• Journal of Sensor Science and Technology
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• v.19 no.6
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• pp.483-489
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• 2010

Display quality depends on panel temperatures. To compensate it, temperature sensor was integrated on the panel. The conventional temperature sensor integrated on the panel needs external reference resistor. Since the resistance of external resistor can vary according to the variation of the environment temperature, the conventional temperature sensor can make error in temperature sensing. The environmental temperatures can change by the back light unit, driving circuits or chips. In this paper, we proposed a integrated temperature sensor on display panel which does not need external reference resister. Instead of external reference resistor, we used two materials which have different temperature coefficient in resistivity. They are connected serially and the output voltage was measured at the point of connection with the applied voltage to both ends. The proposed sensor was fabricated with indium tin oxide(ITO), and Mo metal electrode temperature sensor which were connected serially. We verified the temperature senor by the measurements of sensitivity, lineality, hysteresis, repeatability, stability, and accuracy.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2004.11a
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• pp.81-84
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• 2004

The NiCr is an important material for present thin-film resistor application owing to its low TCR and thermal stability. In this work, the NiCr thin films were deposited on coming glass substrate by reactive magnetron sputtering and the annealing at temperatures range from 300 to $500^{\circ}C$ for 20 min in vacuum. X-ray, AFM, $R_s$(surface leakage current) have been used to study the structural and electrical properties of the NiCr thin films. The high precision NiCr thin films resistor with TCR(temperature coefficient of resistance) of less then $10\;ppm/^{\circ}C$ was obtained under in in-situ annealing at $300^{\circ}C$ on Cr buffer layer substrate. It is clear that the NiCr thin-films resistor electrical properties are low TCR related with it's annealing and buffer layer condition. NiCr thin film resistor having a good thermal stability and low TCR properties are expected for the application to the dielectric material of passive component.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.30 no.1
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• pp.59-62
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• 2017

CNT (carbon nanotube) resistors with low resistance and negative TCR (temperature coefficient of resistance) were fabricated with yarned CNT (carbon nanotube) fibers. The CNT fibers were prepared by yarning CNTs grown on the silicone substrate by CVD (chemical vapor deposition) method. The CNT resistors were fabricated by winding CNT fibers on the surface of ceramic rod. Both metal terminals were connected with the CNT fiber wound on the ceramic rod. We measured electrical resistance and thermal stability with the number of CNT fibers wound. The CNT resistor system shows linearly decreased resistance with the number of CNTs wound on the ceramic rod and saturated at 20 strands. The CNT resistor system has negative TCR between $-1,000{\sim}-2,000ppm/^{\circ}C$ and stable frequency properties under 100 kHz.

• Proceedings of the KIEE Conference
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• summer
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• pp.1275-1277
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• 2004

In this paper, we propose a new diagnosis method of DC/DC converter aging. The method is based on the variations of parasitic resistor for the aging process. We apply an on-line diagnosis of DC/DC converter because the observation is not a device, but a system. This study proposes a method of DC/DC converter diagnosis by analyzing the variations of model on the variations of parasitic resistor.

• Proceedings of the KIEE Conference
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• 2007.11a
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• pp.98-99
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• 2007

This study has successfully demonstrated the direct fabrication of polymer resistors using ink-jet printing technology as an alternative patterning to traditional photolithography. The polymer resistors were fabricated just by two layer processes using a ink-jet printer (DMP-2800, Fujifilm Dimatix). First, resistive materials was patterned by a ink-jet printing with the desired width and length. Next, resistor fabrication was completed by printing metal contact pads on the both sides of the polymer resistor. We used poly (3,4-ethylene dioxythiophene) poly(styrenesulfonate)(PEDOT:PSS) for the resistor material and a nano-sized silver colloid for the metal contact pads. We characterized the electrical properties of PEDOT:PSS by measuring sheet resistance and specific resistance on a glass substrate. From analysis of the measured resistances, the electrical resistances of the polymer resistors linearly increased as a function of printed width and length of resistors. The accuracy of the fabricated polymer resistor showed about $0.6{\sim}2.5%$ error for the same dimensions.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.35 no.7
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• pp.799-804
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• 2011

