• 제목/요약/키워드: p-Type semiconductor

검색결과 420건 처리시간 0.027초

Formation of a thin nitrided GaAs layer

  • Park, Y.J.;Kim, S.I.;Kim, E.K.;Han, I.K.;Min, S.K.;O'Keeffe, P.;Mutoh, H.;Hirose, S.;Hara, K.;Munekata, H.;Kukimoto, H.
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 1996년도 제11회 학술발표회 논문개요집
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    • pp.40-41
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    • 1996
  • Nitridation technique has been receiving much attention for the formation of a thin nitrided buffer layer on which high quality nitride films can be formedl. Particularly, gallium nitride (GaN) has been considered as a promising material for blue-and ultraviolet-emitting devices. It can also be used for in situ formed and stable passivation layers for selective growth of $GaAs_2$. In this work, formation of a thin nitrided layer is investigated. Nitrogen electron cyclotron resonance(ECR)-plasma is employed for the formation of thin nitrided layer. The plasma source used in this work is a compact ECR plasma gun3 which is specifically designed to enhance control, and to provide in-situ monitoring of plasma parameters during plasma-assisted processing. Microwave power of 100-200 W was used to excite the plasma which was emitted from an orifice of 25 rnm in diameter. The substrate were positioned 15 em away from the orifice of plasma source. Prior to nitridation is performed, the surface of n-type (001)GaAs was exposed to hydrogen plasma for 20 min at $300{\;}^{\circ}C$ in order to eliminate a native oxide formed on GaAs surface. Change from ring to streak in RHEED pattern can be obtained through the irradiation of hydrogen plasma, indicating a clean surface. Nitridation was carried out for 5-40 min at $RT-600{\;}^{\circ}C$ in a ECR plasma-assisted molecular beam epitaxy system. Typical chamber pressure was $7.5{\times}lO^{-4}$ Torr during the nitridations at $N_2$ flow rate of 10 seem.(omitted)mitted)

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Hafnium Oxide Layer Based Metal-Oxide-Semiconductor (MOS) Capacitors with Annealing Temperature Variation

  • 이나영;최병덕
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 2016년도 제50회 동계 정기학술대회 초록집
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    • pp.318.1-318.1
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    • 2016
  • Hafnium Oxide (HfOx) has been attracted as a promising gate dielectric for replacing SiO2 in gate stack applications. In this paper, Metal-Oxide-Semiconductor (MOS) capacitor with solution processed HfO2 high-k material as a dielectric were fabricated. The solvent using $HfOCl2{\cdot}8H2O$ dissolve in 2-Methoxy ethanol was prepared at 0.3M. The HfOx layers were deposited on p-type silicon substrate by spin-coating at $250^{\circ}C$ for 5 minutes on a hot plate and repeated the same cycle for 5 times, followed by annealing process at 350, 450 and $550^{\circ}C$ for 2 hours. When the annealing temperature was increased from 350 to $550^{\circ}C$, capacitance value was increased from 337 to 367 pF. That was resulted from the higher temperature of HfOx which have more crystallization phase, therefore dielectric constant (k) was increased from 11 to 12. It leads to the formation of dense HfOx film and improve the ability of the insulator layer. We confirm that HfOx layer have a good performance for dielectric layer in MOS capacitors.

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Improvement of reliability of an ISFET pH-meter by employing multiple sensors

  • 장기석;조병욱;김창수;최상복;손병기
    • 센서학회지
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    • 제6권2호
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    • pp.131-136
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    • 1997
  • The ISFET(ion sensitive field effect transistor), a semiconductor ion sensor, has many advantages over conventional ion sensors. Various single-sensor type ISFET pH-meters have been developed. However, they could not be applied in fields because their performances are directly affected by the sensor condition. With only one sensor, the system could be easily damaged from environmental factors, and reliability of it is decreased. Therefore, a 4-channel PH-meter system is proposed to improve the reliability of ISFET pH-meter. It has 4 ISFETS as ion sensor, and a software which contains a new calibration and measurement algorithm appropriate to the system. The reliability of the system was proved by measuring hydrogen ion concentration in the pH standard solutions and buffer solutions.

