• Journal of Biosystems Engineering
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• v.24 no.5
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• pp.439-444
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• 1999

Automated greenhouse production systems often require crop growth monitoring involving accurate quantification of plant physiological properties. Conventional methods are usually burdensome, inaccurate, and harmful to crops. A thermal image analysis system can accomplish rapid and accurate measurements of physiological-property changes of stressed crops. In this research a thermal imaging system was used to measure the leaf-temperature changes of several crops according to water deficit. Thermal images were obtained from lettuce, cucumber, pepper, and chinese cabbage plants. Results showed that there were significant differences in the temperature of stressed plants and non-stressed plants. The temperature differences between these two group of plants were 0.7 to 3$^{\circ}C$ according to species.

• Proceedings of the KSME Conference
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• 2001.11b
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• pp.711-716
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• 2001

This paper presents an information about the heat transfer characteristics of impinging jet in eletronic equipment with infrared image processing unit. There have been many experimental investigations and theoretical studies on impinging jet because of application in a wide variety of industrial process including electronic equipment. In this study, we used infrared image processing unit to visualize heat transfer characteristics of impinging jet in electronic equipment. Infrared image processing unit is one of non-contact temperature measuring methods and it is possible to minimize flow resistance and this measurement is comparatively accurate. The main parameters are nozzle exit angle $(30^{\circ},\;45^{\circ},\;60^{\circ},\;75^{\circ},\;90^{\circ})$ and distance between nozzle and heat source is fixed 6d("d" is diameter of circular nozzle(10 mm). Reynolds number is 4500.

• Proceedings of the IEEK Conference
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• 2008.06a
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• pp.1043-1044
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• 2008

In this study, a novel algorithm of the improvement residual non-uniformity (RNU) in thermal imaging system is proposed using correlated double sample signal processing. The proposed method attempts to eliminate offset variation of ROIC in IR detector causing the variation of FPA (focal plane array) temperature and suppling power. Experimental results show that the proposed method confirmed a better performance than the existing RNU system.

• Proceedings of the Korea Air Pollution Research Association Conference
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• 2004.05a
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• pp.189-190
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• 2004

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2003.06a
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• pp.569-572
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• 2003

In VLM-ST process, the fine detailed shape processing process is needed due to the use of thick sheets for layers. The developed process perform the fine detailed shape processing in VLM-ST parts using non-contact hot tool. To predict the heat-affected zone and temperature distribution of VLM-ST parts in detailed shaping, the heat flux from the tool to the surface was calculated for the finite element analysis by modeling the tool as a heat source of radiation. The dominant process parameters such as the radiated heat input, the tool speed, and the gap between the tool tip and the foam sheet (tool height) were considered in the analysis. The results showed a good agreement with the experiments.

• Proceedings of the Korean Society for Food Science of Animal Resources Conference
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• 2005.10a
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• pp.131-135
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• 2005

In general, the application of HP contributes to improvement of functionalities of meat protein. In the current study, HP allowed the lower thermal processing of restructured meat product. Low thermal processing allowed fresh-like meat color which is one of problems in hot-set restructuring, while they showed slight discolorization induced by HP. In addition, HP processing combined with thermal processing could be achieved the palatable binding strength in restructured meat product. The addition of non-meat protein had an effect in binding strength. However, they showed no effect on water binding properties at 200 MPa, especially in milk proteins such as casein and whey protein. This is probably due to protein aggregation or to increase in surface hydrophobicity under HP. This result indicates that the application of HP on meat restructuring is more significant than the addition of binders. Therefore, the application of HP has apotential benefit in restructured meat product, and further investigations are needed.

• Journal of Advanced Marine Engineering and Technology
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• v.25 no.6
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• pp.1237-1243
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• 2001

This paper presents an information about the heat transfer characteristics of impinging jet in eletronic equipment with infrared image processing unit. There have been many experimental investigations and theoretical studies on impinging jet because of application in a wide variety of industrial process including electronic equipment. In this study, we used infrared image processing unit to visualize heat transfer characteristics of impinging jet in eletronic equipment. Infrared image processing unit is one of non-contact temperature measuring methods and it is possible to minimize flow resistance and this measurement is comparatively accurate. The main parameters are distance between nozz1e and heat source. Reynolds number is 6000.

