• Electrical & Electronic Materials
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• v.10 no.6
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• pp.581-588
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• 1997

The ionization energy and degree of ionization for Si and Ge with boron doping are calculated. The hole mobilities are then calculated as a function of doping concentration using the relaxation time approximation. When the screening effect is taken into account, the reduction of ionization energy results in the increase of degree of ionization. As a result, the calculated Si mobility becomes closer to the experimental data, whereas the calculated Ge mobility is almost independent of the screening effect. The inclusion of the broadening effect in the mobility calculation overestimates the ionized impurity scattering. As compared with the experiment, the screening effect is not avoidable to calculate Si and Ge mobilities, and the broadening effect must accompany with the hopping process.

• Proceedings of the KIEE Conference
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• 2006.10a
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• pp.53-54
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• 2006

Arsenic doped p-type ZnO thin films have been realized on intrinsic (100) GaAs substrate by RF magnetron sputtering and thermal annealing treatment. p-Type ZnO exhibits the hole concentration of $9.684{\times}10^{19}cm^3$, resistivity of $2.54{\times}10^{-3}{\Omega}cm$, and mobility of $25.37\;cm^2/Vs$. Photoluminescence (PL) spectra of As doped p-type ZnO thin films reveal neutral acceptor bound exciton ($A^{0}X$) of 3.3437 eV and a transition between free electrons and acceptor levels (FA) of 3.2924 eV. Calculated acceptor binding energy ($E_A$) is about 0.1455 eV. Thermal activation and doping mechanism of this film have been suggested by using X-ray photoelectron spectroscopy (XPS). p-Type formation mechanism of As doped ZnO thin film is more related to the complex model, namely, $As_{Zn}-2V_{Zn}$, in which the As substitutes on the Zn site, rather than simple model, Aso, in which the As substitutes on the O site. ZnO-based p-n junction was fabricated by the deposition of an undoped n-type ZnO layer on an As doped p-type ZnO layer.

• Transactions on Electrical and Electronic Materials
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• v.2 no.4
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• pp.24-29
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• 2001

GaN films were grown for various Mg doping concentrations in metal-organic chemical vapor deposition. Below the Mg concentration of 10$^{19}$ ㎤, the thermally annealed sample shows the compensated phase to n-type GaN in Hall measurement. In the MB concentration of 4$\times$10$^{19}$ ㎤ corresponding to the hole carrier concentration of 2.6$\times$1$^{19}$ ㎤ there exists a photoluminescence center of the donor and the acceptor pair transition of the 3.28-eV band. This center is correlated with the defects for a shallow donor of the $V_{Ga}$ and for an acceptor of $Mg_{Ga}$ . The acceptor level shows the binding energy of 0.2-0.25 eV, which was observed by the photon energy of the photocurrent signal of 3.02-3.31 eV. Above the Mg concentration of 4$\times$10$^{19}$ ㎤, both the Mg doping level and Mg concentration were saturated and there Is a photoluminescence center of a deep donor and an acceptor pair transition of the 2.76-eV blue band.

• Proceedings of the Korean Vacuum Society Conference
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• 2016.02a
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• pp.399.1-399.1
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• 2016

p-type 반도체 물질로 알려진 $Cu_2O$에 Li 이온을 doping하면 Cu 이온 자리에 Li이온이 치환되어 p-type의 특성이 더욱 강하게 나타내는 것으로 알려져 있다. 이에 본 연구에서는 RF magnetron sputtering방법으로 성막한 p-type형 $Li:Cu_2O$박막의 특성을 연구하고 이를 $Li:Cu_2O-ZnO$ pn 접합 유연 나노제너레이터에 적용하였다. $Li:Cu_2O$ 성막시 $O_2$ 분압을 변수로 100nm 두께의 $Li:Cu_2O$ 박막을 성막하여 전기적, 광학적, 구조적, 표면 특성을 분석하였다. Hall measurement 측정 결과 $Li:Cu_2O$ 박막은 정공을 Major Carrier로 갖는 p-type 반도체임을 확인하였고, $O_2$의 분압이 증가할수록 Mobility 및 Carrier Concentration이 증가함을 확인하였다. 최적조건에서 광학적 투과도는 약 45%를 보였으며, 투과도를 통해 계산한 band gap은 약 2.03eV로써 일반적인 산화물 반도체의 작은 밴드갭을 가지고 있음을 알 수 있었다. 또한 Ellipsometer분석을 통해 $Ar:O_2$ 비가 $Li:Cu_2O$ 굴절률 및 흡광도에 미치는 영향을 연구하였으며, FE-SEM(Field Emission Scanning Electron Microscope)을 통해 표면을 분석하였다. 또한 XRD(X-ray diffractometer), TEM(Transmission Electron Microscope) 분석을 통하여 상온에서 성막한 $Li:Cu_2O$ 박막의 미세구조를 연구하였다. UPS(Ultraviolet Photoelectron Spectroscopy) 분석을 통해 일함수를 측정하였다. 이렇게 제작된 p 타입 $Li:Cu_2O$ 박막을 이용하여 $Li:Cu_2O-ZnO$ pn 접합을 구현하고 이를 이용해 유연 나노제너레이터를 제작하였다. 다양한 특성 분석을 통해p-type을 이용한 산화물 박막 기반 유연 나노 제너레이터 특성 향상 메커니즘을 제시하였다.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.24 no.3
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• pp.240-244
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• 2011

