• Title/Summary/Keyword: normal spot

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The Computer Simulation of the Temperature Distribution on the Superconducting thin-film by Moving Quenching-Field (이동 Quenching 자계시 컴퓨터 시뮬레이션에 의한 초전도 박막에서의 온도분포해석)

  • Kang, Jung-Sun;Ko, Tae-Kuk
    • Proceedings of the KIEE Conference
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    • 1991.11a
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    • pp.115-118
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    • 1991
  • The temperature distribution on the superconducting thin-film is analyzed as moving constant field is applied above upper critical field. The distribution of magnetic field is derived in the normal spot. Governing equation is obtained with the help of the equation of conservation of energy. The temperature distribution and the heat dissipation are obtained through computer simulation by the method of numerical analysis. Maximum temperature is occured in the most right side inside normal spot. The temperature is increased abruptly inside the normal spot, and decreased more gradually outside normal spot in the direction of moving field as velocity is increased. Increasing the velocity rather than increasing magnitude of the normal spot and the applied field makes maximum temperature larger. Heat dissipation is affected by the velocity rather than the magnitude of normal spot and the applied field.

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Investigation of shinning Spot Defect on Hot-Dip Galvanized Steel Sheets

  • Liu, Yonggang;Cui, Lei
    • Corrosion Science and Technology
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    • v.13 no.4
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    • pp.125-129
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    • 2014
  • Shinning spot defects on galvanized steel sheets were studied by optical microscope, scanning electron microscope(SEM), Energy Dispersive Spectrometer (EDS) and Laser-Induced Breakdown Spectroscopy Original Position Statistic Distribution Analysis (LIBSOPA) in this study. The research shows that the coating thickness of shinning spot defects which caused by the substrate defect is much lower than normal area, and when skin passed, the shinning spot defect area can not touch with skin pass roll which result in the surface of shinning spot is flat while normal area is rough. The different coating morphologies have different effects on the reflection of light, which cause the shinning spot defects more brighter than normal area.

Experimental Study on Spot Weld and Plug Weld of Automotive Body Panel (자동차 차체 패널의 점용접 및 플러그용접 특성에 대한 실험적 분석)

  • Kwon, Jongho;Kim, Janghoon;Lee, Yongwoo
    • Transactions of the Korean Society of Automotive Engineers
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    • v.24 no.6
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    • pp.709-715
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    • 2016
  • This paper presents a comparison of an experimental study on spot and plug welding of an automotive body panel. Spot welding is a common joining technology used in automotive body panel assembly. In automotive body repair, however, plug welding is widely used due to its technical simplicity and cost benefit. Some researchers have focused on the use of spot welding in the manufacturing process, but there has been very little research done with respect to the engineering analysis of the plug welding process. In this study, two kinds of specimens are considered to compare the difference of failure strength between spot weld and plug weld: normal tension and shear tension. The experimental results show, in both normal tension and shear tension, that spot welding has higher failure strength than plug welding. In addition, plug welding is more vulnerable to shear tension than normal tension. This study can be applied to further studies on practical optimization for maintenance and repair of automotive body panels.

The Characteristic Analysis of E.M.F. Induced by Moving Normal Spot in a Cylindrical Superconducting Foil

  • Kim, Ho-Min;Bae, Joon-Han;Yoon, Yong-Soo;Chu, Yong;Ko, Tae-Kuk;Han, Tae-Su
    • Progress in Superconductivity
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    • v.1 no.2
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    • pp.99-104
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    • 2000
  • The e.m.f. induced by a normal spot moving in a superconducting foil has been investigated by using the simulation and the experiment of a simple superconducting Power Supply. The induced e.m.f. has been derived theoretically from the magnetic field distribution within the spot. It is the sum of a DC component induced constantly by the Faraday's law during the spot's movement and a pulse component induced periodically by the flux conservation law at every electrical degrees 2$\pi$ radians. The DC component of the output voltage appears slightly nonlinear to the rotating speed, having values greater than the linear approximation values. The theoretical interpretation has been verified through experiment.

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Stress Intensity Factor for the Cracked Sheet Subjected to Normal Stress and Reinforced with a Plate by Spot Welding (점용접에 의하여 판재로 보강된 균열판의 수직응력에 의한 응력세기계수)

  • 이강용;김옥환
    • Journal of Welding and Joining
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    • v.15 no.1
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    • pp.55-65
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    • 1997
  • The stress intensity factor has been calculated for the cracked plate subjected to remote normal stress and reinforced with a plate by symmetric spot welding. The solution was based on displacement compatibility condition between the cracked sheet and the reinforcement plate. It is shown that the results from the derived equation for stress intensity factor were agreed with previous solutions. The reinforcement effect gets better as a joining spot is closer to the crack tip and the other joining spots become nearer to the crack surface.

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The Analysis of Temperature Characteristics of a Superconducting Power Supply Due to the Eddy Current (와전류에 의한 초전도 전원장치의 온도특성 해석에 관한 연구)

  • O, Yun-Sang;Bae, Joon-Han;Song, Myung-Kon;Ji, Chang-Sub;Kim, Ho-Min;Ko, Tae-Kuk
    • Proceedings of the KIEE Conference
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    • 1996.07a
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    • pp.175-177
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    • 1996
  • This paper is studied on the numerical analysis of temperature distribution on the Nb-foil due to the eddy current under operating a superconducting power supply. The increase of rotating speed and magnetic flux above critical magnetic field lead to the temperature rising in the normal spot, the heat was distributed in the region of 30% distance from the center of the normal spot, but the most of the heat was transferred to LHe. Under operation of the sc power supply, the increase of rotation speed has the more influence on the temperature rising than that of magnetic flux. we can conclude that the totaling speed of normal spot is the main design consideration of the sc power supply, and get the optimal value of rotating speed.