• Journal of Mechanical Science and Technology
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• v.14 no.5
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• pp.477-482
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• 2000

This study discusses a non-contact optical technique (electronic speckle pattern interferometry) that is well suited for thermal deformation measurement without any surface preparation and compensating process. Fiber reinforced plastics ($[0]_{16},\;[0/90]_{8S}$) were analyzed by ESPI to determine their thermal expansion coefficients. The thermal expansion coefficient of the transverse direction of a uniaxial composite is evaluated as $48.78{\times}10^{-6}(1/^{\circ}C)$. Also, the thermal expansion coefficient of the cross-ply laminate $[0/90]_{8S}$ is numerically estimated as $3.23{\times}10^{-6}(1/^{\circ}C)$ that is compared with that measured by ESPI.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2000.04a
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• pp.9-15
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• 2000

Flip chip assembly on organic substrates using ACAs have received much attentions due to many advantages such as easier processing, good electrical performance, lower cost, and low temperature processing compatible with organic substrates. ACAs are generally composed of epoxy polymer resin and small amount of conductive fillers (less than 10 wt. %). As a result, ACAs have almost the same CTE values as an epoxy material itself which are higher than conventional underfill materials which contains lots of fillers. Therefore, it is necessary to lower the CTE value of ACAs to obtain more reliable flip chip assembly on organic substrates using ACAs. To modify the ACA composite materials with some amount of conductive fillers, non-conductive fillers were incorporated into ACAs. In this paper, we investigated the effect of fillers on the thermo-mechanical properties of modified ACA composite materials and the reliability of flip chip assembly on organic substrates using modified ACA composite materials. For the characterization of modified ACAs composites with different content of non-conducting fillers, dynamic scanning calorimeter (DSC), and thermo-gravimetric analyzer (TGA), dynamic mechanical analyzer (DMA), and thermo-mechanical analyzer (TMA) were utilized. As the non-conducting filler content increased, CTE values decreased and storage modulus at room temperature increased. In addition, the increase in tile content of filler brought about the increase of Tg$^{DSC}$ and Tg$^{TMA}$. However, the TGA behaviors stayed almost the same. Contact resistance changes were measured during reliability tests such as thermal cycling, high humidity and temperature, and high temperature at dry condition. It was observed that reliability results were significant affected by CTEs of ACA materials especially at the thermal cycling test. Results showed that flip chip assembly using modified ACA composites with lower CTEs and higher modulus by loading non-conducting fillers exhibited better contact resistance behavior than conventional ACAs without non-conducting fillers.ers.

• Journal of the Microelectronics and Packaging Society
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• v.7 no.1
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• pp.41-49
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• 2000

Flip chip assembly on organic substrates using ACAs have received much attentions due to many advantages such as easier processing, good electrical performance, lower cost, and low temperature processing compatible with organic substrates. ACAs are generally composed of epoxy polymer resin and small amount of conductive fillers (less than 10 wt.%). As a result, ACAs have almost the same CTE values as an epoxy material itself which are higher than conventional underfill materials which contains lots of fillers. Therefore, it is necessary to lower the CTE value of ACAs to obtain more reliable flip chip assembly on organic substrates using ACAs. To modify the ACA composite materials with some amount of conductive fillers, non-conductive fillers were incorporated into ACAs. In this paper, we investigated the effect of fillers on the thermo-mechanical properties of modified ACA composite materials and the reliability of flip chip assembly on organic substrates using modified ACA composite materials. For the characterization of modified ACAs composites with different content of non-conducting fillers, dynamic scanning calorimeter (DSC), and thermo-gravimetric analyser (TGA), dynamic mechanical analyzer (DMA), and thermo-mechanical analyzer (TMA) were utilized. As the non-conducting filler content increased, CTE values decreased and storage modulus at room temperature increased. In addition, the increase in the content of filler brought about the increase of $Tg^{DSC}$ and $Tg^{TMA}$. However, the TGA behaviors stayed almost the same. Contact resistance changes were measured during reliability tests such as thermal cycling, high humidity and temperature, and high temperature at dry condition. It was observed that reliability results were significantly affected by CTEs of ACA materials especially at the thermal cycling test. Results showed that flip chip assembly using modified ACA composites with lower CTEs and higher modulus by loading non-conducting fillers exhibited better contact resistance behavior than conventional ACAs without non-conducting fillers.