• Journal of the Korean Wood Science and Technology
• /
• v.45 no.5
• /
• pp.580-587
• /
• 2017

Woodfiber insulation board can be considered as a one of the key material for low energy consumption, comfortable and safety construction of residential space because of its eco-friendly and high thermal insulation performance. This study was carried out to investigate the formaldehyde (HCHO) total volatile organic compounds (TVOC) emission properties and combustion shapes by flame test of low density fiberboards (LDFs) prepared with different adhesives. HCHO TVOC emission and combustion properties of LDFs prepared by melamine urea formaldehyde (MUF), phenol formaldehyde (PF), emulsified methylene diphenyl diisocyanate (eMDI) and latex resin adhesives were measured by desiccator method, 20 L chamber method, and flame test, respectively. As results, LDFs manufactured by MUF, eMDI and latex resin adhesives satisfied the Super $E_0$ grade of HCHO emission performance except PF resin. Furthermore, TVOC emission of all LDFs were satisfied the Korean indoor air quality standard (below $400{\mu}g/m^2{\cdot}h$). Especially, LDF with eMDI resin adhesive showed the lowest HCHO and TVOC emissivity, that $0.14mg/{\ell}$, $12{\mu}g/m^2{\cdot}h$, respectively. However, eMDI emitted the small amount ($3{\mu}g/m^2{\cdot}h$) of toluene in VOC components. In the flame test, LDF with MUF resin adhesives showed the most favorable shape after flame test compare to LDFs prepared other adhesives. Based on HCHO and TVOC emission, and combustion shapes, MUF resin adhesive may be recommended to prepare LDF for insulation purpose.

• Applied Chemistry for Engineering
• /
• v.10 no.4
• /
• pp.523-530
• /
• 1999

Acrylic pressure-sensitive adhesive has been made utilizing organic solvents, but nowadays it is made by solvent-free system due to environmental problems. In this study, emulsion polymerization were carried out at $40^{\circ}C$ with methacrylic acid(MAA), n-butyl acrylate(n-BA) and 2-ethylhexyl acrylate(2-EHA) as monomers in the presence of anionic(sodium dodecyl sulfate, SDS) and nonionic(ethylene oxide types) surfactant mixtures. The overall conversion of the polymerization reaction in a mixed surfactant system was found to be higher than that in a single surfactant system. Emulsion stability in mixed or anionic surfactant systems was found to be over 12 week, which was better than that in nonionic surfactant system. Emulsion particle size decreased as surfactant content increased. The Tg and molecular weight of emulsion polymer were inependent of the type, the amount and the mixing ratio of surfactant. Based on the results of stability and peel strength, the optimum nonionic surfactant ratio in total 4 g of surfactant mixture systems is found to be 40~60% by weight where the nonionic surfactant has 50 ethylene oxide groups and 16~18 carbon atoms in hydrophobic alkyl chain.

• Journal of the Korea Academia-Industrial cooperation Society
• /
• v.20 no.4
• /
• pp.503-509
• /
• 2019

The demand for smaller, faster, and multi-functional mobile devices in increasing at a rapidly increasing rate. In response to these trends, Stacked Chip Scale Package (SCSP) is used widely in the assembly industry. A film type adhesive called die attach film (DAF) is used widely for bonding chips in SCSP. The DAF requires high flowability at high die attachment temperatures for bonding chips on organic substrates, where the DAF needs to feel the gap depth, or for bonding the same sized dies, where the DAF needs to penetrate bonding wires. In this study, the mixture design of experiment (DOE) was performed for three raw materials to obtain the optimized DAF recipe for low elastic modulus at high temperature. Three components are acrylic polymer (SG-P3) and two solid epoxy resins (YD011 and YDCN500-1P) with different softening points. According to the DOE results, the elastic modulus at high temperature was influenced greatly by SG-P3. The elastic modulus at $100^{\circ}C$ decreased from 1.0 MPa to 0.2 MPa as the amount of SG-P3 was decreased by 20%. In contrast, the elastic modulus at room temperature was dominated by YD011, an epoxy with a higher softening point. The optimized DAF recipe showed approximately 98.4% pickup performance when a UV dicing tape was used. A DAF crack that occurred in curing was effectively suppressed through optimization of the cure accelerator amount and two-step cure schedule. The imizadole type accelerator showed better performance than the amine type accelerator.

