• Journal of Sensor Science and Technology
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• v.11 no.3
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• pp.155-162
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• 2002

The sensing properties of carbon monooxide were investigated as a function of mixing ratio and the lamination structure of 3mol% ZnO-doped $SnO_2$ and 3mol% $SnO_2$-doped ZnO. The lamination structures were fabricared monolayer, double layer, and hetero layer of $SnO_2$, Zno, and theirs mixture composition using thick film process. There was no second phase by the reaction of $SnO_2$ and ZnO. The conductance was decreased by the addition of ZnO in $SnO_2$, but it was increased with the addition of $SnO_2$ in ZnO. The conductance was increased with temperature and the inlet of CO. There was no improvement of sensitivity in the structure of mono- and double-layer. The hetero-layer structure, however, of $SnO_2$ 3ZnO-ZnO $3SnO_2$ showed the higher resistivity and the highest sensitivity. Ohmic characteristics was confirmed by the linear properties for I-V measurements.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.47 no.8
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• pp.1-6
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• 2010

We report on the electrical properties of Ti/Al/Ni/Au (20 nm/ 150 nm/ 30 nm/ 100 nm) Ohmic contacts and the anisotropic conductivity of n-type ${\alpha}$-plane ([11-20]) GaN grown on $\gamma$-plane ([1-102]) sapphire substrates. The Ti/Al/Ni/Au Ohmic contacts and their sheet resistances are characterized by using the transfer length method (TLM) as a function of azimuthal angles. It is found that the specific contact resistance does not depend on the axis orientation and there are significant electrical anisotropy in ${\alpha}$-plane GaN films on $\gamma$-plane sapphire substrates, and the sheet resistance varies with azimuthal angles. The sheet resistance values in the direction parallel to m-axis [1-100] are 25% ~ 75% lower than those parallel to c-axis [0001] directions. Thus, Basal stacking faults (BSFs) are offered as a feasible source of the anisotropic mobility in defected m-axis direction because the band-edge discontinuities owing to the differential band gap structure.

• Korean Journal of Metals and Materials
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• v.48 no.5
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• pp.456-461
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• 2010

We investigated the In-based ohmic contacts on Nitrogen-face (N-face) n-type GaN, as well as Ga-face n-type GaN, for InGaN-based vertical Light Emitting Diodes (LEDs). For this purpose, we fabricated Circular Transfer Length Method (CTLM) patterns on the N-face n-GaN that were prepared by using a laser-lift off method, as well as on the Ga-face n-GaN that were prepared by using a dry etching method. Then, In/transparent conducting oxide (TCO) and In/TiW schemes were deposited on the CTLM in order for low resistance ohmic contacts to form. The In/TCO scheme on the Ga-face n-GaN showed high specific contact resistance, while the minimum specific contact resistance was only 3${\times}$10$^{-2}$ $\Omega$-cm$^{2}$ after annealing at 300${^{\circ}C}$, which can be attributed to the high sheet resistance of the TCO layer. In contrast, the In/TiW scheme on the Ga-face n-GaN produced low specific contact resistance of 2.1${\times}$10$^{5}$ $\Omega$-cm$^{2}$ after annealing at 500${^{\circ}C}$ for 1 min. In addition, the In/TiW scheme on the N-face n-GaN also resulted in a low specific contact resistance of 2.2${\times}$10$^{-4}$ $\Omega$-cm$^{2}$ after annealing at 300${^{\circ}C}$. These results suggest that both the Ga-face n-GaN and N-face n-GaN.

• Journal of Electrical Engineering and Technology
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• v.1 no.2
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• pp.211-215
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• 2006

This paper presents a new structure for the universal motor using soft magnetic composite (SMC). The stator for this new type of motor is made by combination of the SMC pole and the silicon steel yoke. The shape of the 3D SMC pole is designed to minimize ohmic loss and amount of stator coil. To design the pole shape, the 3D analysis in the design procedure is replaced with an equivalent 2D analysis. Finally, the optimal shape is analyzed by 3D FEM and the performance is discussed.

• Proceedings of the Korean Vacuum Society Conference
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• 2015.08a
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• pp.195-195
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• 2015

반도체 제조 시 ohmic contact을 형성하고, barrier metal layer형성을 위해 NH3 기체를 사용하는 rapid thermal nitridation (RTN)은 반도체 공정에 있어 매우 중요한 핵심 기술이다. 그러나 공정 진행 시 발생하는 공정 부산물에 의한 chamber오염으로 인해 매우 정확히 입사 되어야 할 thermal energy의 controllability가 저하되고 있어, 미세 공정능력 구현의 한계에 부닥치고 있다. 본 연구에서는 quartz plate liner를 적용하여 RTN 공정에서 발생하는 공정 부산물인 ammonium chloride (NH4Cl)의 chamber 표면 증착을 최소화하였고, 공정 진행 온도의 controllability를 확보하였다.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1995.11a
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• pp.261-264
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• 1995

The response speed enhancement in picosecond photoconductor made from RF planar magnetron sputtered hydrogenated amorphous germanium thin film is discussed. Pulsed laser annealing technique was used to fabricate the highly conductive ohmic contacts and to remove the shallow deflects in the deposited photoconductive film using the different laser powers. Measured V-I curve showed -5 times bigger conductance in photoconductive gap than the one used by the conventional vacuum annealing method using strip heater.

• Proceedings of the Materials Research Society of Korea Conference
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• 2007.11a
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• pp.43.2-43.2
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• 2007

• 한국정보디스플레이학회:학술대회논문집
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• 2006.08a
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• pp.882-885
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• 2006

The contact resistivity of the black interlayer which has been introduced between BUS and ITO electrodes in a plasma display panel was evaluated using two kinds of specially designed test electrode patterns. Of the two, type 2 pattern was able to evaluate the contact resistivity more successfully, which was calculated as about $250{\Omega}$ in the suggested test pattern structure.

• The Transactions of the Korean Institute of Electrical Engineers
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• v.35 no.2
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• pp.62-66
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• 1986

Ion beam etching of silicon with N2 and Ar gas has been found to cause the band edge to bend downward near the surface in p-type silicon. Rectifying, rather than ohmic contacts are obtained on the structures formed by evaporation of gold and titanium onto ion-bean-etched p-type silicon. The 1/C2 versus V relationship measured at 1MHz is found to be nonlinear for small voltages indicating alteration of the effective doping colse to the silicon surface.

• Proceedings of the Korean Vacuum Society Conference
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• 1997.02a
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• pp.42-42
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• 1997