• 한국체육학회지인문사회과학편
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• v.54 no.2
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• pp.285-297
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• 2015

This study aimed to research customer reward program factors of ski resorts in Korea through surveying the expert panel side and the customer side. This study conducted survey for 28 practicians that have been working for the department of customer reception of 6 different ski resorts all over the country and 7 faculties quited well-known in the academic circles. Delphi technique has been used to conduct survey customer reward program factors of the supplier side till the 3rd survey as the final. Based on this survey, an interview and a questionnaire survey have been used to conduct survey customer reward program factors that have been aware by the 50 customers, who have visited the ski resorts in 2014, and compared those two surveys above. In order to process the data, descriptive statistic analysis and Kendall W test have been utilized PASWWIN Ver. 18.0. The results were as follows: discount factor 8 articles, promotion factor 10 articles, package factor 5 articles, and convenience factor 6 articles have been produced as a good result.

• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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• v.12 no.1
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• pp.45-53
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• 2006

Thermal insulation is used in a variety of applications to protect temperature sensitive products from thermal damage. Several factors affect the performance of insulation packages. Among these factors, the thermal resistance of the insulating wall is the most important factor to determine the performance of the insulating package. In many cases, insulating wall consists of multi-layered structure and the heat transfer through this structure is a very complex process. In this study, an one-dimensional mathematical model, which includes all of the heat transfer principles covering conduction, convection and radiation in multi-layered structure, were developed. Based on this model, several heat transfer phenomena occurred in the air space between the layer of the insulating wall were investigated. From the simulation results, it was observed that the heat transfer through the air space between the layer were dominated by conduction and radiation and the low emissivity of the surface of each solid layer of the wall can dramatically increase the thermal resistance of the wall. For practical use, an equation was derived for the calculation of the thermal resistance of a multi-layered wall.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2005.10a
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• pp.882-884
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• 2005

A new rectangular shape microlens array having high sag for solid-state lighting is presented. Proposed microlens, which has high sag, over $375{\mu}m$ and large diameter, over 3 mm can enormously enhance output optical extraction efficiency. Rectangular shape of microlens can maximize the fill factor of light-emitting-diode (LED) package and minimize the optical loss at the same time. This wafer level microlens array is fabricated on LED package. It has many advantages in optical properties, low cost, high aligning accuracy, and mass production.

• Cartoon and Animation Studies
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• s.45
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• pp.283-298
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• 2016

Design is a fatal factor to differentiate and survive one product from the other in fierce competition of the market, when other conditions such as price or quality makes no much difference. Among many marketing tools, package design is known as a direct communication that visualizes and forms the very initial brand image of a product. Package design is not only for packing, transporting, storing and loading but for engraving the brand image in a consumers' mind and lead them to purchasing. One of recent package design trands is various ways of using character, not just as a printed image on the surface but as a part of three dimensional structure of package. If it succeed, the package design could give out the secondary fun and impact to the consumers. The package design with an effective character is itself a great marketing tool and valuable design asset, which can bring a further profit to the company. Especially, character-package can be a powerful and effective marketing method for various local products, in needs of further publication and sales with limited cost. It should motivate the sales of the products by grabbing their attention and taken as a souvenir. This research takes a character package as a useful marketing method for a local brand in Jeonju, South Korea, and tries to design a three dimensional package using its own character. Through the process, the research aims to propose an important design strategy for repositioning or enhancing an existing brand.

• The Proceeding of the Korean Institute of Electromagnetic Engineering and Science
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• v.24 no.2
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• pp.51-57
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• 2013

The current expanding mobile markets incessantly demands small form factor, low power consumption and high aggregate throughput for silicon-level integration such as memory to logic system. One of emerging solution for meeting this high market demand is 3D through silicon stacking (TSS) technology. Main challenges to bring 3D TSS technology to the volume production level are establishing a cost effective supply chain and building a reliable manufacturing processes. In addition, this technology inherently help increase number of IOs and shorten interconnect length. With those benefits, however, potential signal and power integrity risks are also elevated; increase in PDN inductance, channel loss on substrate, crosstalk and parasitic capacitance. This paper will report recent progress of wide IO memory to high count TSV logic device assembly development work. 28 nm node TSV test vehicles were fabricated by the foundry and assembled. Successful integration of memory wide IO chip with less than a millimeter package thickness form factor was achieved. For this successful integration, we discussed potential signal and power integrity challenges. This report demonstrated functional wide IO memory to 28 nm logic device assembly using 3D package architecture with such a thin form factor.