• KSCE Journal of Civil and Environmental Engineering Research
• /
• v.12 no.1
• /
• pp.207-217
• /
• 1992

In this study, isolated and cultured nitrogen fixed microbes were seeded in the three-phase fluidized bed in which gas, solid and liquid were contacted directly. Input velocity was varied from 8.12 cm/hr to 16.32 cm/hr. And upflow gas pressure was fixed to 80 psi. Return ratios were from 0.2 to 0.6 with the each experimental condition. According to these condition, movement of media, growth of biofilm and removal efficiency were measured. As the results, in case of briquette ash, biofilm was developed to $170{\mu}m$ when velocity was 8.12 cm/hr and return ratio was 0.6. In this condition, COD removal efficiency was 97% and $NH_4$-N removal efficiency was 83%. At the same condition, biofilm thickness of glass bead was $17.59{\mu}m$ and its COD and $NH_4$-N removal efficiency was 83% and 72%. Nitrogen fixed microbes have following characters: it formed dark-brownish sludge, excellent adhesive force, easy solid-liquid separation and low oxygen uptake ratio, but sensitive to DO concentration. Not only it endured shock loading, but required short time to steady state.

• Journal of the Microelectronics and Packaging Society
• /
• v.11 no.1
• /
• pp.1-6
• /
• 2004

The requirements for harsh environment electronic controllers in automotive applications have been steadily becoming more and more stringent. Electronic substrate technologists have been responding to this challenge effectively in an effort to meet the performance, reliability and cost requirements. An effect of the plasma cleaning at the ECM(Engine Control Module) alumina substrate and the intermetallic compound layer between Sn-37wt%Pb solder and pad joints after reflow soldering has been studied. Organic residual carbon layer was removed by the substrate plasma cleaning. So the interfacial adhesive strength was enhanced. As a result of AFM measurement, conductor pad roughness were increased from 304 nm to 330 nm. $Cu_6/Sn_5$ formed during initial reflow process at the interface between TiWN/Cu pad and solder grew by the succeeding reflow process, so the grains became coarse. A cellular-shaped $Ag_3Sn$ was observed at the interface between Ag-Pd conductor pad and solder. The diameters of the $Ag_3Sn$ grains ranged from about 0.1∼0.6 $\mu\textrm{m}$. And a needle-shaped was also observed at the inside of the solder.

• Applied Chemistry for Engineering
• /
• v.17 no.1
• /
• pp.58-61
• /
• 2006

The object of this study was to develop an advanced method for fluid flow and oxygen transmission and increase adhesive property of microorganism to waste plastic vessel that was made of microorganism media. Through lab scale experiments, we found the optimum packed media volume rate and method, and when the optimum condition was applied to pilot plant, we confirmed possibility of advanced treatment. The sewage that was used in the test was the sewage disposal facility established in C and K elementary schools, which utilized waste plastic media oxidation engineering method. Analysis showed that removal efficiency of organic matter, SS, T-N and T-P was very high, that the sewage disposal facility maintained stability of treatment when changeable load of raw sewage flowed in.

