• 제목/요약/키워드: on-board equipment

검색결과 326건 처리시간 0.023초

발사체 탑재물 페어링 내부 공기 공급을 위한 탑재 시스템 유동 해석 (FLOW ANALYSIS OF THE ON-BOARD SYSTEM FOR THE AIR SUPPLY TO THE PAYLOAD FAIRING OF A LAUNCH VEHICLE)

  • 옥호남;김영훈;김인선
    • 한국전산유체공학회:학술대회논문집
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    • 한국전산유체공학회 2005년도 추계 학술대회논문집
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    • pp.269-273
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    • 2005
  • The on-board system for the air supply to the payload fairing(PLF) of a launch vehicle using both high and low pressure air was designed. The design concept was obtained from the CFD analysis of a Russian interstage air supply system, and a collector was adopted to expand the high pressure air. To verify that the on-board system would work as designed, a simplified axisymmetric computational model was made and a CFD analysis was also performed. It was found that the flow ejected from the hole of the collector expands to the Mach number of 4 and is soon retarded due to the action of viscosity. It was also found that a small gap between the low pressure duct and equipment bay wall can cause large velocity in PLF over the velocity requirement and no gap should be allowed in the design.

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LED 전광판용 SMPS의 고조파 특성에 관한 연구 (A Study on the Harmonic Characteristics of SMPS Load in LED Display Board)

  • 박준열;고만석;장래창;최홍규
    • 조명전기설비학회논문지
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    • 제27권9호
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    • pp.36-43
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    • 2013
  • The prevalence of electronic devices in our modern life is accompanied with the generation of harmonics caused by the nonlinear characteristic load. Especially, the employment of LED have brought the rapid use of SMPS. SMPS is used for supplying the constant DC electric power to the LED display board, but it has a big problem which gives birth of harmonics causing by its high-speed switching. measurement HIOKI 3196 equipment to solve these harmonics were measured. In this study, we are LED Display Board Load Measuring the impedance response with $X_L$ changes for removing harmonics in the measured. And we adopted the suitable passive filter by the impedance response characteristic obtained in the $X_L$ variation experiments. We are trying to deeply the application of passive harmonic filter characteristics that generation in the LED Display Board through EDSA LED simulation.

스마트제조시스템의 설비인자 분석 (Analysis of Equipment Factor for Smart Manufacturing System)

  • 안재준;심현식
    • 반도체디스플레이기술학회지
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    • 제21권4호
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    • pp.168-173
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    • 2022
  • As the function of a product is advanced and the process is refined, the yield in the fine manufacturing process becomes an important variable that determines the cost and quality of the product. Since a fine manufacturing process generally produces a product through many steps, it is difficult to find which process or equipment has a defect, and thus it is practically difficult to ensure a high yield. This paper presents the system architecture of how to build a smart manufacturing system to analyze the big data of the manufacturing plant, and the equipment factor analysis methodology to increase the yield of products in the smart manufacturing system. In order to improve the yield of the product, it is necessary to analyze the defect factor that causes the low yield among the numerous factors of the equipment, and find and manage the equipment factor that affects the defect factor. This study analyzed the key factors of abnormal equipment that affect the yield of products in the manufacturing process using the data mining technique. Eventually, a methodology for finding key factors of abnormal equipment that directly affect the yield of products in smart manufacturing systems is presented. The methodology presented in this study was applied to the actual manufacturing plant to confirm the effect of key factors of important facilities on yield.

시뮬레이션 기반 배전반 검사장비 교체의 타당성 분석에 관한 사례연구 (A Case Study of Simulation-based Feasibility Analysis of Replacement of Inspection Equipment for Switchboards)

  • 한영진;이도윤;홍준표;주성호;김기민;박재훈
    • 산업경영시스템학회지
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    • 제45권1호
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    • pp.83-90
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    • 2022
  • This study deals with replacement analysis of deteriorated equipment for improving productivity of production system. Frequent breakdown of the deteriorated equipment causes a situation that reduces productivity such as low product quality, process delay, and repair cost. However, the replacement of new equipment will be required a high initial investment cost, so it is important to analysis the economic feasibility. Therefore, we analyze the effect of the production system due to the aging effect of the equipment and the feasibility of equipment replacement based on the economic analysis. The process flow, working time, logistics movement, etc. are analyzed in order to build the simulation modeling for a ship and land switchboard production system. Using numerical examples, the economic feasibility analysis of equipment replacement through replacement of existing deteriorated equipment and additional arrangement of new facilities is performed.

틸팅열차 차상신호장치 교정유지보수 평가에 관한 연구 (A Study on Evaluation of corrective maintenance for the ATP on-board equipped in Tilting train)

  • 이강미;신덕호;백종현;이재호
    • 한국철도학회:학술대회논문집
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    • 한국철도학회 2009년도 춘계학술대회 논문집
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    • pp.1989-1992
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    • 2009
  • Maintenance is classified preventive maintenance before performing equipment failure and corrective maintenance after performing equipment failure. In preventive maintenance, we may analyze the failure data to end from beginning of equipment and allocate maintenance method and calculate maintenance cycle quantitatively by the failure data analysis. So, it has a merit to reduce system maintenance cost and to operate effectively but, it require high cost in system introducing and continuous operation to end of system. In corrective maintenance, we may calculate MTTR(mean time to repair) quantitatively based on function failure time. it can be based on establishing maintenance system for operation efficiency. In this paper, we may reflect the MTTR for the onboard equipped in Tilting train to establish maintenance system for Tilting train operation efficiency.

