• 제목/요약/키워드: package film

검색결과 258건 처리시간 0.032초

디지털 시네마 플랫폼 구축과 보안에 관한 연구 (A study on the implementation of Digital Cinema platform and its security system)

  • 김종안;김진한;김종흠
    • 한국정보통신설비학회:학술대회논문집
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    • 한국정보통신설비학회 2006년도 하계학술대회
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    • pp.82-86
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    • 2006
  • Film has been used widely since Auguste and Louis Lumiere hold the first private screening in 1895. Star Wars Episode II: Attack of the Clones directed by George Lucas released on May 16, was the first motion picture both to be shot completely on a high definition digital 24-frame system and to be projected by digital projectors. Its success showed us that the digital cinema era is imminent. Digital Cinema will enable the studios and movie distributors to low the expenses of making and delivering film prints and dissemination of it can put the entire digital cinema ecosystem in great jeopardy. Therefore DRM and other security policies are used for digital cinema content protection. In this paper it will be discussed how the digital cinema platform can package (encooe & encrypt), transport, and project the digital cinema contents safely.

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PCB 기판을 적용한 RF SAW 필터 개발 (Development of the RF SAW filters based on PCB substrate)

  • 이영진;임종인;이승희
    • 대한전자공학회:학술대회논문집
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    • 대한전자공학회 2006년도 하계종합학술대회
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    • pp.597-598
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    • 2006
  • This paper describes a development of a new $1.4{\times}1.1$ and $2.0{\times}1.4mm$ RF SAW filters made by PCB substrate instead of HTCC package, and this technology can reduce the cost of materials down to 40%. We have investigated the multi-layered PCB substrate structures and raw materials to find out the optimal flip-bonding condition between the $LiTaO_3$ wafer and PCB substrates. Also the optimal materials and processing conditions of epoxy laminating film were found out through the experiments which can reduce the bending moment caused by the difference of the thermal expansion between the PCB substrate and laminating film. The new PCB SAW filter shows good electrical and reliability performances with respect to the present SAW filters.

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임피던스 공진기를 이용한 FR-4 임베디드 광대역필터 (FR-4 Embedded UWB Filter using Uniform Impedance Resonator)

  • 양창수;윤상근;박재영
    • 전기학회논문지
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    • 제56권8호
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    • pp.1471-1475
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    • 2007
  • In this paper, a novel embedded ultra wideband (UWB) band-pass filter is presented on a FR-4 package substrate including high Dk resin coated copper (${\varepsilon}_r=30$) film. The proposed UWB filter is comprised of a parallel resonator with meander-type uniform impedance resonator (UIR) and two series resonators with high Q circular stacked spiral inductor and metal-insulator-metal (MIM) capacitor. In order to obtain excellent attenuation characteristics by generating attenuation poles in lower and upper stop bands, a single MIM capacitor is added to each resonator. The fabricated FR-4 embedded UWB filter has insertion loss of -1.0dB and return loss of -11dB, respectively. It has also extremely wide bandwidth (over 50%) and small size ($3.7{\times}4{\times}0.77\;mm^3$) which is compatible with LTCC devices.

DRAM기술의 최신 기술 동향 (Recent trend of DRAM technology)

  • 유병곤;백종태;유종선;유형준
    • E2M - 전기 전자와 첨단 소재
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    • 제8권5호
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    • pp.648-657
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    • 1995
  • 정보처리의 다양화, 고속화를 위하여 장래의 집적회로는 다량의 정보를 단시간에 처리하지 않으면 안된다. 종래, 3년에 4배의 고집적화가 실현되어 LSI개발에 기술 견인차의 역할을 하고 있는 DRAM(Dynamic Random Access Memory)은 미세화기술의 한계를 우려하면서도 오히려 개발에 박차를 가하고 있다. 이러한 DRAM의 미세, 대용량화에는 미세가공 기술, 새로운 메모리 셀과 트랜지스터 기술, 새로운 회로 기술, 그 이외에 재료박막기술, Computer aided design/Design automation(CAD/DA) 기술, 검사평가기술 혹은 소형팩키지(package)기술등의 광범위한 기술발전이 뒷받침되어 왔다. 그 중에서 미세가공 기술 및 새로운 트랜지스터 기술과 메모리 셀 기술을 중심으로 개발 동향을 살펴보고 최근에 발표된 1Gbit DRAM의 시제품 기술에 대하여 분석해 보기로 한다.