The high cost of crystalline silicon solar cells has been considered as one of the major obstacles to their terrestrial applications. Spin on doping (SOD) is presented as a useful process for the manufacturing of low cost solar cells. Phosphorus (P509) was used as an n-type emitters of solar cells. N-type emitters were formed on p-type EFG ribbon Si wafers by using a SOD at different spin speed (1,000~4,000 rpm), diffusion temperatures ($800^{\circ}C{\sim}950^{\circ}C$), and diffusion time (5~30 min) in $N_2+O_2$ atmosphere. With optimum condition, we were able to achieve cell efficiency of 14.1%.

• Proceedings of the Korean Vacuum Society Conference
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• 2014.02a
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• pp.287.2-287.2
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• 2014

PV (photovoltaic) has becoming an important industry to invest due to its high robustness and require very little maintenance which goes a long time. Solar cell fabrication involves a few critical processes such as doping to make the N-type and P-type silicon, contact metallization, surface texturization, and anti-reflection coatings. Anti-reflection coating is a kind of surface passivation which ensures the stability, and efficiency of the solar cell. Thus, I will focus on the changes happen to the solar cell due to the reflectance and anti-reflection coating by PC1D. By using the PC1D (solar cell simulation program), I would analysis the effect of reflectance on the N-type cell. At last I will conclude the result regarding what I learned throughout this experiment.

• The Transactions of the Korean Institute of Power Electronics
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• v.24 no.6
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• pp.411-418
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• 2019

Light-triggered thyristors (LTTs) are essential components in high-power applications, such as HVDC transmission and several pulsed-power applications. Generally, LTT fabrication includes a deep diffusion of aluminum as a p-type dopant to form a uniform p-base region, which needs careful concern for contamination and additional facilities in silicon semiconductor manufacturing factories. We fabricated 4-inch 5,000 V LTTs with boron implantation and diffusion process as a p-type dopant. The LTT contains a main cathode region, edge termination designed with a variation of lateral doping, breakover diode, integrated resistor, photosensitive area, and dV/dt protection region. The doping concentration of each region was adjusted with different doses of boron ion implantation. The fabricated LTTs showed good light triggering characteristics for a light pulse of 905 nm and a blocking voltage (V_DRM) of 6,500 V. They drove an average on-state current (I_TAVM) of 2,270 A, peak nonrepetitive surge current (I_TSM) of 61 kA, critical rate of rise of on-state current (di/dt) of 1,010 A/㎲, and limiting load integral (I²T) of 17 MA²s without damage to the device.

• Journal of the Korean Magnetics Society
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• v.16 no.1
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• pp.45-50
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• 2006

Oxygen-deficient anatase and rutile titanium dioxide $(TiO_{2-\delta})$ thin films were prepared by a sol-gel method and their structural, electronic, and magnetic properties were investigated. Both anatase and rutile $TiO_{2-\delta}:Fe$ Fe films exhibited ferromagnetism at room temperature for a limited range of Fe doping. For the same amount of Fe doping, the anatase sample exhibited a higher magnetic moment than the rutile one. Result of conversion electron Mossbauer spectroscopy measurements indicates that $Fe^{3+}$ ions substituting the octahedral $Ti^{4+}$ sites mainly contribute to the room-temperature ferromagnetism. Some of the anatase $TiO_{2-\delta}:Fe$ films exhibited p-type character but the observed feromagnetism turns out to be independent of the hole concentration. The room-temperature ferromagnetism can be explained in terms of a direct ferromagnetic coupling between two neighboring $Fe^{3+}$ ions via an electron trapped in oxygen vacancy in $TiO_{2-\delta}:Fe$.

• Journal of Korean Vacuum Science & Technology
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• v.6 no.3
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• pp.120-125
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• 2002

The aim of the present work is to optimized the annealing parameter in both front and back screen printed contacts realization on p-type multicrystalline silicon and with phosphorus diffused. The RTA treatments were carried out at various temperatures from 600 to 850$\^{C}$ and annealing time ranging from 3 min to 5 min in air, O$_2$and N$_2$ ambiance. The contacts parameters are obtained according to Transmission Line Model measurements. A good RTA cycle is obtained with a temperature plateau of 700$\^{C}$-750$\^{C}$ and annealing ambiance of air. Several processing parameters required for good cell efficiency are discussed with an emphasis placed on the critical role of the glass frit in the aluminum paste. A anamolus behaviour of Aluminum n-doping on p-type Si wafer, contact at high temperature have also been studied.

• Journal of the Korean Institute of Telematics and Electronics
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• v.16 no.5
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• pp.34-41
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• 1979

In the work reported here we have sputtered from silicon targets in argon-silane mixtures using undoped n-type and p-type targets. Doped films have been produced, but the doping efficiency is extremely low. It appears that the dopant atoms are able to satisfy their natural valencies and are therefore not electrically active. Infra-red absorption spectroscopy has been used to establish the hydrogen bonding in the films. No correlation has been found between the nature of the hydrogen bonding in the film and the electrical properties.