• Journal of Electrochemical Science and Technology
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• v.13 no.3
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• pp.369-376
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• 2022

In this study, the stability of an anion exchange membrane water electrolyzer (AEMWE) cell was evaluated in an on-off cycling operation with respect to an applied electric bias, i.e., a current density of 500 mA cm^-2, and an open circuit. The ohmic and polarization resistances of the system were monitored during operation (~800 h) using electrochemical impedance spectra. Specific consideration was given to the ohmic resistance of the cell, especially that of the membrane under on-off cycling conditions, by consistently feeding the cell with KOH solution. Owing to an excess feed solution, a momentary increase in the polarization resistance was observed immediately after the open-circuit. The excess feed solution was mostly recovered by subjecting the cell to the applied electric bias. Stability tests on the AEMWE cell under on-off cycling with continuous feeding even under an open circuit can guarantee long-term stability by avoiding an irreversible increase in ohmic and polarization resistances.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.37 no.4
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• pp.353-358
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• 2013

The current interruption method is considered to be an efficient way of measuring the resistance of a fuel cell. In this study, the ohmic area specific resistances (ASRs) of polymer electrolyte fuel cells with different types of bipolar plates were evaluated using the current interruption method. The ohmic ASRs of both a fuel cell with graphite bipolar plates and a fuel cell with graphite foil-based assembled bipolar plates decreased as the current density increased. On the other hand, with increasing cell temperature, the ohmic ASRs of a fuel cell with graphite bipolar plates were decreased by a reduction in the proton transport resistance through the membrane, and the ohmic ASRs of a fuel cell with graphite foil-based assembled bipolar plates were increased by the differences in thermal expansion between different components of the bipolar plates.

• Proceedings of the Materials Research Society of Korea Conference
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• 2007.11a
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• pp.44.2-44.2
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• 2007

• Proceedings of the Optical Society of Korea Conference
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• 2008.02a
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• pp.93-94
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• 2008

In order to suppress the current crowding in light emitting diodes (LEDs) grown on sapphire substrate, the effect of nonuniform contact resistivity between TME layer and p-GaN layer on the LED surface was theoretically investigated. The analysis results showed that current crowding occurring around p-electrode could be considerably improved, which in turn would be helpful to improve the electrostatic discharge (ESD) characteristic.

• Journal of the Korean Ceramic Society
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• v.28 no.8
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• pp.619-625
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• 1991

The current-voltage characteristics of the semiconducting BaTiO3 ceramics are measured in the range of 0.01∼100 Volt. Non ohmic behavior was observed above Tc. This behavior is not dependent on specimen thickness and is not observed at the incomplete semiconducting sepcimen. From this experiment, non-ohmic behavior of PTC is attributed to Heywang's potential barrier not to space change limited current. In the low voltage range, current-voltage characteristics of PTC ceramics can be explained by Heywang model.

• Journal of IKEEE
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• v.13 no.4
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• pp.23-27
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• 2009

Ohmic contact formation and etching processes for the fabrication of MBE (molecular beam epitaxy) grown GaSb-based p-channel HEMT devices on Si substrate have been studied. Firstly, mesa etching process was established for device isolation, based on both HF-based wet etching and ICP-based dry etching. Ohmic contact process for the source and drain formation was also studied based on Ge/Au/Ni/Au metal stack, which resulted in a contact resistance as low as $0.683\;{\Omega}mm$ with RTA at $320^{\circ}C$ for 60s. Finally, for gate formation of HEMT device, gate recess process was studied based on AZ300 developer and citric acid-based wet etching, in which the latter turned out to have high etching selectivity between GaSb and AlGaSb layers that were used as the cap and the barrier of the device, respectively.

• Journal of the Microelectronics and Packaging Society
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• v.10 no.4
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• pp.29-33
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• 2003

Material and electrical properties of copper-based ohmic contacts on n-type 4H-SiC were investigated for the effects of the post-annealing and the metal covering conditions. The ohmic contacts were prepared by sequential sputtering of Cu and Si layers on SiC substrate. The post-annealing treatment was performed using RTP (rapid thermal process) in vacuum and reduction ambient. The specific contact resistivity ($p_{c}$), sheet resistance ($R_{s}$), contact resistance ($R_{c}$), transfer length ($L_{T}$), were calculated from resistance (RT) versus contact spacing (d) measurements obtained from TLM (transmission line method) structure. The best result of the specific contact resistivity was obtained for the sample annealed in the reduction ambient as $p_{c}= 1.0 \times 10^{-6}\Omega \textrm{cm}^2$. The material properties of the copper contacts were also examined by using XRD. The results showed that copper silicide was formed on SiC as a result of intermixing Cu and Si layer.

• The Transactions of the Korean Institute of Electrical Engineers C
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• v.49 no.8
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• pp.438-444
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• 2000

We report the effects of etch process parameters on the ohmic contact formation in the plasma etching of GaN. Planar inductively coupled plasma system with $CH_4/H_2/Ar$gas chemistry has been used as etch reactor. The contact resistance and the specific contact resistance have been investigated using transfer length method as a function of RF bias power and %Ar gas concentration in total flow rate. AES(Auger electron spectroscopy) analysis revealed that the etched GaN has nonstoichiometric Ga rich surface and was contaminated by carbon and oxygen. Especially large amount of carbon was detected at the sample etched for high bias power (or voltage) condition, where severe degradation of contact resistance was occurred. We achieved the low ohmic contact of $2.4{\times}10^{-3} {\Omega}cm^2$ specific contact resistance at the input power 400 W, RF bias power 150 W, and working pressure 10mTorr with 10 sccm $CH_4$, 15 sccm H2, 5 sccm Ar gas composition.

• Proceedings of the KIEE Conference
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• 2001.07c
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• pp.1378-1380
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• 2001

Ohmic contacts have been fabricated on p-type 4H-SiC using Pt/Ti. Low resistivitf Ohmic contacts of Pt/Ti to p-type 4H-SiC were investigated. Specific contact resistances were measured using the transmission line model method, and the physical properties of the contacts were examined using x-ray diffraction, scanning electron microscopy. Ohmic behavior with linear current-voltage characteristics was observed following anneals at $900^{\circ}C$ for 90sec at a pressure of $3.4{\times}10^{-5}$ Torr. The Pt/Si/Ti films was measured lower value of the specific contact resistance by the annealing process, and the contact resistances were improved more than one order compared to Ti contact the annealed sample. Scanning electron microscopy shows that the Pt layer effectively reduce the oxidation of Ti films. And results are obtained as $4.6{\times}10^{-4}$ ohm/$cm^2$ for a Pt/Ti metal structure after a vacuum annealing at $900^{\circ}C$ for 90sec. Titanium has a relatively high melting point, thus Ti-based metal contacts were attempted in this study.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2010.06a
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• pp.160-160
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• 2010

In this work, we investigate ohmic contacts to p-type GaN using a Pt/Cu/Au metallization scheme in order to achieve low resistance and thermally stable ohmic contact on p-GaN. An ohmic contact formed by a metal electrode deposited on a highly doped InGaN/GaN superlattice sturucture on p-GaN layer. The specific contact resistance is $1.56{\times}10^{-6}{\Omega}cm^2$ for the as-deposited sample, $1.35{\times}10^{-4}{\Omega}cm^2$ for the sample annealed at $250^{\circ}C$ and $6.88{\times}10^{-3}{\Omega}cm^2$ for the sample annealed at $300^{\circ}C$.