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진공포장한 육류제품의 열가공처리와 포장재질에 따른 저장중의 미생물성장 효과 (Effect of Thermal Processing and Packaging Materials on Microbial Growth of Vacuum Packaged a Meat Product during Storage)

  • 이종현
    • 한국포장학회지
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    • 제4권1호
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    • pp.33-40
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    • 1997
  • The microbial growth of fresh, vacuum packaged, cook-in-bag uncured beef patties was determined in two film structures, a commercial (PE/EVOH), and super barrier ($SiO_2$ coated polyester) material. Packaged samples were cooked to internal temperature of 71 and $82^{\circ}C$ for 30 minutes, and stored in temperature abused ($23{\pm}2^{\circ}C$) and refrigerated storage ($4-6^{\circ}C$). Barrier properties had a significant effect (p<0.001) on aerobic and mesophilic growth in the abused condition. Cooking temperatures had a statistically significant effect (p<0.05) on aerobic growth in the refrigerated condition. The growth of anaerobes and psychrophiles were not significantly effected by either variables. Storage times had the most significant effect (p<0.001) for all groups of microorganisms. The physical properties of the commercial film (strength, thickness, and shrinkage) were changed after exposure to thermal treatment, while the super barrier package had actually no change.

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기능성 무기물과 폴리올레핀계 수지의 정량적 혼합시스템에 의한 환경대응형 포장소재 개발 (Environment Corresponding Package by Quantitative Mixing System with Functional Inorganic Material and Polyolefin Resin)

  • 김희삼;임현주;박영미
    • 한국염색가공학회지
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    • 제21권1호
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    • pp.1-9
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    • 2009
  • A lot of research has been made over the recent decade to develop testing packages with antimicrobial properties to improve food safety. In this study, a new method, experimental device and technology for environmental corresponding packages of polypropylene (PP) film has been developed to provide effective temperature buffering during the transport/long-term storage of grains or foodstuffs from the supplier to the market. This quantitatively optimized mixing system enabled to produce PP films with the 700$\sim$1,400d (width;1.5$\sim$3mm, thickness;0.01$\sim$0.5mm). In the whole mixing systems, the finely-granulated inorganic illite and PP virgin chip for master batch (M/B) chip was calculated by digital measurement methods, and then the M/B chip for PP film was adapted through a air jet and PP grinding method. The prepared PP film was characterized with tensile strength and elongation, far infrared radiation (FIR) emissivity, antimicrobial activity and deodorization properties. The results revealed that the two differently grain-sized illite could be show homogeneously dispersed on PP chip surface, and as the increasing of illite content, the FIR emissivity and the anion emission rate of film was increasingly improved. In both of 325 and 1,500 mesh-sized illite contained PP chip, of course the antimicrobial activity was good. But the ultimate deodorization rate for ammonia gas of PP film were found to be approximately the same.

항균 세라믹 충전 LDPE필름의 김치 저장성 (Storage of Kimchi in LDPE Film Containg Antibiotic Ceramic)