• THE INTERNATIONAL COMMERCE & LAW REVIEW
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• v.50
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• pp.277-308
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• 2011

Korea's economy has shown recovery since the global financial crisis in 2008. In the year 2010, Korea's export volume reached US D 467.4 billion and Korea is one of the main producer of IT equipment, electronics, ship-buildings, chemicals and automobiles. In particular, IT industry is one of the largest portion in Korea's export industries. The reason of the performance is that we develop innovative products to overseas markets and continued it. Also, there has been export support or promotion scheme in Korea. In this study, We need to evaluate the current system of export support and derive future challenges. This article has been studied to investigate relationship between export promotion and export performance. So, We classify export promotion program into 7 group(IT package, Market pioneers, Overseas exhibition, consultation invited buyers, International IT market research, Small Business IT export counseling center, Overseas marketing online) and the export performance was considered as the dependent variable. So the result are as follows. Factors on IT package, Market pioneers, overseas exhibition, International IT market research have been identified as influencing. and consultation invited buyers, Small Business IT export counseling center and Overseas marketing online have been identified as unimportant factor. So, We have to develop those Factors(IT package, Market pioneers, overseas exhibition, International IT market research) in the direction of strengthening the development of export support scheme.

• Preventive Nutrition and Food Science
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• v.16 no.4
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• pp.364-369
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• 2011

Levels of carbon dioxide gas, a metabolite of microbial growth, have been reported to parallel the onset of microbial spoilage and may be used as a convenient index for a packaged food's shelf life. This study aimed to establish a kinetic model of $CO_2$ production from perishable food for the potential use for shelf life control in the food supply chain. Aerobic bacterial count and package $CO_2$ concentration were measured during the storage of seasoned pork meat at four temperatures (0, 5, 10 and $15^{\circ}C$), and their interrelationship was investigated to establish a mathematical model. The microbial growth at constant temperature was described by using model of Baranyi and Roberts. $CO_2$ production from the stored food could be explained by taking care of its yield and maintenance factors linked to the microbial growth. By establishing the temperature dependence of the microbial growth and $CO_2$ yield factor, $CO_2$ partial pressure or concentration in package headspace could be estimated to a limited extent, which is helpful for controlling the shelf life under constant and dynamic temperature conditions. Application and efficacy of the model needs to be improved with further refinement in the model.

• Journal of Information Management
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• v.37 no.4
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• pp.49-67
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• 2006

The purpose of this study is to select factors that its impact on subscription of the package type e-journal in Korea. In order to accomplish this study, factors to select the package-type electronic journal are discussed through preceded research literatures, and presented the factors for subscription of the package-type electronic journal based on KESLI materials. As a result, ten evaluation categories and thirty-four evaluation factors are selected as e-journal evaluation elements.

• Applied Chemistry for Engineering
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• v.21 no.3
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• pp.258-264
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• 2010

Most of fluid systems, such as P&ID in ships, power plants, and chemical plants, consist of various components. The components such as bends, tees, sudden-expansions, sudden-contractions, and orifices contribute to overall pressure loss of the system. The local pressure losses across such components are determined using a pressure loss coefficient, k-factor, in lumped parameter models. In many engineering problems Idelchik's k-factor models have been used to estimate them. The present work compares the k-factor based on CFD calculation against Idelchik's model in order to confirm whether a commercial CFD package can be used for pressure loss coefficient estimation of complex geometries. The results show that RSM is the best appropriate for evaluating pressure loss coefficient. Commercial CFD package can be used as a tool evaluating k-factor even though the accuracy is influenced by a turbulence model.

• Journal of the Microelectronics and Packaging Society
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• v.19 no.2
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• pp.7-15
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• 2012

Semiconductor packages are increasingly moving toward miniaturization, lighter and multi-functions for mobile application, which requires highly integrated multi-stack package. To meet the industrial demand, the package and silicon chip become thinner, and ultra-thin packages will show serious reliability problems such as warpage, crack and other failures. These problems are mainly caused by the mismatch of various package materials and geometric dimensions. In this study we perform the numerical analysis of the warpage deformation and thermal stress of 4-layer stacked FBGA package after EMC molding and reflow process, respectively. After EMC molding and reflow process, the package exhibits the different warpage characteristics due to the temperature-dependent material properties. Key material properties which affect the warpage of package are investigated such as the elastic moduli and CTEs of EMC and PCB. It is found that CTE of EMC material is the dominant factor which controls the warpage. The results of RSM optimization of the material properties demonstrate that warpage can be reduced by $28{\mu}m$. As the silicon die becomes thinner, the maximum stress of each die is increased. In particular, the stress of the top die is substantially increased at the outer edge of the die. This stress concentration will lead to the failure of the package. Therefore, proper selection of package material and structural design are essential for the ultra-thin die packages.