• Composites Research
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• v.21 no.1
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• pp.16-21
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• 2008

The cure behavior of epoxy resin with a conventional amide-type hardener(HD) was investigated in the presence of castor oil(CO), cashew nut shell liquid(CNSL) and CNSL-formaldehyde resin(CFR) by using a dynamic differential scanning calorimetry(DSC). The activation energy of curing reaction was also calculated based on the non-isothermal DSC thermograms at various heating rates. An one-stage curing was noted in the case of epoxy resin filled with CO, while the epoxy resin with CNSL and CFR showed a two-stage curing process. A competitive cure reaction was noted for the epoxy resin/CNSL(or CFR)/HD blends. In the absence of HD, the CFR showed lower values of curing enthalpy than that of CNSL. The activation energy of epoxy resin curing increased with increasing the CNSL and CFR loading.

• Journal of the Korean Society of Combustion
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• v.16 no.3
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• pp.21-26
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• 2011

Thermal analyses are conducted to measure chemical kinetic parameters of an unknown liquid fuel with various components. Thermal Analyses are divided into two different methods such as TGA(Thermo-Gravimetric Analysis) and DSC(Differential Scanning Calorimety). Non-isothermal experimental results are analyzed by adopting TGA and they are filtered by Freeman-Carroll method. As a results of the analysis, chemical parameters of the activation temperature and the reaction order are measured to be 6128.2 K and 1.4, respectively. Furthermore, the chemical kinetic parameters are obtained by a variety of mathematical processing methods. It has been found that they show a little difference depending on the processing method.

• Proceedings of the KWS Conference
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• 2010.05a
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• pp.78-78
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• 2010

모바일 정보통신기기를 중심으로 패키지의 초소형화, 고집적화를 위해 플립칩 공법의 적용이 증가되고 있고 있으며 접속피치의 미세화에 따라 솔더 및 언더필을 사용하는 C4 공법보다 ACA(Anisotropic Conductive Adhesive), NCA (Non-conductive Adhesive) 등의 접착제를 이용하는 칩본딩 공법에 대한 요구가 증가하고 있다. 특히, NCA 공법의 경우 산업 현장의 대량생산에 대응하기 위해서는 접착제의 속경화 특성이 요구되어 진다. 일반적으로 접착제의 경화거동은 DSC(Differential Scanning Calorimeter)를 사용해 확인하지만, 수초 이내에 경화되는 접착제의 경우는 적용되기 어렵다. 본 연구에서는 이러한 전자패키지용 접착제의 속경화 거동을 효과적으로 평가할 수 있는 방법을 조사 하였다. 실험에서 사용된 접착제는 에폭시계 레진 기반에 이미다졸계 경화제를 사용한 기본적인 포뮬레이션을 사용하였고, 경화시간은 160^{\circ}C에서 1분 이내에 경화되는 특성을 가지고 있다. 경화 거동을 확인하기 위해서 isothermal DSC와 DEA(Dielectric Analysis)의 두가지 방법을 사용해 비교하였다. 두 실험 방법 모두 $160^{\circ}C$를 유지하며 경화 거동을 확인하였고, DoC(Degree of Cure)의 측정오차를 비교 분석하였다. DEA는 이온 모빌리티 변화에 따른 유전손실율을 측정하는 방법으로 80~90% 이후의 경화도는 측정되지 않았지만, 수초 이내에 경화되는 속경화 특성을 평가하기에 적합한 것으로 확인되었다.

• Bulletin of the Korean Chemical Society
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• v.32 no.7
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• pp.2369-2376
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• 2011

Effect of heat treatment of carbon nanofibers (CNF) on electrical properties and crystallization behavior of polypropylene was reported. Two types of CNFs (untreated and heat treated at 2300 $^{\circ}C$) were incorporated into polypropylene (PP) using intensive mixing. A significant drop in volume resistivity was observed with composites containing untreated 5 wt % and heat treated 3 wt % CNF. In non-isothermal crystallization studies, both untreated and heat treated CNFs acted as nucleating agents. Composites with heat treated CNFs showed a higher crystallization temperature than composites with untreated CNFs did. TEM results of CNF revealed that an irregular structure of CNFs can be converted into the continuous graphitic structure after heat treatment. Furthermore, STM showed that the higher carbonization temperature leads to the higher graphite degree which presents the larger carbon network size, suggesting that a more graphitic structure of CNFs led to a higher crystallization temperature of PP.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.33 no.5
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• pp.400-404
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• 2020

In this paper, we study the correlation between the crystallinity of semiconductive compounds for eco-friendly power cables and the dispersive properties of carbon black. The crystal structure of the polymer material is advantageous for mechanical properties and heat-resistance. However, the polymer acts as an inhibitor to the dispersibility of carbon black. The purpose of this study is to develop a TPE semiconductive compound technology. The high heat resistance and ultra-smoothness characteristics which are required for high voltage and ultra-high voltage cables should be satisfied by designing and optimizing the structure of a non-crosslinking-type eco-friendly TPE semiconductive compound. The application of excess TPE resin was found to not only inhibit the processability in the compounding process, but also reduced the dispersion properties of carbon black due to higher crystallinity. After the crystallinity of the compound was identified through DSC analysis, it was compared with the related dispersion characteristics. Through this analysis and comparison, we designed the optimal structure of the eco-friendly TPE semiconductive compound.