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장방형 발열체가 부착된 채널에서 자연대류 연구 (Natural Cconvection in a Vertical Channel with Thermal Blocks)

  • 최용문;박경암
    • 대한기계학회논문집
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    • 제17권2호
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    • pp.438-444
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    • 1993
  • The circuit board of an electronic equipment were simulated with a vertical channel which had thermal blocks protruded from one of the channel walls. A rought front plate was made of a circuit board attached with short wires to simulate the back side of a printed circuit board. Natural convection experiments were carried out to study the effects of channel space and rough front plate and to find the suitable characteristic value after the fourth row. The effect of a rough front plate was negligble. There were negligible effects of the channel space on the first and second heaters. Heat transfer coefficients after the third row decreased as the channel space decreased. Heat transfer coefficients were almost constant for larger than 20 mm channel space. A characteristic length was suggested to non-dimensionalize Nu and Ra numbers in a vertical channel with protruded heaters. A correlation was obtained using the new characteristic lengths.

PCB 구조변화가 전자장비 냉각에 미치는 영향에 관한 수치적 연구 (A Numerical Study on the Effect of PCB Structure Variation on the Electronic Equipment Cooling)

  • 박희용;박경우
    • 대한기계학회논문집
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    • 제19권12호
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    • pp.3329-3343
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    • 1995
  • The interaction of mixed convection and surface radiation in a printed circuit board(PCB) is investigated numerically. The electronic equipment is modeled by a two-dimensional channel with three hot blocks. In order to calculate the turbulent flow characteristics, the low Reynolds number k-.epsilon. model which is proposed by Launder and Sharma is applied. The S-4 approximation is used to solve the radiative transfer equation. The effects of the Reynolds number and geometric configuration variation of PCB on the flow and heat transfer characteristics are analyzed. As the results of this study, it is found that the thermal boundary layer occured at adiabatic wall in case with thermal radiation included, and the effect of radiation is also found to be insignificant for high Reynolds numbers. It is found, as well, that the heat transfer increases as the Reynolds number and block space increase and the channel height decreases and the heat transfer of vertical channel is greater than that of horizontal channel.

OBE 단말기를 이용한 차량 간 통신시스템 (Study on Communication Each Other Cars by OBE Terminal)

  • 박세준;유승선;양태규
    • 한국통신학회논문지
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    • 제33권8A호
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    • pp.838-845
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    • 2008
  • 본 연구는 OBE(On Board Equipment) 단말기를 이용하여 특별한 인프라 없이 무선통신이 가능하도록 단거리 무선통신(DSRC:Dedicated Short Range Communication) )을 이용하여, 차량 간 직접통신을 통한 교통정보교환방식 서비스 체계를 개발하였다. 본 기술은 이동차량이 교통상태정보를 실시간으로 센터에 전달함으로써 수집정보의 정확도를 개선할 수 있도록 하였으며, 통신 음영지역에서도 고품질의 교통정보 서비스 제공이 가능하게 하였다. 또한 본 기술은 통행료를 지불하는 ETC 기능과 함께 그 다음 통신 음영지역에서도 차량 간 직접통신을 통해 교통정보 지점방송과 GPS 등의 부가 통신서비스를 인프라 없이 제공 할 수 있는 장점을 가지고 있다.

칩마운트 (SMD) 장비의 동하중(動荷重) 발생특성에 관한 실험적 연구 (An Experimental Study on the Dynamic Load Characteristics of Surface Mount Device(SMD))

  • 백재호;이홍기;김강부
    • 한국소음진동공학회:학술대회논문집
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    • 한국소음진동공학회 2000년도 춘계학술대회논문집
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    • pp.1913-1917
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    • 2000
  • SMD Equipment convey an electronic parts at high speed, then assemble parts into a circuit board, and it develop a long time-duration dynamic force to be caused by moving mass. Vibration problem to be caused by SMD Equipment have an effect on micro-meter level's precision production process, directly, and dynamic stability of building. In the cause of quantitatively access about its vibration problem, input information(or data) of structure dynamic analysis need accuracy information of dynamic load. Determination of Dynamic load is various kinds of method using experimental and theory. In this paper, we got dynamic load using direct measurement method. We expect that an study on the dynamic load characteristic of SMD can be used to Equipment development of low level vibration and basis information of structure dynamic analysis.

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Diagnosis of Plasma Equipment using Neural Network and Impedance Match Monitoring

  • Byungwhan Kim
    • KIEE International Transaction on Systems and Control
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    • 제2D권2호
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    • pp.120-124
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    • 2002
  • A new methodology is presented to diagnose faults in equipment plasma. This is accomplished by using neural networks as a pattern recognizer of radio frequency (rf) impedance match data. Using a match monitor system, the match data were collected. The monitor system consisted mainly of a multifunction board and a signal flow diagram coded by Visual Designer. Plasma anomaly was effectively represented by electrical match positions. Twenty sets of fault-symptom patterns were experimentally simulated with variations in process factors, which include rf source power, pressure, Ar, and $O_$2 flow rates. As an input to neural networks, two means and standard deviations of positions were used as well as a reflected power. Diagnostic accuracy was measured as a function of training factors, which include the number of hidden neurons, the magnitude of initial weights, and two gradients of neuron activation functions. The accuracy was the most sensitive to the number of hidden neurons. Interaction effects on the accuracy were also examined by performing a 2$^$4 full factorial experiment. The experiments were performed on multipole inductively coupled plasma equipment.

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