  • 김광섭;강용구;김종대;은종방;박찬영
    • 한국식품과학회지
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    • 제30권4호
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    • pp.811-816
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    • 1998
  • 김치포장이 부풀지 않으면서 맛이 유지될수 있는 새로운 재질을 갖는 포장재를 개발하기 위해 식물 성장을 촉진시키는 생리활성능력과 항균력이 뛰어난 것으로 알려진 은처리한 소재를 LDPE필름에 충전하여 포장재를 만든후 김치를 포장하여 $20^{\circ}C$저장중 품질변화를 관찰하였다. 이 포장재는 이산화탄소가스와 에틸렌 투과도가 뛰어나 포장재를 부풀게 하지 않았으며 김치냄새방출도 은처리한 소재의 탈취효과로 인해 약간만 방출되었다. pH의 경우에는 김치맛이 가장좋은 $4.0{\sim}4.5$ 범위기간이 두배 이상 증가되었다. 젖산균의 수에 있어서도 미미하기는 하지만 LDPE의 경우보다 젖산균 성장이 지연됨을 보여주었다. 전체적인 평가로 판단해볼 때 은처리한 소재를 충전시킨 AC3O포장재가 LDPE포장재보다 김치저장특성이 뛰어나 김치맛이 상온에서 더 오랫동안 좋은 맛을 유지하였다.

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LTCC 내장형 미세 라인 인덕터 구현을 위한 감광성 Ag Paste 조성에 관한 연구 (Study on the Compositions of Photosensitive Ag Paste for Patterning Embedded Fine-Line Inductor in LTCC)

  • 이상명;박성대;유명재;이우성;강남기;남산
    • 한국세라믹학회지
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    • 제44권3호
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    • pp.157-161
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    • 2007
  • Line width under $100\;{\mu}m$ with good resolution is difficult to achieve using conventional thick-film process utilizing screen printing method. However combined with lithography technology finer line and space for miniaturization and highly integrated package is achievable. In this study, photosensitive Ag paste of optimum formulation used for thick film lithography technology was fabricated by various Ag powder, glass powder and additives. As the result, line width of $30\;{\mu}m$ with good definition and reduced mismatch during co-firing with LTCC substrate was acquired. Formulated Ag paste was used to pattern embedded fine line inductor with over 90% yield.

마이크로 패키지의 밀폐도 측정을 위한 정전용량형 폴리이미드 습도센서 (A Capacitive Type Humidity Sensor Using a Polyimide Film for Hermeticity Measurement of Micro Packages)

  • 김용호;김용준;김경일;김중현
    • 센서학회지
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    • 제13권4호
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    • pp.287-291
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    • 2004
  • A capacitive type humidity sensor has been fabricated using a polyimide film without hydrophobic elements and its characteristics has been evaluated for hermeticity measurement of micro packages. For a highly sensitive humidity sensor, a polyimide film without hydrophobic elements has been synthesized and used instead of using a commercial one in which 7 group elements such as fluorine or chlorine are included. Sensitivity, stability and hysteresis has been performed to characterize the fabricated sensors. The sensitivity defined as normalized percent capacitance change was 0.3751%RH and hysteresis was 0.77% in the range of 10%RH to 90%RH. Maximum deviation from the average capacitance measured for 120 minutes at 50%RH was 0.25%. The proposed humidity sensor can be used for hermeticity measurement of micro packages.

플라스틱 포장재의 잔존 인쇄 용제 감소 방안 (Study about decreasing methods of printing ink solvents residue amounts on plastic food package materials)

  • 안덕준;조훈일
    • 한국포장학회지
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    • 제10권1호
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    • pp.1-6
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    • 2004
  • Amount of residual ink solvent on the packaging materials from Korea, Japan and Europe was measured and compared. The amount of packaging materials from Korea was much higher than that of Japan and Europe. To reduce the residual amounts of ink solvent, aging condition of printed packaging materials including aging time and temperature was modified and evaluated. Aging with high temperature and short time ($60^{\circ}C$ and 24 hours) was more effective for reduction of residual amount of ink solvent than that with low temperature and long time. To find out change of reduction pattern of residual amount of solvent according to plastic packaging material, several monolayer and multilayer packaging materials were selected. Among the monolayer packaging materials, the amount of EVOH and PET was lower than that of polyolefin plastic film including PE and PP. PP/EVOH/PET among the selected multilayer film showed the lowest amount of residual ink solvent on food packaging materials. Result of this research revealed that the residual amount of ink solvent can be reduced by proper selection of aging condition with and by appropriate application of mutilayer plastic film.

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