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Production of monoclonal antibodies against VP28 of white spot syndrome virus (WSSV) (White spot syndrome virus (WSSV)의 VP28에 대한 단클론 항체 생산)

  • Bang, Ji-hyeong;Kim, Wi-Sik;Kim, Choon-sup;Kim, Jong-Oh;Oh, Myung-Joo
    • Journal of fish pathology
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    • v.32 no.1
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    • pp.45-48
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    • 2019
  • We developed and subsequently characterized mouse monoclonal antibodies (MAbs) against recombinant VP28 structural protein (rVP28) of white spot syndrome virus (WSSV). We established six hybridoma clones secreting MAbs against rVP28: 15A11, 20G6, 31H2, 34H6, 38D1 and 43A1. All six MAbs recognized the 25 kDa of protein in gill homogenates of WSSV-infected shrimp by western blot analysis, while no reactivity was observed in gill homogenates of normal shrimp. Moreover, high enzyme-linked immunosorbent assay (ELISA) optical density (OD) values (0.8-2.68) were observed in the hemolymphs from WSSV-infected shrimp, while low OD values (less than 0.24) were recorded in the hemolymphs from normal shrimp, by using these six MAbs produced in this study. These results suggest that these six MAbs are useful for the detection of WSSV.

Analysis of Electrical Contact Resistance Model in Multi-Contact of Tribological Elements (트라이볼로지 기소의 멀티접촉에서 전기접촉저항 모델해석에 관한 연구)

  • 김청균
    • Tribology and Lubricants
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    • v.12 no.4
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    • pp.52-59
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    • 1996
  • The results of the electrical contact conductivity of multi-contact spots accounting the surface roughness and the non-conductive films of different origins such as air, water, cutting oil, and machining oil are presented. The array of metal spheres compressed between two flat plates has been used for simulation of the contact behavior of multiple contact of solids, under normal loading. Measurement of electrical contact resistance has been made using the equipment providing the adequate accuracy in the range of micro Ohms. The data on electrical contact resistance have been compared with theoretical predictions using the multiple contact model of constriction resistance. The effect of single spot number and array on conductivity of contact has been evaluated. The results of the experiments show that the contact resistance are closely related to the number of loading cycles, form of surface roughness, and presence of non-conductive films that reduce the size of the real electrical contact spots.

Environmental Factor Analysis of Helminthosporium-Leaf-Spot-Disease Occurrence in Rice (벼 깨씨무늬병 발생의 환경요인 분석)

  • Won Jong-Gun;Seo Young-Jin;Choi Jang-Soo;Kim Seung-Han;Kim Jong-Soo;Yoon Jae-Tak
    • KOREAN JOURNAL OF CROP SCIENCE
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    • v.51 no.3
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    • pp.199-203
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    • 2006
  • In the late growth stage of rice plant, the growth declines even though they grow well in early growth stage. This phenomenon is called autumn declining and it often accompanies the infection of Helminthosporium leaf spot disease. This study was carried out to identify the related environmental factors and to establish the integrated control system of Helminthosporium Leaf Spot Disease in rice. The total area of infected paddy field by Helminthosporium leaf spot was 470 ha in 2000 and 1,004 ha in 2001, which occupied about 1% of the total paddy area in Gyeongbuk province, Korea. The ill-drained sandy paddy occupied 50% of the total area of infected paddy fields and followed by sandy paddy (28%). Comparing the content of soil elements between infected and normal paddy, it was clarified that the organic matter content of normal was higher than that of infected paddy and the contents of inorganic elements such as Mn, Fe, Zn and available $SiO_2$ were also higher in normal paddy. The results of comparing the inorganic elements between infected and normal rice plants also showed the same results. The contents of inorganic elements such as MgO, $SiO_2$, Fe, Mn were higher in normal rice plants. Especially highly significant difference of $SiO_2$ content on both soil and rice plants was noticeable.

An Iterative Spot Matching for 2-Dimensional Protein Separation Images (반복 점진적 방법에 의한 2차원 단백질 분리 영상의 반점 정합)

  • Kim, Jung-Ja;Hoang, Minh T.;Kim, Dong-Wook;Kim, Nam-Gyun;Won, Yong-Gwan
    • Journal of Biomedical Engineering Research
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    • v.28 no.5
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    • pp.601-608
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    • 2007
  • 2 Dimensional Gel Electrophoresis(2DGE) is an essentialmethodology for analysis on the expression of various proteins. For example, information for the location, mass, expression, size and shape of the proteins obtained by 2DGE can be used for diagnosis, prognosis and biological progress by comparison of patients with the normal persons. Protein spot matching for this purpose is comparative analysis of protein expression pattern for the 2DGE images generated under different conditions. However, visual analysis of protein spots which are more than several hundreds included in a 2DGE image requires long time and heavy effort. Furthermore, geometrical distortion makes the spot matching for the same protein harder. In this paper, an iterative algorithm is introduced for more efficient spot matching. Proposed method is first performing global matching step, which reduces the geometrical difference between the landmarks and the spot to be matched. Thus, movement for a spot is defined by a weighted sum of the movement of the landmark spots. Weight for the summation is defined by the inverse of the distance from the spots to the landmarks. This movement is iteratively performed until the total sum of the difference between the corresponding landmarks is larger than a pre-selected value. Due to local distortion generally occurred in 2DGE images, there are many regions in whichmany spot pairs are miss-matched. In the second stage, the same spot matching algorithm is applied to such local regions with the additional landmarks for those regions. In other words, the same method is applied with the expanded landmark set to which additional landmarks are added. Our proposed algorithm for spot matching empirically proved reliable analysis of protein separation image by producing higher accuracy.