• Corrosion Science and Technology
• /
• v.7 no.5
• /
• pp.269-273
• /
• 2008

It is known that the fluoric resin has the most outstanding properties in the extremely acidic environment of high temperature. However, this resin is the thermal hardening type that needs long time heat treatments above $250^{\circ}C$. It's impossible to use in situ in the extremely acidic environment such as a huge FGD ductworks or industrial chemical tanks. Furthermore, even the natural hardening type fluoric coatings which can be hardened less than $120^{\circ}C$ can not be applied to the highly acidic environmental plants because of its chemical resistance. In this study, new fluoric coatings that has excellent thermal resistance, chemical resistance and corrosion resistance has been developed in order to solve above problems and to be applied to the large plant structures in the field. These newly developed coatings are organic and inorganic composite type that have fluoric rubber(100 wt%), fluoric resin(5~50 wt%), oxalates(5~30 wt%), inorganic fillers mixed with plate-type and bulk-type solids(20~150 wt%), hardeners(0.5~5 wt%), and hardening hasteners(0.1~3 wt%). The best chemical and physical properties of these coatings are acquired by variation of adhesive reinforcement agents, dispersants, leveling agents. Mixing ratios of plate-type and bulk-type inorganic fillers influence the thermal properties, abrasive resistance and chemical infiltration properties of coatings. The mixing control is also very important to have homogeneous surface and removing inner voids of coatings.

• Journal of Adhesion and Interface
• /
• v.16 no.4
• /
• pp.156-161
• /
• 2015

In this study, waterborne polyurethane acrylate were synthesized with polyester polyol, 4,4-dicyclohexylmethane diisocyanate ($H_{12}MDI$), dimethylol propionic acid (DMPA), acrylate monomer to improve the properties and peel strength. In addition, the properties of the synthesized waterborne polyurethane acylate was evaluated through FT-IR, particle size analysis, UTM, peel strength. As the acrylic acid content increased, particle size increased. In the results of mechanical properties, when the acrylic acid contents increased, tensile strength was increased but elongation was decreased. All peel strength was improved as the acrylic acid contents of WPUA and acrylate ratio of PU/acrylate increased. Optimum peel strength obtained when acrylic acid was 0.5 wt%.

• Journal of the Korea Concrete Institute
• /
• v.19 no.5
• /
• pp.639-646
• /
• 2007

This study performed several tests for the durability of the concrete coated with nano synthesis ceramics which do not contain volatile organic compounds harmful to environment. The tests were adhesion test on dry and humid concrete, SEM test, MIP analysis, carbonation, chloride diffusion by electronic facilitation, freezing-thawing resistance, alkaline resistance, and brine resistance test. In the adhesion test on dry and humid concrete, nano synthesis ceramics coating produced the highest results among all the coatings tested. Nano synthesis ceramics adhered solidly on the concrete surface. The adhesive strength seemed to result from the hydrogen bond between nano synthesis ceramics which are inorganic and generated by hydrolysis and re-condensation reaction and the concrete's hydrates such as calcium silicate aluminate or calcium silicate hydrate. SEM test and MIP analysis results show surface structure with finest crevices pore in the nano synthesis ceramics coating applied concretes. In the carbonation, chloride diffusion, and freezing-thawing resistance tests, the concretes with nano synthesis ceramics coating indicated the best results. Based on these test results, further progress in application of nano synthesis ceramics coatings to various concrete structures including costal structures and sewerage arrangements can be expected.

• Journal of the Microelectronics and Packaging Society
• /
• v.20 no.3
• /
• pp.23-29
• /
• 2013

Development of flexible electronic devices has primarily focused on printing technology using organic materials. However, organic-based flexible electronics have several disadvantages, including low electrical performance and long-term reliability. Therefore, we fabricated nano- and micro-thick silicon film attached to the polymer substrate using transfer printing technology to investigate the feasibility of silicon-based flexible electronic devices with high performance and high flexibility. Flexibility of the fabricated samples was investigated using bending and stretching tests. The failure bending radius of the 200 nm-thick silicon film attached on a PI substrate was 4.5 mm, and the failure stretching strain was 1.8%. The failure bending radius of the micro-thick silicon film attached on a FPCB was 2 mm, and the failure strain was 3.5%, which showed superior flexibility compared with conventional silicon material. Improved flexibility was attributed to a buffering effect of the adhesive between the silicon film and the substrate. The superior flexibility of the thin silicon film demonstrates the possibility for flexible electronic devices with high performance.