• 대한기계학회논문집A
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• 제28권10호
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• pp.1590-1597
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• 2004

Three methods of design sensitivity analysis for structures such as numerical method, analytical method and semi-analytical method have been developed for the last three decades. Although analytical design sensitivity analysis can provide very exact result, it is difficult to implement into practical design problems. Therefore, numerical method such as finite difference method is widely used to simply obtain the design sensitivity in most cases. The numerical differentiation is sufficiently accurate and reliable fur most linear problems. However, it turns out that the numerical differentiation is inefficient and inaccurate in nonlinear design sensitivity analysis because its computational cost depends on the number of design variables and large numerical errors can be included. Thus the semi-analytical method is more suitable for complicated design problems. Moreover, semi-analytical method is easy to be performed in design procedure, which can be coupled with an analysis solver such as commercial finite element package. In this paper, implementation procedure fur the semi-analytical design sensitivity analysis outside of the commercial finite element package is studied and the computational technique is proposed for evaluating the partial differentiation of internal nodal force, so called pseudo-load. Numerical examples coupled with commercial finite element package are shown to verify usefulness of proposed semi-analytical sensitivity analysis procedure and computational technique for pseudo-load.

• 한국생산제조학회지
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• 제23권3호
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• pp.230-236
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• 2014

Wafer level package technology is added to the surface of wafer circuit packages to create a semiconductor technology that can minimize the size of the package. However, in conventional packaging, warpage and fracture are major concerns for semiconductor manufacturing. We optimized the wafer dam design using a finite element method according to the dam height and heat distribution thermal properties. The dam design influences the uniform deposition of the image sensor and prevents the filling material from overflowing. In this study, finite element analysis was employed to determine the key factors that may affect the reliability performance of the dam package. Three-dimensional finite element models were constructed using the simulation software ANSYS to perform the dam thermo-mechanical simulation and analysis.

• 제어로봇시스템학회:학술대회논문집
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• 제어로봇시스템학회 1996년도 한국자동제어학술회의논문집(국내학술편); 포항공과대학교, 포항; 24-26 Oct. 1996
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• pp.441-444
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• 1996

Object-oriented programming goes on increasing in many areas, as its advantages of flexibility and ease of maintenance have been recognized. As in usual programmings, the productivity and flexibility of CACSD package can be improved by adopting object-oriented programmin. This paper describes our efforts to implement an OO-CACSD(Object Oriented CACSD) package for control system design and simulation. Since the proposed OO-CACSD is based on the modularity, portability, reuseability, and matrix-oriented data structure, a control system can be not only modeled and simulated but also maintained easily.

• Journal of the Optical Society of Korea
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• 제3권2호
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• pp.74-79
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• 1999

We present a simple design rule for a passive temperature-compensating optical package. We also present experimentally that a package fabricated by using the design rule compensates the temperature dependence of the resonant wavelength of an optical long period fiber grating by varying the strain inside the fiber, The package fabricated in this work consists of two pieced of brass tube, 10 mm long, and a piece of nylon rod, 45.4 mm long. It is shown that the package can compensate the temperature-induce wavelength shifts of the long period grating to a range of 6.8 pm/$^{\circ}C$, compared with 0..48 nm/$^{\circ}C$ for an uncompensated grating. The reduced strength of the fiber caused by exposure to ultraviolet limits the performance of the package to the range operating temperature form -3 $^{\circ}C$ to 7$0^{\circ}C$.

• 유통과학연구
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• 제22권4호
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• pp.37-46
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• 2024

Purpose: Social media influencers (SMIs) have become significant sources of information influencing their followers' purchase intentions; few studies have been published on the effect of the number of followers and package tour prices on followers' purchase intention within the Vietnam travel industry utilizing naïve theories. This study examined the relationship between the number of followers and purchase intention and tested the moderating role of package tour price. Research Design, data and methodology: A 2 (number of followers: high vs. medium) × 2 (package tour price: high vs. low) between-subjects factorial design was used. 395 Vietnamese students (114 men, 281 women; M_age = 19.99, SD_age = 1.25) from Thuongmai University participated in the study. ANOVA and PROCESS MARCO were used to test hypotheses. Results: Findings indicate that participants show a higher purchase intention for SMIs with a higher number of followers than those with a medium one. When the package tour price is high, participants with a medium number of followers show a greater purchase intention than those with a high one. Conclusion: This recommendsthat tourism managers collaborate with SMIs with a high number of followers when the package tour price is low and with SMIs with medium ones when the package tour price is high.

