• Proceedings of the KSRS Conference
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• 2006.03a
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• pp.315-318
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• 2006

Pushbroom 방식의 CCD 영상에서 발생하는 pixel들 사이의 Non-uniformity 원인은 CCD pixel 면적의 차이, Dark current 영향, Output amplifier 차이, input radiance의 차이 등과 같은 CCD의 특성에 의해 발생하게 되며, CCD의 특성에 의해 발생되는 pixel사이의 상대복사량 차이인 Non-uniformity errors은 위성영상에서 줄무늬의 일차적 원인이 된다. 이러한 CCD의 상대복사보정을 위해서는 일차적으로 CCD의 특성을 잘 파악할 수 있는 지상에서 보정 값이 계산되어져야 하며 위성발사 후 보정 값이 다시 update 되어야 한다. 본 연구에서는 다목적실용위성2호의 상대복사보정을 위한 준비로서, 지상에서 만들어진 MSC CCD PAN1 영상과 Pushbroom 방식의 다목적실용위성1호 영상을 시험자료로 이용하여 pixel 사이의 줄무늬를 제거하기 위한 상대복사보정을 수행하였다.

• Proceedings of the KSRS Conference
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• 2007.03a
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• pp.305-307
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• 2007

KOMPSAT-2(K-2) 의 MSC 는 CCD pixel 별 band 별 특성, 감도 및 시간에 따른 변화, CCD Geometry 등에 의해 왜곡 현상이 일어나며 위성 발사 전에 실험실에서의 충분한 실험과 Calibration 작업 을 통해 얻어진 값들을 사용하여 Image Restoration, 상대 복사 보정, 절대 복사 보정 등의 작업들을 거쳐서 왜곡 현상을 보정하게 된다. 그 중 복사 보정에 해당하는 NUC(NonUniformity Correction)은 MSC 각각의 픽셀들이 상이한 특성을 나타내는 것을 균일한 이미지로 보정하는 작업으로 무엇보다 우선시 되는 검보정 작업이다. K-2 NUC table 생성에는 시스템 특성상 몇 가지 사항을 고려 하여 위성에 upload 하는 high frequency NUC(HF NUC)과 지상국에서 처리할 수 있는 low frequency NUC(LF NUC)으로 구분하여 알고리즘을 생성하였다.

• Proceedings of the KSME Conference
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• 2003.04a
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• pp.1296-1301
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• 2003

The chemical mechanical polishing(CMP) is necessarily applied to manufacturing the dielectric layer and metal line in the semiconductor device. The conditioning of polishing pad in CMP process additionally operates for maintaining the removal rate, within wafer non-uniformity, and wafer to wafer non-uniformity. But the fixed abrasive pad(FAP) using the hydrophilic polymer with abrasive that has the swelling characteristic by water owns the self-conditioning advantage as compared with the general CMP. FAP also takes advantage of planarity, resulting from decreasing pattern selectivity and defects such as dishing due to the reduction of abrasive concentration. This paper introduces the manufacturing technique of FAP. And the tungsten CMP using FAP achieved the good conclusion in point of the removal rate, non-uniformity, surface roughness, material selectivity, micro-scratch free contemporary with the pad life-time.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2001.04a
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• pp.1068-1071
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• 2001

Recently, the minimum line width shows a tendancy to decrease and the multi-level to increase in semiconductor. Therefore, a planarization technique is needed, which chemical polishing(CMP) is considered as one of the most important process. CMP accomplishes a high polishing performance and a global planarization of high quality. But there are several defects in CMP such as microscratches, abrasive contaminations, and non-uniformity of polished wafer edges. Spin Etching can improve the defects of CMP. It uses abrasive-free chemical solution instead of slurry. Wafer rotates and chemical solution is simultaneously dispensed on a whole surface of the wafer. Thereby chemical reaction is occurred on the surface of wafer, material is removed. On this study, TEOS film is removed by CMP and Spin Etching, the results are estimated at a viewpoint of material removal rate(MRR) and within wafer non-uniformity(WIWNU).

• Proceedings of the Korean Society of Precision Engineering Conference
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• 1997.10a
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• pp.935-938
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• 1997

Recently, the minimum line width shows a tendency to decrease and the multi-level increase in semiconductor. Therefore, a planarization technique is needed and chemical mechanical polishing(CMP) is considered as one of the most suitable process. CMP accomplishes a high polishing performance and a global planarization of high quality. But there are several defects in CMP such as micro-scratches, abrasive contaminations, and non-uniformity of polished wafer edges. Wet etching include of Spin-etching can improve he defects of CMP. It uses abrasive-free chemical solution instead of slurry. On this study, ILD(INterlayer-Dielectric) was removed by CMP and wet-etching methods in order to investigate the superiority of wet etching mechanism. In the thin film wafer, the results were evaluated at a viewpoint of material removal rate(MRR) and within wafer non-uniformity(WIWNU). And pattern step height was also compared for planarization characteristics of the patterned wafer.

