• 제목/요약/키워드: out-of-plane stress

검색결과 329건 처리시간 0.025초

Delamination of non-linear viscoelastic beams under bending in the plane of layers

  • Victor I. Rizov
    • Coupled systems mechanics
    • /
    • 제12권4호
    • /
    • pp.297-313
    • /
    • 2023
  • This paper deals with delamination analysis of non-linear viscoelastic multilayered beam subjected to bending in the plane of the layers. For this purpose, first, a non-linear viscoelastic model is presented. In order to take into account the non-linear viscoelastic behaviour, a non-linear spring and a non-linear dashpot are assembled in series with a linear spring connected in parallel to a linear dashpot. The behaviours of the non-linear spring and dashpot are described by applying non-linear stress-strain and stress-rate of strain relationships, respectively. The constitutive law of the model is derived. Due to the non-linear spring and dashpot, the constitutive law is non-linear. This law is used for describing the time-dependent mechanical behaviour of the beam under consideration. The material properties involved in the constitutive law vary along the beam length due to the continuous material inhomogeneity of the layers. Solution of the strain energy release rate for the delamination is obtained by analyzing the balance of the energy with considering of the non-linear viscoelastic behaviour. The strain energy release rate is found also by using the complementary strain energy for verification. A parametric study is carried-out by using the solution obtained. The solutions derived and the results obtained help to understand the time-dependent delamination of non-linear viscoelastic beams under loading in the plane of layers.

나노압흔시 응력에 따른 결정립계거동의 분자역학모사 (MOLECULAR DYNAMICS SIMULATION OF STRESS INDUCED GRAIN BOUNDARY MIGRATION DURING NANOINDENTATION EXPERIMENTS)

  • 윤장혁;김성진;장호
    • 한국재료학회:학술대회논문집
    • /
    • 한국재료학회 2003년도 추계학술발표강연 및 논문개요집
    • /
    • pp.39-39
    • /
    • 2003
  • Molecular dynamics (MD) simulation was performed to study the stress induced grain boundary migration caused by the interaction of dislocations with a gain boundary. The simulation was carried out in a Ni block (295020 atoms) with a ∑ = 5 (210) grain boundary and an embedded atom potential for Ni was used for the MD calculation. Stress was provided by indenting a diamond indenter and the interaction between Ni surface and diamond indenter was assumed to have a fully repulsive force to emulate a faction free surface. Results showed that the indentation nucleated perfect dislocations and the dislocations produced stacking faults in the form of a parallelepiped tube. The parallelepiped tube consisted of two pairs of parallel dislocations with Shockley partials and was produced successively during the penetration of the indenter. The dislocations propagated along the parallelepiped slip planes and fully merged onto the ∑ = 5 (210) grain boundary without emitting a dislocation on the other grain. The interaction of the dislocations with the grain boundary induced the migration of the grain boundary plane in the direction normal to the boundary plane and the migration continued as long as the dislocations merged onto the grain boundary plane. The detailed mechanism of the conservative motion of atoms at the gram boundary was associated with the geometric feature of the ∑ = 5 (210) grain boundary.

  • PDF

줄눈 보강을 통한 면내 방향의 조적조 사인장 전단강도 평가 (Shear Strength Evaluation in Masonry Assemblages by Reinforcing Materials in Joint)

  • 우종훈;신경재;이준섭;한승윤
    • 대한건축학회논문집:구조계
    • /
    • 제35권9호
    • /
    • pp.191-198
    • /
    • 2019
  • All over the Republic of Korea, there are many masonry buildings which have been built since 1970s. When the earthquake at Po-Hang occurred, this is the main cause of huge damage because the masonry buildings have not seismic capacity. When masonry buildings are failed, two type of the failure modes can be shown, which are in-plane mode and out-plane mode. In-plane mode can have seismic capacity in masonry so diagonal shear test is performed in this study. The purpose of this study was to find the best way to reinforce the materials through the diagonal shear test. Through the test, shear stress and shear modulus of elasticity will be calculated, referred to the ASTM E 519-02. The variables in this test are ${\phi}3$ wire, three types of wire meshes, polypropylene strap and different types of brick. Each variable is applied to the same condition of the $1.2m{\times}1.2m$ masonry walls which are made by ASTM E 519-02. Compared to each variable with shear stress and shear modulus of elasticity, the best way of reinforcing method to have seismic capacity will be proved in this study.