A thermal cycling test was conducted on a chip resistor solder joint with real-time failure monitoring. In order to study the failure mechanism of the chip resistor solder joint during the test, the resistance between both ends of the resistor was monitored until the occurrence of failure. It was observed that the monitored resistance first fluctuated linearly according to the temperature change. The initial variation in the resistance occurred at the time during the cycle when there was a decrease in temperature. A more significant change in the resistance followed after a certain number of cycles, during the time when there was an increase in the temperature. In order to explain the failure patterns of the solder joint, a mechanism for the solder failure was suggested, and its validity was proved through FE simulations. Based on the explained failure mechanism, it was shown that prognostics for the solder failure can be implemented by monitoring the resistance change in a thermal cycle condition.

• Journal of the Microelectronics and Packaging Society
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• v.15 no.1
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• pp.27-31
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• 2008

Due to the increasing need for miniaturization of electronic device, embedded resistor technology using thick film resistance paste to embed resistors currently mounted on the board thus effectively reducing board size, is being extensively researched. In this research, thick film resistor paste having $0.35{\sim}4k{\Omega}/sq$ range of resistivity were fabricated using mixtures of carbon black and epoxy resin. In order to adjust the TCR (temperature coefficient resistivity), TCR modifiers such as Ni-Cr alloy, $SiO_2$ powder were added and were able to improve on TCR value with $100ppm/^{\circ}C$. Finally embedded resistor board using thick film resistance paste were fabricated. Stable resistivity value and reliability results were achieved.

• Progress in Superconductivity and Cryogenics
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• v.6 no.1
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• pp.48-52
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• 2004

Breakdown characteristics of insulator-liquid nitrogen ($LN_2$) composite insulation for resistor type High $T_c$/ superconducting fault current limiter (HTSFCL) under ac and impulse voltage in $LN_2$ has been studied using model electrode systems. Electrodes for model electrode systems were made of SUS 304 contacted fiberglass reinforced plastic (FRP) and Au coated sapphire. The breakdown characteristics of model electrode systems were investigated experimentally for FRP thickness ranging from 1 mm to 5 mm. surface distance ranging from 2.5 mm to 7 mm and electrode gap ranging from 1 to 5 mm. The experimental data suggested that the breakdown voltage of model electrode systems in $LN_2$ is highly dependent on the surface distance, electrode gap as well as on the FRP thickness. Also, we had observed discharge traces and puncture due to high-voltage 60-Hz AC stress.

• Journal of the Korean Ceramic Society
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• v.12 no.1
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• pp.5-11
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• 1975

Thick film resistor paste was made utilizing oxide materials such as SnO, SnO＋Sb2O3, and SnO＋Zn. The oxide materials were mixed respectively with Q-12 glass powder and finally suspended in ethyl cellulose dissolved in ethyl cellosolve. Thick film resistor was made by screen printing the paste on the alumina substrate and firing it at a suitable temperature. Among thick films made from the resistor paste, the thick film containing 85% SnO and fired at $600^{\circ}C$ demonstrated the finest electrical properties showing 10 K ohm in sheet resistance, 110 ppm/$^{\circ}C$ in TCR. In general, TCR of the thick films made from the oxide-mixture paste is good in linearity, therefore it is suggested the oxide-mixture paste is utilized as the negative thermistor.

• International Journal of Computer Science & Network Security
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• v.23 no.7
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• pp.23-31
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• 2023

This article discusses the sabotage of loops of intruder alarm systems. Although loop alarm systems are now gradually being replaced by digital alarm systems, they are still significantly present in practice. This paper describes two experimentally verified techniques for sabotaging balanced loops. The first technique is based on the jump replacement of the balancing resistor by a fake resistor. The second technique is based on inserting a series-parallel combination of two rheostats into the loop. By alternately changing the resistance of these rheostats, a state is reached where the balancing resistor is shorted by the parallel rheostat and replaced by the series rheostat. Sabotage devices for both attacks are technically simple and inexpensive, so they can be made and used by an amateur. Owners of loop alarm systems should become find out about this threat.