• 제목/요약/키워드: optical chip

검색결과 371건 처리시간 0.024초

에노다이징 절연층과 반사컵 구조를 보유한 COB타입 LED BLU 광원구현 (Implementation of LED BLU Using Metal core PCB with Anodizing Oxide Layer and Reflection Cup Structure)

  • 조재현;이민수
    • 조명전기설비학회논문지
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    • 제23권8호
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    • pp.8-13
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    • 2009
  • LED 광원 기술의 발전과 더불어 응용분야도 다양하게 넓어지고 있다. 이중 본 논문에서는 액정 후면 배광 장치와 같이 고성능의 광원이 요구되는 응용제품에 적합한 광원을 제작하였다. 논문에서 제안한 광원은 금속산화물 절연층을 이용하여 LED chip에서 발생한 열을 효율적으로 외부로 전달하는 구조를 적용하였으며 패키지 구조가 아닌 chip과의 접촉면에 반사컵 구조를 적용하여 배광 분포 제어와 광자 재흡수 특성을 개선하였다.

Numerical Investigation of Purcell Enhancement of the Internal Quantum Efficiency of GaN-based Green LED Structures

  • Choi, Young-Hwan;Ryu, Guen-Hwan;Ryu, Han-Youl
    • Current Optics and Photonics
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    • 제1권6호
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    • pp.626-630
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    • 2017
  • GaN-based green light-emitting diode (LED) structures suffer from low internal quantum efficiency (IQE), known as the "green gap" problem. The IQE of LED structures is expected to be improved to some extent by exploiting the Purcell effect. In this study, the Purcell effect on the IQE of green LED structures is investigated numerically using a finite-difference time-domain simulation. The Purcell factor of flip-chip LED structures is found to be more than three times as high as that of epi-up LED structures, which is attributed to the high-reflectance mirror near the active region in the flip-chip LED structures. When the unmodified IQE is 20%, the relative enhancement of IQE can be greater than 50%, without utilizing the surface-plasmon coupling effect. Based on the simulation results, the "green gap" problem of GaN-based green LEDs is expected to be mitigated significantly by optimizing flip-chip LED structures to maximize the Purcell effect.

One-Chip 마이크로프로세서를 이용한 Nd:YAG 레이저의 반복율 및 펄스폭제어 (The Repetition rate and Pulse-width control of Nd:YAG laser using One-Chip Microprocessor)

  • 홍정환;정영환;양동민;김휘영;김희제
    • 대한전기학회:학술대회논문집
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    • 대한전기학회 1998년도 하계학술대회 논문집 E
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    • pp.1696-1698
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    • 1998
  • Pulsed Nd:YAG laser using Nd:YAG crystal operates stably in the thermal conductivity, mechanical, optical condition. That is used broadly in material processings because of easy reaction to the materials, and the maintenance is very easy because of lamp excitation. In these material processings, power dinsity control is very important to improve processing technology. Power density is controled by inductance and capacitance or repetition rate. Therefore we are going to control laser power density as One-Chip Microprocessor(PIC16C55) and 8051. We have been experimented at the pulse repetition rate range of 10pps to 60pps(pulse per second).

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집적화된 Lab-On-a Chip을 위한 광센서의 제작 및 특성 평가 (Development of Photo-sensor for Integrated Lab-On-a-Chip)

  • 김주환;신경식;김용국;김태송;김상식;주병권
    • 한국전기전자재료학회논문지
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    • 제17권4호
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    • pp.404-409
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    • 2004
  • We fabricated photo-sensor for fluorescence detection in LOC. LOC is high throughput screening system. Our LOC screens biochemical reaction of protein using the immunoassay, and converts biochemical reaction into electrical signal using LIF(Laser Induced Fluorescence) detection method. Protein is labeled with rhodamine intercalating dye and finger PIN photodiode is used as photo-sensor We measured fluorescence emission of rhodamine dye and analyzed tendency of fluorescence detection, according to photo-sensor size, light intensity, and rhodamine concentration. Detection current was almost linearly proportional to two parameters, intensity and concentration, and was inversely proportional to photo-sensor size. Integrated LOC consists of optical-filter deposited photo-sensor and PDMS microchannel detected 50 (pg/${mu}ell$) rhodamine. For integrated LOC including light source, we used green LED as the light source and measured emitted fluorescence.

A One-Kilobit PQR-CMOS Smart Pixel Array

  • Lim, Kwon-Seob;Kim, Jung-Yeon;Kim, Sang-Kyeom;Park, Byeong-Hoon;Kwon, O'Dae
    • ETRI Journal
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    • 제26권1호
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    • pp.1-6
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    • 2004
  • The photonic quantum ring (PQR) laser is a three dimensional whispering gallery (WG) mode laser and has anomalous quantum wire properties, such as microampere to nanoampere range threshold currents and ${\sqrt{T}}$-dependent thermal red shifts. We observed uniform bottom emissions from a 1-kb smart pixel chip of a $32{\times}32$ InGaAs PQR laser array flip-chip bonded to a 0.35 ${\mu}m$ CMOS-based PQR laser driver. The PQR-CMOS smart pixel array, now operating at 30 MHz, will be improved to the GHz frequency range through device and circuit optimization.