Investigations on the bearing strength of stainless steel bolted plates under in-plane tension

  • Kiymaz, G.
    • Steel and Composite Structures
    • /
    • 제9권2호
    • /
    • pp.173-189
    • /
    • 2009
  • This paper presents a study on the behavior and design of bolted stainless steel plates under in-plane tension. Using an experimentally validated finite element (FE) program strength of stainless steel bolted plates under tension is examined with an emphasis on plate bearing mode of failure. A numerical parametric study was carried out which includes examining the behavior of stainless steel plate models with various proportions, bolt locations and in two different material grades. The models were designed to fail particularly in bolt tear-out and material piling-up modes. In the numerical simulation of the models, non-linear stress-strain material behavior of stainless steel was considered by using expressions which represent the full range of strains up to the ultimate tensile strain. Using the results of the parametric study, the effect of variations in bolt positions, such as end and edge distance and bolt pitch distance on bearing resistance of stainless steel bolted plates under in-plane tension has been investigated. Finally, the results obtained are critically examined using design estimations of the currently available international design guidance.

Inelastic lateral-distortional buckling of continuously restrained continuous beams

  • Lee, Dong-Sik
    • Steel and Composite Structures
    • /
    • 제5권4호
    • /
    • pp.305-326
    • /
    • 2005
  • The inelastic buckling behaviour of continuously restrained two and three-span continuous beams subjected to concentrated loads and uniformly distributed loads are studied in this paper. The restraint type considered in this paper is fully restrained against translation and elastic twist applied at the top flange. These types of restraints are most likely experienced in industrial structures, for example steel-concrete composite beams and half through girders. The buckling analysis of continuous beam consists of two parts, firstly the moment and shear distribution along the member are determined by employing force method and the information is then used for an out-of-plane buckling analysis. The finite element method is incorporated with so-called simplified and the polynomial pattern of residual stress. Owing to the inelastic response of the steel, both the in-plane and out-of-plane analysis, which is treated as being uncoupled, extend into the nonlinear range. This paper presents the results of inelastic lateral-torsional and lateral-distortional buckling load and finally conclusions are drawn regarding the web distortion.

섬유 체적분율을 고려한, 단일의 함유체를 포함한 무한고체에서의 탄성해석 (Elastic Analysis of an Unbounded Elastic Solid with an Inclusion Considering Composite Fiber Volume Fraction)

  • 이정기;한희덕
    • 대한기계학회논문집A
    • /
    • 제31권1호
    • /
    • pp.89-96
    • /
    • 2007
  • A volume integral equation method (VIEM) is applied for the effective analysis of plane elastostatic problems in unbounded solids containing single isotropic inclusion of two different shapes considering composite fiber volume fraction. Single cylindrical inclusion and single square cylindrical inclusion are considered in the composites with six different fiber volume fractions (0.25, 0.30, 0.35, 0.40, 0.45, 0.50). Using the rule of mixtures, the effective material properties are calculated according to the corresponding composite fiber volume fraction. The analysis of plane elastostatic problems in the unbounded effective material containing single fiber that covers an area corresponding to the composite fiber volume fraction in the bounded matrix material are carried out. Thus, single fiber, matrix material with a finite region, and the unbounded effective material are used in the VIEM models for the plane elastostatic analysis. A detailed analysis of stress field at the interface between the matrix and the inclusion is carried out for single cylindrical or square cylindrical inclusion. Next, the stress field is compared to that at the interface between the matrix and the single inclusion in unbounded isotropic matrix with single isotropic cylindrical or square cylindrical inclusion. This new method can also be applied to general two-dimensional elastodynamic and elastostatic problems with arbitrary shapes and number of inclusions. Through the analysis of plane elastostatic problems, it will be established that this new method is very accurate and effective for solving plane elastic problems in unbounded solids containing inclusions considering composite fiber volume fraction.