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Fabrication and Characteristics of an InP Single HBT and Waveguide PD on Double Stacked Layers for an OEMMIC

  • Kim, Hong-Seung;Kim, Hye-Jin;Hong, Sun-Eui;Jung, Dong-Yun;Nam, Eun-Soo
    • ETRI Journal
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    • 제26권1호
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    • pp.61-64
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    • 2004
  • We have explored the fabrication of an InP/InGaAs single heterojunction bipolar transistor (HBT) and a wave guide p-i-n photodiode (PD) on two kinds of double stacked layers for the implementation of an optoelectronic millimeter-wave monolithic integrated circuit (OEMMIC). We applied a photosensitive polyimide for passivation and integration to overcome the large difference between the HBT and PD layers of around $3{\mu}m$. Our experiment showed that the RF characteristics of the HBT were dependent on the location of the PD layer, while the dc performances of the HBTs and PDs were independent of the type of stacked layer used. The $F_t$ and $F_{max}$ of the HBTs on the HBT/PD stacked layer were 10% lower than those of the HBTs on the PD/HBT stacked layer.

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A highly integrable p-GaN MSM photodetector with GaN n-channel MISFET for UV image sensor system

  • Lee, Heon-Bok;Hahm, Sung-Ho
    • 센서학회지
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    • 제17권5호
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    • pp.346-349
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    • 2008
  • A metal-semiconductor-metal (MSM) ultraviolet (UV) photodetector (PD) is proposed as an effective UV sensing device for integration with a GaN n-channel MISFET on auto-doped p-type GaN grown on a silicon substrate. Due to the high hole barrier of the metal-p-GaN contact, the dark current density of the fabricated MSM PD was less than $3\;nA/cm^2$ at a bias of up to 5 V. Meanwhile, the UV/visible rejection ratio was 400 and the cutoff wavelength of the spectral responsivity was 365 nm. However, the UV/visible ratio was limited by the sub-bandgap response, which was attributed to defectrelated deep traps in the p-GaN layer of the MSM PD. In conclusion, an MSM PD has a high process compatibility with the n-channel GaN Schottky barrier MISFET fabrication process and epitaxy on a silicon substrate.

Ultrafast and flexible UV photodetector based on NiO

  • Kim, Hong-sik;Patel, Malkeshkumar;Kim, Hyunki;Kim, Joondong
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 2016년도 제50회 동계 정기학술대회 초록집
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    • pp.389.2-389.2
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    • 2016
  • The flexible solid state device has been widely studied as portable and wearable device applications such as display, sensor and curved circuits. A zero-bias operation without any external power consumption is a highly-demanding feature of semiconductor devices, including optical communication, environment monitoring and digital imaging applications. Moreover, the flexibility of device would give the degree of freedom of transparent electronics. Functional and transparent abrupt p/n junction device has been realized by combining of p-type NiO and n-type ZnO metal oxide semiconductors. The use of a plastic polyethylene terephthalate (PET) film substrate spontaneously allows the flexible feature of the devices. The functional design of p-NiO/n-ZnO metal oxide device provides a high rectifying ratio of 189 to ensure the quality junction quality. This all transparent metal oxide device can be operated without external power supply. The flexible p-NiO/n-ZnO device exhibit substantial photodetection performances of quick response time of $68{\mu}s$. We may suggest an efficient design scheme of flexible and functional metal oxide-based transparent electronics.

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SOA 집적 XPM형 파장변환기 모듈 제작 및 특성 (Fabrication and characterization of XPM based wavelength converter module with monolithically integrated SOA's)