• Korean Journal of Materials Research
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• v.22 no.9
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• pp.454-458
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• 2012

Various adhesive materials are used in flip chip packaging for electrical interconnection and structural reinforcement. In cases of COF(chip on film) packages, low temperature bonding adhesive is currently needed for the utilization of low thermal resistance substrate films, such as PEN(polyethylene naphthalate) and PET(polyethylene terephthalate). In this study, the effects of anhydride and dihydrazide hardeners on the low-temperature snap cure behavior of epoxy based non-conductive pastes(NCPs) were investigated to reduce flip chip bonding temperature. Dynamic DSC(differential scanning calorimetry) and isothermal DEA(dielectric analysis) results showed that the curing rate of MHHPA(hexahydro-4-methylphthalic anhydride) at $160^{\circ}C$ was faster than that of ADH(adipic dihydrazide) when considering the onset and peak curing temperatures. In a die shear test performed after flip chip bonding, however, ADH-containing formulations indicated faster trends in reaching saturated bond strength values due to the post curing effect. More enhanced HAST(highly accelerated stress test) reliability could be achieved in an assembly having a higher initial bond strength and, thus, MHHPA is considered to be a more effective hardener than ADH for low temperature snap cure NCPs.

• Proceedings of the Korean Society of Propulsion Engineers Conference
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• 2009.11a
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• pp.177-180
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• 2009

This study was investigated to know the thermal decomposition for the propellant ingredients and 2 kinds of HTPE propellants. The thermal analysis of the propellant ingredients used in this study showed that the thermal stability of these materials decreases in the following order : AP > HTPE > AN > BuNENA. In addition, propellant HTPE 002 containing AN showed that an endothermic process at around $125^{\circ}C$ corresponding to the solid-solid phase change($II{\rightarrow}I$) of AN was followed by the exothermic process due to decomposition of BuNENA/AN until $200^{\circ}C$. The critical temperature, $T_c$, of thermal explosion for the propellants HTPE 001 and HTPE 002, were obtained from the non-isothermal curves at various heating rates, by using Semenov's thermal explosion theory. Kissinger's method was employed to obtain the activation energy of the thermal decomposition, and it was used to calculate the $T_c$.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.15 no.6
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• pp.4039-4045
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• 2014

The crystallization behavior of irradiated polypropylene (PP) and the blend is an important parameter for polymer processing. Blends of PP/low density polyethylene (LDPE) with different LDPE contents were prepared by melt mixing in a twin screw extruder. The effect of the LDPE content on the irradiation effectiveness of the PP/LDPE blend with trimethylolpropane-trimetacrylate (TMPTMA) as a crosslinking co-agent was investigated in conjunction with the LDPE loading in the blend. The non-isothermal crystallization and crystal structure were measured by DSC, X-ray diffraction (XRD), and polarized optical microscopy (POM). A decrease in the melting temperature of PP was observed due to irradiation, which may be due to the PP chain scissioning effect of irradiation. The Ozawa component n represents a rod shaped, disc shaped and sphere-shaped geometry of the crystal if the value corresponds to 2, 3 and 4, respectively. Based on Ozawa analysis, the values of n were 3.8 and 2.3 for the pure PP and PP blends with 30 wt% LDPE, respectively. The fact that the crystal geometry of PP changed from spherical to disc and rod shaped was confirmed by Ozawa analysis and POM. The ${\beta}$ form XRD peak of the PP/LDPE blend at $16.1^{\circ}$ disappeared after irradiation due to the crosslinking reaction.

• Applied Chemistry for Engineering
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• v.25 no.3
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• pp.318-323
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• 2014

In order to analyze the effect of maleic anhydride (MAH) content and styrene monomer (SM)/MAH mole ratio on reactive extrusion of maleic anhydride grafted random polypropylenes (MAH-g-rPP), MAH-g-rPPs were prepared by using a twin screw extruder. MAH contents were 0.5, 1.0, 3.0, and 5.0 phr and SM/initiator mole ratio was 0.0, 1.0, and 2.0. Dicumyl peroxide (DCP) was used as an initiator. The graft degree of MAH was confirmed by the existence of carbonyl group (C = O) stretching peak at $1700cm^{-1}$ from FT-IR spectrum. The degree of graft reaction increased up to 3.0 phr MAH and showed the optimum value at 1.0 SM/MAH mole ratio from the area ratio of C = O and C-H stretching peak. Thermal and crystallization properties of MAH-g-rPP and PP/MAH-g-rPP/pulp composites were investigated by DSC, TGA, XRD, and POM. There was a decrease in non-isothermal crystallization temperature of PP/MAH-g-PP/pulp composites. Based on tensile properties and SEM pictures for the fractured surface of PP/MAH-g-PP/pulp composites, MAH content of 1.0 wt% and SM/MAH mole ratio of 1.0 were the optimum formulation as the compatibilizer. The rheological properties of the composites were measured by dynamic Rheometer to compare the processability of the composites with and without compatibilizer. The power law index showed slightly low value at the composites with compatibilizer.

• Journal of the Korean Society of Propulsion Engineers
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• v.14 no.6
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• pp.31-37
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• 2010

This study was carried out to investigate the thermal decomposition and execute EIDS slow cook-off test for the propellant ingredients and 2 kinds of HTPE propellants. The thermal analysis of the propellant ingredients used in this study showed that the thermal stability of these materials decreases in the following order : AP > HTPE > AN > BuNENA. In addition, propellant HTPE 002 containing AN showed that an endothermic process at around $125^{\circ}C$ corresponding to the solid phase change(II$\rightarrow$I) of AN was followed by the exothermic process of BuNENA/AN mixture up to $200^{\circ}C$. In EIDS slow cook-off tests, HTPE 001 and HTPE 002 reacted at around $250^{\circ}C$ and $152^{\circ}C$ respectively, and both of them showed sudden temperature increase curves at $115^{\circ}C$. The critical temperatures, $T_c$, of thermal explosion for the propellants HTPE 001 and HTPE 002, were obtained from both the non-isothermal curves at various heating rates and Semenov's thermal explosion theory. Kissinger's method that was used to calculate $T_c$ was also employed to obtain the activation energies for thermal decompositions.