• Proceedings of the Korean Society of Medical Physics Conference
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• 2002.09a
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• pp.214-215
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• 2002

Generally uniform dose distribution is assumed to be formed in a target region when a conventional dose formation method using a broad proton beam, a fixed modulation technique, a bolus and an aperture is employed. However, actual situations differ. We usually find non-uniformity in the target region. This is due to the insertion of a range-compensating bolus before the patient. Since the range-compensating bolus has an irregular shape, the scattering in the bolus depends on the lateral position. Dose distribution is overlapping results of dose distribution of pencil-proton beams traversing different lateral positions of the bolus. The lateral extent of dose distribution of each pencil beam traversing the different position differs each other at the same depth in the target object. This is a cause of the non-uniformity of the dose distribution. Therefore the same lateral extent of dose distribution should be attained for different pencil beams at the same depth to obtain a uniform dose distribution. For that purpose, we propose here a bi-material bolus. The bi-material bolus consists of a low-Z material determining mainly the range loss and a high-Z material defining mainly the scattering in the bolus. After passing through the bi-material bolus, protons traversing different lateral positions will have different residual range yet with the same lateral spread at a certain depth. Using the optimized bi-material bolus, we can obtain a more uniform dose distribution in the target region as expected.

• Journal of Broadcast Engineering
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• v.22 no.2
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• pp.207-213
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• 2017

In order to accurately perform multispectral imaging using a multiplexed illumination, intensity of illumination in a scene must be uniform. For image acquisition that requires accurate color information, even if not multispectral imaging, the illumination information must be accurate, and a flat light source or illumination calibration is performed for accurate illumination characteristics. In this paper, we propose a method of color correction to uniformly illuminate an image with non-uniform illumination intensity. The proposed method uses multispectral imaging instead of illumination calibration for color correction. First of all, we perform multispectral imaging with two images obtained from non-uniformity illumination to acquire spectral reflectance. The obtained reflection spectrum is relit as the illumination characteristic of the image obtained from general planar light such as fluorescent light or sunlight. By comparing the image obtained by relighting with the uniformly illuminated image, the non-uniformity of the illumination is confirmed, and the color correction is performed as the image obtained from the uniform image. It is expected that the experimental results will confirm whether the non-uniformity of the illumination is uniformly corrected and reduce the restriction of illumination in obtaining the color information of the image.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.15 no.11
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• pp.6702-6709
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• 2014

In this study, a susceptibility weighted image (SWI) showed a wrapped phase and a non-uniformity of the rapid susceptibility difference. Consequently, the bandwidth limits at low frequency were improved by applying HPF. From November 2013 to March 2014, a three-dimensional SWI was obtained from patients and compared with the existing images and HPF phase images. The maximum and minimum signal intensity differences and non-uniformity were analyzed. As a result, a high pass filter before and after applying the maximum and minimum of the signal intensity difference was decreased by 274.16% (498.98), and the non-uniformity was decreased by 439.55% (19.83). After applying the HPF, a comparison with the existing phase images revealed the HPF phase images to have high signal and image uniformity of the SWI image. A high pass filter method can effectively remove the non-uniformity and improve the overall image quality.

• Journal of the Semiconductor & Display Technology
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• v.22 no.4
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• pp.19-25
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• 2023

With an attempt to investigate the correlation between the internal pressure distribution of slit nozzle and the thickness uniformity of slot-coated thin films, we have performed computational fluid dynamics (CFD) simulations of slit nozzles and slot coating of high-viscosity (4,800 cPs) polydimethylsiloxane (PDMS) using a gantry slot-die coater. We have calculated the coefficient of variation (CV) to quantify the pressure and velocity distributions inside the slit nozzle and the thickness non-uniformity of slot-coated PDMS films. The pressure distribution inside the cavity and the velocity distribution at the outlet are analyzed by varying the shim thickness and flow rate. We have shown that the cavity pressure uniformity and film thickness uniformity are enhanced by reducing the shim thickness. It is addressed that the CV value of the cavity pressure that can ensure the thickness non-uniformity of less than 5% is equal to and less than 1%, which is achievable with the shim thickness of 150 ㎛. It is also found that as the flow rate increases, the average cavity pressure is increased with the CV value of the pressure unchanged and the maximum coating speed is increased. As the shim thickness is reduced, however, the maximum coating speed and flow rate decrease. The highly uniform PDMS films shows the tensile strain as high as 180%, which can be used as a stretchable substrate.

• Journal of the Korean Society of Industry Convergence
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• v.23 no.2_2
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• pp.281-288
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• 2020

In this paper, we propose a control method to solve the surface hardness non-uniformity due to flow non-uniformity occurring in the heat treatment process of marine CAM. In the water cooling method including the decarbonization method, an automation device for deformation control has been developed and applied. LSTM was used to estimate the water cooling conditions, and the proposed method was found to be meaningful by improving the prototype results.