  • 김종회;김현수;심은덕;백용순;김강호;권오기;엄용성;윤호경;오광룡
    • 한국광학회지
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    • 제14권5호
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    • pp.509-514
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    • 2003
  • SOA(Semiconductor Optical Amplifier)를 단일 기판에 집적한 Mach-Zehnder 간섭계 구조의 파장변환기를 제작하여 40 nm 지역폭에 대한 10 Gb/s 파장변환 특성을 조사하였다. 제작된 파장변환기는 BRS(Buried Ridge Structure)형 SOA와 수동 도파로를 butt-joint결합하여 단일 집적한 구조이다. 집적화 과정에서 높은 도파 손실을 발생시키는 p+ InP덮개층을 제거하고 무첨가 InP로 도파로 덮개층 및 전류 차단층을 동시에 형성시키는 새로운 방법을 이용하였고, 모듈 제작에서 경사진 도파로와 광섬유를 효율적으로 광 접속하기 위하여 경사진 광섬유 배열을 제작하여 사용하였다. 이와 같이 제작된 파장변환기 모듈을 이용하여 1535-1575 nm의 40 nm 대역폭에서 1 ㏈ 이하의 power penalty를 갖는 10 Gb/s 파장변환을 구현하였고, 특히 negative penalty를 갖는 파장변환을 성공적으로 구현함으로써 2R(re-amplification, re-shaping) 기능을 제공할 수 있음을 보였다.

Improvement Performance of Graphene-MoS2 Barristor treated by 3-aminopropyltriethoxysilane (APTES)

  • 오애리;심재우;박진홍
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 2016년도 제50회 동계 정기학술대회 초록집
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    • pp.291.1-291.1
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    • 2016
  • Graphene by one of the two-dimensional (2D) materials has been focused on electronic applications due to its ultrahigh carrier mobility, outstanding thermal conductivity and superior optical properties. Although graphene has many remarkable properties, graphene devices have low on/off current ratio due to its zero bandgap. Despite considerable efforts to open its bandgap, it's hard to obtain appropriate improvements. To solve this problem, heterojunction barristor was proposed based on graphene. Mostly, this heterojunction barristor is made by transition metal dichalcogenides (TMDs), such as molybdenum disulfide ($MoS_2$) and tungsten diselenide ($WSe_2$), which have extremely thickness scalability of TMDs. The heterojunction barristor has the advantage of controlling graphene's Fermi level by applying gate bias, resulting in barrier height modulation between graphene interface and semiconductor. However, charged impurities between graphene and $SiO_2$ cause unexpected p-type doping of graphene. The graphene's Fermi level modulation is expected to be reduced due to this p-doping effect. Charged impurities make carrier mobility in graphene reduced and modulation of graphene's Fermi level limited. In this paper, we investigated theoretically and experimentally a relevance between graphene's Fermi level and p-type doping. Theoretically, when Fermi level is placed at the Dirac point, larger graphene's Fermi level modulation was calculated between -20 V and +20 V of $V_{GS}$. On the contrary, graphene's Fermi level modulation was 0.11 eV when Fermi level is far away from the Dirac point in the same range. Then, we produced two types heterojunction barristors which made by p-type doped graphene and graphene treated 2.4% APTES, respectively. On/off current ratio (32-fold) of graphene treated 2.4% APTES was improved in comparison with p-type doped graphene.

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수열합성법으로 합성된 산화구리 나노막대의 일산화질소 가스 감지 특성 (Nitrogen Monoxide Gas Sensing Properties of CuO Nanorods Synthesized by a Hydrothermal Method)

  • 박수정;김효진;김도진
    • 한국재료학회지
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    • 제24권1호
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    • pp.19-24
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    • 2014
  • We report the nitrogen monoxide (NO) gas sensing properties of p-type CuO-nanorod-based gas sensors. We synthesized the p-type CuO nanorods with breadth of about 30 nm and length of about 330 nm by a hydrothermal method using an as-deposited CuO seed layer prepared on a $Si/SiO_2$ substrate by the sputtering method. We fabricated polycrystalline CuO nanorod arrays at $80^{\circ}C$ under the hydrothermal condition of 1:1 morality ratio between copper nitrate trihydrate [$Cu(NO_2)_2{\cdot}3H_2O$] and hexamethylenetetramine ($C_6H_{12}N_4$). Structural characterizations revealed that we prepared the pure CuO nanorod array of a monoclinic crystalline structure without any obvious formation of secondary phase. It was found from the gas sensing measurements that the p-type CuO nanorod gas sensors exhibited a maximum sensitivity to NO gas in dry air at an operating temperature as low as $200^{\circ}C$. We also found that these CuO nanorod gas sensors showed reversible and reliable electrical response to NO gas at a range of operating temperatures. These results would indicate some potential applications of the p-type semiconductor CuO nanorods as promising sensing materials for gas sensors, including various types of p-n junction gas sensors.