• 제목/요약/키워드: ohmic layer

검색결과 168건 처리시간 0.024초

Differences in Design Considerations between InGaN and Conventional High-Brightness Light-Emitting Diodes

  • Lee, Song-Jae
    • Journal of the Optical Society of Korea
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    • 제2권1호
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    • pp.13-21
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    • 1998
  • Based on the escape cone concepts, high-brightness light-emitting diodes (LEDs) have been analyzed. In AlGaAs or InGaAlP LEDs, photon absorption in the ohmic region under the electrode is known to be significant. Thus, ins general, a thick window layer (WL) and a transparent substrate (TS) would minimize photon shielding by the electrodes and considerably improve photon output coupling efficiency. However, the schemes do not seem to be necessary in InGaN system. Photon absorption in ohmic contact to a wide bandgap semiconductor such as GaN may be negligible and, as a result, the significant photon shielding by the electrodes will not degrade the photon output coupling efficiency so much. The photon output coupling efficiency estimated in InGaN LEDs is about 2.5 - 2.8 times that of the conventional high-brightness LED structures based on both WL and TS schemes. As a result, the extenal quantum efficiency in InGaN LEDs is as high as 9% despite the presumably very low internal quantum efficiency.

Effects of an Aluminum Contact on the Carrier Mobility and Threshold Voltage of Zinc Tin Oxide Transparent Thin Film Transistors

  • Ma, Tae-Young
    • Journal of Electrical Engineering and Technology
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    • 제9권2호
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    • pp.609-614
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    • 2014
  • We fabricated amorphous zinc tin oxide (ZTO) transparent thin-film transistors (TTFTs). The effects of Al electrode on the mobility and threshold voltage of the ZTO TTFTs were investigated. It was found that the aluminum (Al)-ZTO contact decreased the mobility and increased the threshold voltage. Traps, originating from $AlO_x$, were assumed to be the cause of degradation. An indium tin oxide film was inserted between Al and ZTO as a buffer layer, forming an ohmic contact, which was revealed to improve the performance of ZTO TTFTs.

유기발광소자(OLED)의 전기전도메커니즘에 대한 고찰 (Study on the Electrical Conduction Mechanism of Organic Light-Emitting Diodes (OLEDs))

  • 이원재
    • 반도체디스플레이기술학회지
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    • 제17권4호
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    • pp.6-10
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    • 2018
  • Organic light emitting devices have attracted the attention of many people because of their high potential for self-emission and flexible display devices. However, due to limitations in device efficiency and lifetime, partial commercialization is underway. In this paper, we have investigated the electrical conduction mechanism of the organic light emitting device by the temperature and the thickness of the light emitting layer through the current - voltage characteristics with respect to the conduction mechanism directly affecting the efficiency and lifetime of the organic light emitting device. Through the study, it was found that the conduction in the low electric field region is caused by the movement of the heat excited charge in the ohmic region and the tunneling of the electric charge due to the high electric field in the high electric field region.

탄소나노튜브 페이스트 접합에 의한 탄소계 복합저항체의 전기적 특성 (Electrical Properties of Carbon-Based Hybrid Resistor Bonded with Carbon Nanotube Paste)

  • 이선우;김은민
    • 한국전기전자재료학회논문지
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    • 제36권5호
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    • pp.482-487
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    • 2023
  • A carbon-based hybrid resistor was fabricated using carbon nanotube (CNT) paste as an adhesive layer to establish electrically continuous ohmic contacts between CNT sheets and different CNT sheet or copper based metal alloy plates, and its electrical properties were evaluated. CNT sheets were fabricated using vacuum filtration with a CNT solution dispersed in isopropyl alcohol (IPA) solvent. The electrical characteristics of these carbon-based hybrid resistors were investigated. The CNT paste fulfilled the requirements for forming ohmic contacts between CNT sheets and metal alloy plates, which was attributed to the lowest work function difference and excellent wettability at the interface.