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3-Component RGB chip으로 구성된 LED 전구의 광학적 설계 (Optical design of an LED lamp composed of 3-Component RGB chips)

  • 강석훈;송상빈;권용석;여인선
    • 대한전기학회:학술대회논문집
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    • 대한전기학회 2002년도 추계학술대회 논문집 전기물성,응용부문
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    • pp.197-199
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    • 2002
  • This paper describes the effects of chip arrangement configurations and the dimension of a reflecting cup upon the light output characteristics of a white lamp composed of RGB LED chips. As a result of simulation, the shorter distance between adjacent chips leads to a relative decrease in the light output efficiency due to inter-chip absorption of quanta, but rather uniform color mixing is expected. Among the factors of designing a reflecting cup it is the tilt angle of the cup wall that plays a determining role upon the variation of the light distribution. The light distribution shows a sudden change of pattern from Lambertian to Batwing at about $35^{\circ}{\sim}40^{\circ}$ of tilt angle in case of a silver-coated wall cup.

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백색 발광다이오드의 특성에 대한 황색 형광체의 영향 (Effect of Yellow Phosphor on Characteristics of White Light Emitting Diode)

  • 장호정;손창식;허재성
    • 한국표면공학회지
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    • 제40권2호
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    • pp.103-106
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    • 2007
  • We have investigated the optical and electrical properties of surface mounted white light emitting diode (LED) chips prepared by using yellow phosphors on the blue LED chip. The yellow phosphor mixed with transparent epoxy was coated on the prepared LED chip. The optimum mixing conditions with epoxy and yellow phosphor is obtained at the mixing ratio of epoxy:yellow phosphor = 97:3 wt%. The maximum luminance and light emitting efficiency are above $80,000cd/m^2$ and 23.2 lm/W, respectively, at the bias voltage of 2.9 V. There was no distinct change in the luminance strength with changing of the yellow phosphor ratios. The current of the white LED chip is about 30 mA at 2.9 V.

Investigation of smart multifunctional optical sensor platform and its application in optical sensor networks

  • Pang, C.;Yu, M.;Gupta, A.K.;Bryden, K.M.
    • Smart Structures and Systems
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    • 제12권1호
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    • pp.23-39
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    • 2013
  • In this article, a smart multifunctional optical system-on-a-chip (SOC) sensor platform is presented and its application for fiber Bragg grating (FBG) sensor interrogation in optical sensor networks is investigated. The smart SOC sensor platform consists of a superluminescent diode as a broadband source, a tunable microelectromechanical system (MEMS) based Fabry-P$\acute{e}$rot filter, photodetectors, and an integrated microcontroller for data acquisition, processing, and communication. Integrated with a wireless sensor network (WSN) module in a compact package, a smart optical sensor node is developed. The smart multifunctional sensor platform has the capability of interrogating different types of optical fiber sensors, including Fabry-P$\acute{e}$rot sensors and Bragg grating sensors. As a case study, the smart optical sensor platform is demonstrated to interrogate multiplexed FBG strain sensors. A time domain signal processing method is used to obtain the Bragg wavelength shift of two FBG strain sensors through sweeping the MEMS tunable Fabry-P$\acute{e}$rot filter. A tuning range of 46 nm and a tuning speed of 10 Hz are achieved. The smart optical sensor platform will open doors to many applications that require high performance optical WSNs.

Gate CD Control for memory Chip using Total Process Proximity Based Correction Method

  • Nam, Byung--Ho;Lee, Hyung-J.
    • Journal of the Optical Society of Korea
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    • 제6권4호
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    • pp.180-184
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    • 2002
  • In this study, we investigated mask errors, photo errors with attenuated phase shift mask and off-axis illumination, and etch errors in dry etch conditions. We propose that total process proximity correction (TPPC), a concept merging every process step error correction, is essential in a lithography process when minimum critical dimension (CD) is smaller than the wavelength of radiation. A correction rule table was experimentally obtained applying TPPC concept. Process capability of controlling gate CD in DRAM fabrication should be improved by this method.

거친 가공표면 형상의 고정밀 측정법 개발 (Precision Profile Measurement on Roughly Processed Surfaces)

  • 김병창;이세한
    • 한국기계가공학회지
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    • 제7권1호
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    • pp.47-52
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    • 2008
  • We present a 3-D profiler specially devised for the profile measurement of rough surfaces that are difficult to be measured with conventional non-contact interferometer. The profiler comprises multiple two-point-diffraction sources made of single-mode optical fibers. Test measurement proves that the proposed profiler is well suited for the warpage inspection of microelectronics components with rough surface, such as unpolished backsides of silicon wafers and plastic molds of integrated-circuit chip package.

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