Reflection of plane waves from the boundary of a thermo-magneto-electroelastic solid half space

  • Singh, Baljeet;Singh, Aarti
    • Coupled systems mechanics
    • /
    • 제10권2호
    • /
    • pp.143-159
    • /
    • 2021
  • The theory of generalized thermo-magneto-electroelasticity is employed to obtain the plane wave solutions in an unbounded, homogeneous and transversely isotropic medium. Reflection phenomena of plane waves is considered at a stress free and thermally insulated surface. For incidence of a plane wave, the expressions of reflection coefficients and energy ratios for reflected waves are derived. To explore the characteristics of reflection coefficients and energy ratios, a quantitative example is set up. The half-space of the thermo-magneto-electroelastic medium is assumed to be made out of lithium niobate. The dependence of reflection coefficients and energy ratios on the angle of incidence is illustrated graphically for different values of electric, magnetic and thermal parameters.

용접변형의 고정도 예측을 위한 지배인자의 정당성 검증 (Verification of Validity of Governing Factors in High Accurate Prediction of Welding Distortion)

  • 이재익;장경호;김유철
    • Journal of Welding and Joining
    • /
    • 제31권5호
    • /
    • pp.7-14
    • /
    • 2013
  • The legitimacy of dominating factor in the high accuracy prediction of welding distortion was investigated for butt welding and fillet welding. When out-of-plane distortion was measured by the experiment objecting to butt welding, if tack welding was easily performed, the position of a neutral axis was variously changed by the irregularity. Then, there have been a case that out-of-plane distortion was generated in the unexpected direction. This case should be especially noted. New model for the experiment was proposed so as to solve this problem. As it was elucidated by the case of fillet welding, it was verified that the analysis should be carried out with satisfying the yield condition (especially at high temperature above 700 degree Celsius) and with closely simulating the penetration shape (heat input in weld metal) in order to solve the proposition that is the high accuracy prediction of welding distortion. It was confirmed that residual stress is highly predicted because welding distortion is highly predicted, too.

TSV 를 이용한 3 차원 적층 패키지의 본딩 공정에 의한 휨 현상 및 응력 해석 (Warpage and Stress Simulation of Bonding Process-Induced Deformation for 3D Package Using TSV Technology)

  • 이행수;김경호;좌성훈
    • 한국정밀공학회지
    • /
    • 제29권5호
    • /
    • pp.563-571
    • /
    • 2012
  • In 3D integration package using TSV technology, bonding is the core technology for stacking and interconnecting the chips or wafers. During bonding process, however, warpage and high stress are introduced, and will lead to the misalignment problem between two chips being bonded and failure of the chips. In this paper, a finite element approach is used to predict the warpages and stresses during the bonding process. In particular, in-plane deformation which directly affects the bonding misalignment is closely analyzed. Three types of bonding technology, which are Sn-Ag solder bonding, Cu-Cu direct bonding and SiO2 direct bonding, are compared. Numerical analysis indicates that warpage and stress are accumulated and become larger for each bonding step. In-plane deformation is much larger than out-of-plane deformation during bonding process. Cu-Cu bonding shows the largest warpage, while SiO2 direct bonding shows the smallest warpage. For stress, Sn-Ag solder bonding shows the largest stress, while Cu-Cu bonding shows the smallest. The stress is mainly concentrated at the interface between the via hole and silicon chip or via hole and bonding area. Misalignment induced during Cu-Cu and Sn-Ag solder bonding is equal to or larger than the size of via diameter, therefore should be reduced by lowering bonding temperature and proper selection of package materials.

Analysis on Short Crack Growth Rate after Single Overload under Cyclic Bending Moment

  • Song, Sam-Hong;Lee, Kyeong-Ro;Kim, Amkee
    • International Journal of Precision Engineering and Manufacturing
    • /
    • 제2권3호
    • /
    • pp.19-26
    • /
    • 2001
  • In order to investigate the effect of single tensile overload on the short crack growth behavior under the out-of-plane cyclic bending moment, crack opening stresses were continuously measured by an elastic compliance method using strain gages. The characteristics of short crack growth after the single tensile overload are analyzed by the effective stress range ratio. Futhermore, the investigation was carried out with respect to various fatigue crack growth behaviors such as the plastic zone size effect on crack retardation, the retarded crack length and the number of cycles.

  • PDF