Cr capping layer를 이용한 n-Ge(100) 기판에서의 Ti germanide 형성과 특성에 관한 연구 (The Formation and Characteristics of Titanium Germanide with Cr capping layer on n-Ge(100) Substrate)

  • 문란주;최철종;심규환
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2009년도 하계학술대회 논문집
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    • pp.154-154
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    • 2009
  • Cr capping layer를 이용하여 Titanium germanide의 열적 안정성을 향상시키는 연구를 수행하였다. n-type Ge(100) 기판 위에 전자빔 증착기를 이용하여 30nm 두께의 Ti와 Cr capping layer를 증착하고 $400\;^{\circ}C$에서 $800\;^{\circ}C$까지 30초간 N2 분위기로 급속 열처리하여 Ti germanide를 형성하였다. XRD결과로부터 Cr capping layer의 유무에 관계 없이 Ti germanide가 형성된 것을 관찰할 수 있었다. Ge 기판 위에 CTLM 패턴을 형성하고 실험을 진행하여 Ti germanide의 I-V 측정 데이터를 통해 Ohmic 특성을 알아보았고, contact resistance, sheet resistance, specific contact resistance를 구하였다.

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Epitaxial에 의한 Si epi층의 케리어 수명과 P-N접합의 이상전도현상 (Carrier Lfetime and Anormal Cnduction Penomena in Silicon Epitaxial Layer-substrate Junction)

  • 성영권;민남기;김승배
    • 전기의세계
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    • 제26권5호
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    • pp.83-89
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    • 1977
  • This paper described the minority carrier lifetime in Si epitaxial layer, and also the voltage (V) versus current (I) characteristics of high resistivity Si epitaxial layer0substrate junction. The measured lifetime in Si epi-layer was much shorter than in bulk, and the temperature dependence of lifetime was found to agree well with Shockley-Read model of recombination which applies to high resistivity n-type materials. The V-I curve showed; an ohmic region (I.var.V), a sublinear region (I.var.V$^{1}$2/), a space charge limited current region (I.var.V$^{2}$), and finally a negative resistance region. We investigated these phenomena by the theory of the relaxation semiconductor.

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전기화학적 방법에 의한 Cu-Ni 다층박막합금의 수학적 모델링 (Mathematical Modeling on Electrodeposition of Compositionally Modulated Cu-Ni Alloy)

  • 박경완;이철경;손헌준
    • 한국표면공학회지
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    • 제27권4호
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    • pp.223-233
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    • 1994
  • It is well known that compositionally modulated Cu-Ni alloy can be produced by an electrochemical method in Ni sulfate solution containing trace amount of Cu. a mathematical model is presented to describe the current distribution and weight percent of Cu in Ni layer on the rotating disk electrode. The model includes convective-diffusion equation, the Laplace's equation and various overpotentials, and is solved numerically. The thickness of Cu layer is almost uniform whereas the thickness of Ni layer as well as the Ni/Cu weight ratio are increased approaching to the edge of the disk. These results agree well with the experimental values. The ohmic potential drop is suggested as a major cause of a nonuniformity in Ni layer. The optimum plating condition for the fabrication of susperlattice is proposed based on the results of this study.

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SiO2 절연박막에 의해서 바나듐옥사이드 박막이 전도성이 높아지는 원인분석 (Analysis of Increasing the Conduction of V2O5 Thin Film on SiO2 Thin Film)

  • 오데레사
    • 한국산학기술학회논문지
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    • 제19권8호
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    • pp.14-18
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    • 2018
  • 일반적으로 반도체소자의 이동도를 높이기 위하여 반도체소자에서 옴접촉이 중요하게 다루어진다. 반도체 구조의 PN접합은 공핍층을 포함하고 있으며, 공핍층은 전기적인 비선형을 유도하고 쇼키접압을 만들어내는 반도체 고유의 물리적인 특징이다. 본 연구에서는 절연막이 전도성에 미치는 효과를 조사하기 위해서 $SiO_2$ 박막과 $V_2O_5/SiO_2$ 박막의 전기적인 특성을 비교하여 조사하였다. 미소전계영역에서 $SiO_2$ 절연막의 전기적인 특성으로부터 비선형 쇼키접합을 이루고 있는 것을 확인하였으며, 그 위에 증착된 $V_2O_5$ 박막은 오믹특성을 갖는 것을 확인하였다. 절연막의 PN 접합에 의한 쇼키접합 특성이 누설전류를 차단하여 $V_2O_5$ 박막의 전도성을 우수하게 만들었다. 양의 전압에서 $SiO_2$ 박막의 커패시턴스 값은 매우 낮았으나 $V_2O_5$ 박막의 커패시턴스 값은 전압이 증가할수록 증가하였다. 일반적인 전계영역에서 $SiO_2$ 박막의 절연 효과에 의해 $V_2O_5$ 박막의 전도성이 증가하는 것을 확인하였다. 절연박막은 공핍층의 효과를 이용하는 쇼키접합을 갖게 되며, 반도체에서의 쇼키접합은 전도성을 높이는 효과가 있는 것을 확인하였다.