• 한국콘텐츠학회논문지
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• 제7권4호
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• pp.259-267
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• 2007

상품판매의 주의를 끄는 일은 제일 먼저 시각을 통해 이루어지고 따라서 포장의 외관이 무엇보다도 중요한데 포장은 모든 시각적인 면, 즉 색채,로고, 문안, 특징적인 모양 및 기타 표현(디자인)의 특색을 모두 표현한다. 포장은 보는 사람으로 하여금 이러한 태도에 관한 가장 강력한 첫인상을 느끼게 한다. 본 논문은 상품을 지각하고 인지하는데 있어서 시지각 현상에 대한 객관적인 사항, 특히 소비자구매행동에 따른 이론적 배경과 실제 구매환경에 있어서의 소비자행동을 조사, 분석하였다. 소비자가 상품을 구매하는데 있어서 최초로 인지되거나 가장 크게 인지되는 자극체는 무엇이며 어떠한 요소들인지, 그러한 요소들은 어떠한 우선순위를 갖고 있는지를 분석하여 차후 디자인을 제작할 때에 참고할만한 지침이 되고자 하였다.

• 한국재료학회지
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• 제19권5호
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• pp.288-292
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• 2009

This article shows various factors that influence the thermal-cycling reliability of semiconductor devices utilizing the lead-on-chip (LOC) die attach technique. This work details how the modification of LOC package design as well as the back-grinding and dicing process of semiconductor wafers affect passivation reliability. This work shows that the design of an adhesion tape rather than a plastic package body can play a more important role in determining the passivation reliability. This is due to the fact that the thermal-expansion coefficient of the tape is larger than that of the plastic package body. Present tests also indicate that the ceramic fillers embedded in the plastic package body for mechanical strengthening are not helpful for the improvement of the passivation reliability. Even though the fillers can reduce the thermal-expansion of the plastic package body, microscopic examinations show that they can cause direct damage to the passivation layer. Furthermore, experimental results also illustrate that sawing-induced chipping resulting from the separation of a semiconductor wafer into individual devices might develop into passivation cracks during thermal-cycling. Thus, the proper design of the adhesion tape and the prevention of the sawing-induced chipping should be considered to enhance the passivation reliability in the semiconductor devices using the LOC die attach technique.

• 한국음향학회지
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• 제38권2호
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• pp.200-206
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• 2019

본 연구에서는 예인 음탐기용 음향패키지에 대한 수신전압감도 특성을 분석하기 위해 수치해석과 실험계획법을 적용하였다. 수치해석 결과는 초기 설계된 음향패키지의 구조 공진 모드 특성으로 인한 수신전압감도 변화를 보여준다. 수신전압감도 편차를 줄이기 위해 도출된 음향패키지 설계 변수의 영향은 실험계획법을 통해 분석하였다. 수신전압감도 편차는 수중청음기 쉴드캔 두께(t)의 변화에 가장 민감한 것을 확인하였다. 수조시험 결과 실험계획법에 의해 도출된 음향패키지는 수신전압감도 편차가 감소됨을 확인하였다.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2002년도 International Symposium
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• pp.219-225
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• 2002

This paper presents a novel "bumpless flip chip package"for cost! performance driven devices. Using the conventional electroplating and etching processes, this package enables the production of fine pitch BGA up to 256 I/O with single layer routing. An array of circuitry down to $25-50{\mu}{\textrm}{m}$ line/space is fabricated to fan-in and fan-out of the bond pads without using bumps or substrate. Various types of joint methods can be applied to connect the fine trace and the bond pad directly. The resin-filled terminal provides excellent compliancy between package and the assembled board. More interestingly, the thin film routing is similar to wafer level packaging whereas the fan-out feature enables high lead count devices to be accommodated in the BGA format. Details of the design concepts and processing technology for this novel package are discussed. Trade offs to meet various cost or performance goals for selected applications are suggested. Finally, the importance of design integration early in the technology development cycle with die-level and system-level design teams is highlighted as critical to an optimal design for performance and cost.

• 한국의상디자인학회지
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• 제13권4호
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• pp.153-165
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• 2011

The purpose of this study is to take into consideration the package products of wedding miniature dress. The method of the research was mainly focused on precedent research data and general references. Furthermore the data on wedding dresses was mainly collected from internet sites. Ai; reflection customer's demands, more personal and distinctive design was planned reflecting trend in the sector of wedding dress. The results of the research is the following. First, the first consideration for designing product in wedding miniature was designed with the focus on what consumers are easy to make and on brilliance when having made. 8 pairs for barbie miniature and 2 pairs for ball joints were designed. Among these things, it designed colorfully with 6 pairs for wedding dress and 4 pairs for shooting, which are used in the right size. Second, as a result of seeing consumers' response by up-loading totally 10 pieces of miniature clothes on wedding miniature. com site, and were the most popular products. The aim is to suggest package product based on these two works. The design-based pattern, the fabric of being used, lace material, beads, and several trimmings are offered to 2 wedding miniature package products. Consumers can make own collection with a handicraft-based feeling by using this.