일 때 가장 낮았다. 포장재 내부의 $O_2$함량은 포장량이 적을수록 산소투과도가 낮을수록 높았으며, $CO_2$함량은 포장량이 많을수록 높았다. 종합적으로 포장량 400 g, 포장재 산소투과도 2,000 $cc/m^2$, 24 h, atm 이하에서 판매가능한 신선도가 35일까지 유지되어 저장기간이 가장 길었다.