청색 발광 다이오드에서 활성층의 균일성과 신뢰성 사이의 상관관계 고찰 (Correlation between the Active-Layer Uniformity and Reliability of Blue Light-Emitting Diodes)

  • 장진원;김상배
    • 대한전자공학회논문지SD
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    • 제42권12호
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    • pp.27-34
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    • 2005
  • 활성층의 균일성 차이에 따라 서로 다른 발광특성을 보이는 소자들의 균일성과 신뢰도 사이의 상관관계를 고찰하였다. 소자들을 초기 특성에 따라 균일한 발광특성을 보이는 그룹 I과 불균일한 발광특성을 보이는 그룹 II로 분류하였다. 그룹 II 소자의 경우 온도 의존성이 더 큰 것으로 나타났으며, 두 그룹의 신뢰성 실험을 통해 크게 두 가지 성능저하 과정이 있는 것을 알았다. 칩 전체적으로 균일하게 성능저하 되는 bulk 성능저하 과정과 칩의 edge부분에서부터 성능저하가 시작되는 edge 성능저하 과정이다. 비발광성 결함에 의한 bulk 성능저하는 불균일한 발광특성을 보이는 그룹 II 소자에서 더 빠르게 진행되었다. edge 성능저하는 그룹 I, II 소자에 관계없이 고전류로 aging하였을 경우 나타났으며, n-Ohmic 접촉 영역에서 시작하여 발광하지 않는 부분이 확장되는 성능저하 과정을 확인하였다. 이에 따라 고효율, 고신뢰도 청색 발광 다이오드 제작을 위해서는 활성층의 균일도를 높이고, 전류 밀도를 균일하게 하며, 건식 식각된 mesa면의 passivation을 하여야 한다.

Al2O3 층을 이용한 저온공정에서의 산화물 기반 트랜지스터 컨택 특성 향상 (Improved Contact property in low temperature process via Ultrathin Al2O3 layer)

  • 정성현;신대영;조형균
    • 한국표면공학회:학술대회논문집
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    • 한국표면공학회 2018년도 춘계학술대회 논문집
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    • pp.55-55
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    • 2018
  • Recently, amorphous oxides such as InGaZnO (IGZO) and InZnO (IZO) as a channel layer of an oxide TFT have been attracted by advantages such as high mobility, good uniformity, and high transparency. In order to apply such an amorphous oxide TFTs to a display, the stability in various environments must be ensured. In the InGaZnO which has been studied in the past, Ga elements act as a suppressor of oxygen vacancy and result in a decreased mobility at the same time. Previous studies have been showed that the InZnO, which does not contain Ga, can achieve high mobility, but has relatively poor stability under various instability environments. In this study, the TFTs using $IZO/Al_2O_3$ double layer structure were studied. The introduction of an $Al_2O_3$ interlayer between source/drain and channel causes superior electrical characteristics and electrical stability as well as reduced contact resistance with optimally perfect ohmic contact. For the IZO and $Al_2O_3$ bilayer structures, the IZO 30nm IZO channels were prepared at $Ar:O_2=30:1$ by sputtering and the $Al_2O_3$ interlayer were depostied with various thickness by ALD at $150^{\circ}C$. The optimal sample exhibits considerably good TFT performance with $V_{th}$ of -3.3V and field effect mobility of $19.25cm^2/Vs$, and reduced $V_{th}$ shift under positive bias stress stability, compared to conventional IZO TFT. The enhanced TFT performances are closely related to the nice ohmic contact properties coming from the defect passivation of the IZO surface inducing charge traps, and we will provide the detail mechanism and model via electrical analysis and transmission line method.

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