• Proceedings of the KSR Conference
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• 2011.05a
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• pp.154-161
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• 2011

Rail inspection is very important as damages in rail can bring about a serious railway accident. In this paper, several real-time non-destructive technologies applied or considered to be applied to damage detection of rails are described. Some limits of existing ultrasonic testing method which has been widely used for rail inspection are discussed. Non-contact type NDE methods for rail inspection and their technical problems are also described.

• Design & Manufacturing
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• v.14 no.2
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• pp.21-27
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• 2020

Recently, LCD (Liquid Crystal Display) has been replaced by OLDE (Organic Light Emitting Diode) in high resolution display industry. In the process of OLDE production, it inspects defective products by sending a signal using a probe during OLED panel inspection. At this time, the cause of the detection of failure is divided into two. One is the self-defect of the OLED panel and the other is the poor contact occurring in the process of contact between the two. The second case is unknown at the time of testing, which increases the time for retesting. To this end, we made a system that can identify in real time whether the probe is in contact during the inspection. A contact probe unit was designed for the system, and a stage system was implemented. An inspection system was constructed through S / W and circuit configuration for actual inspection. Finally, a system that can check contact and non-contact in real time was constructed.

• Smart Structures and Systems
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• v.22 no.2
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• pp.223-230
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• 2018

This study examines a non-contact laser scanning-based ultrasound system, called an angular scan pulse-echo ultrasonic propagation imager (A-PE-UPI), that uses coincided laser beams for ultrasonic sensing and generation. A laser Doppler vibrometer is used for sensing, while a diode pumped solid state (DPSS) Q-switched laser is used for generation of thermoelastic waves. A high-speed raster scanning of up to 10-kHz is achieved using a galvano-motorized mirror scanner that allows for coincided sensing and for the generation beam to perform two-dimensional scanning without causing any harm to the surface under inspection. This process allows for the visualization of longitudinal wave propagation through-the-thickness. A pulse-echo ultrasonic wave propagation imaging algorithm (PE-UWPI) is used for on-the-fly damage visualization of the structure. The presented system is very effective for high-speed, localized, non-contact, and non-destructive inspection of aerospace structures. The system is tested on an aluminum honeycomb sandwich with disbonds and a carbon fiber-reinforced plastic (CFRP) honeycomb sandwich with a layer overlap. Inspection is performed at a 10-kHz scanning speed that takes 16 seconds to scan a $100{\times}100mm^2$ area with a scan interval of 0.25 mm. Finally, a comparison is presented between angular-scanning and a linear-scanning-based pulse-echo UPI system. The results show that the proposed system can successfully visualize defects in the inspected specimens.

• Proceedings of the Korea Committee for Ocean Resources and Engineering Conference
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• 2006.11a
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• pp.41-45
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• 2006

The fabrication process of fiber placement system of carbon fiber reinforced plastic (CFRP) requires real time process control and reliable inspection to ensure quality by preventing defects such as delamination and void. Therefore, novel non-contact inspection technique is required during the non-destructive evaluation in a fiber placement system. For the inspection of delamination in CFRP, various methods to receive laser-generated ultrasound were applied by using piezoelectric transducer, air-coupled transducer, wavelet transform and scanning laser ultrasonic technique. Laser-generated ultrasound was received with a conventional piezoelectric sensor in contacting manner. Then signal characteristics due to defects were analyzed to find a factor for detecting defects. Air-coupled transducer was used for reception of laser-generated guided wave using linear slit array in order to generate high frequency guided wave. And line scan technique was used to confirm the capability of on-line application. The high frequency component of laser-generated guided wave received with piezoelectric sensor disappeared after propagating through delamination region. Nevertheless, it was failed to receive high frequency guided wave in using air-coupled transducer. The first peak of the frequency spectrum under 100kHz in the delamination region is higher than in the sound region. By using this feature, the line scanned frequency data were acquired in fully non-contact generation and reception of ultrasound. This method was proved as useful technique for detecting delamination in CFRP.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2004.10a
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• pp.836-839
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• 2004

Qualitative elevation of products is very important Part. A business racking us brains to find for qualitative elevation of products. Recently, measurement accuracy of a non-contact 3D scanner has been rapidly improving. As a result, the number application cases of non-contact 3D scanners are increasing. A non-contact 3D scanner is capable of measuring a curved surface rapidly and has high resolution. It is more affordable and potable than the CMMs, It is therefore expected to be applied more frequently in more diverse industries. Automating the measuring process using a non-contact 3D scanner and developing a technology, which allows a user to measure easily, will eventually improve the quality of products. As their inspection and analysis processes improve.

• Journal of the Institute of Electronics Engineers of Korea SP
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• v.41 no.5
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• pp.71-75
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• 2004

An efficient color compensation method is proposed to reduce the color difference between the camera based inspection system and the colorimeter based inspection system in a plasma display panel production line. The color compensation matrix can be constructed by using the relationship between RGB to XYZ conversion matrices, which are obtained by the RGB primaries and reference white chromaticity coordinates. Experimental results show that the non-contact color inspection system using the proposed color compensation method satisfactorily compensates the chromaticity coordinates acquired by the area color CCD camera to be matched to those measured by the colorimeter for various test color.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.22 no.1
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• pp.150-155
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• 2013

This work present a new method of sealing inspection system for vehicle in which foam rubber materials are used for sealing the vehicle parts. This system is composed from a devices comprising non-contact and real-time scanning on visual inspection in machine parts. We have been investigated qualitative factors that influenced on sealing system of vehicle structure which flexibly attenuated vibration and plenty of foam rubber materials having elastic property. However, there are different factors which still depended on outdated technique (personnel subjective judgment) in the performance inspection of rubber parts, specially for cross section inspection. Through a newly developed inspection system which recently applied for the production line, we successfully achieved more effective results of matching rate by about 80 % in the sealing performance inspection with 0.7% to 1.4% in the repeated errors. These are resulted from non-contacted response by CCD camera and vision program using geometry matching method. We expect that this system may be widely applied in the strict inspection parts of more diverse cross-section in future.

• 제어로봇시스템학회:학술대회논문집
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• 1997.10a
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• pp.1742-1745
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• 1997

We have developed a highly responsible probing system for inspection of electrical properties of assemble PCB$_{s}$ (printed circuit boards). However, as the duration of the impact occurring between a probe and a solder joint on PCB is very short, it is very difficult to control the harmful peak impact force and the slip motion of the probe to sufficient level only by its vorce feedback control with high gains. To overcome these disadvantages of the prototype, it needs ot obtain some information of the solder joint in advance before the contact. In addition, to guarantee the reliability of the probing task, the probing system is required to measure several points around the probale target point at high speed. There fore, to meet such requirements, we propose a new noncontaet sensor capable of detecting simultaneously position and normal vectors of the multiple points around the probable target point in real time. By using this information, we can prepare a control strategy for stable contact motion on impact. In this paper, we described measuring priniciple, design, and development of the sensor. The effectiveness of the proposed sensor is verified through a series of experiments.s.

• Journal of Mechanical Science and Technology
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• v.14 no.10
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• pp.1072-1080
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• 2000

Leakage magnetic flux (LMF) is widely used for non-contact detection of cracks. The combination of optics and LMF offers advantages such as real time inspection, elimination of electrical noise, high spatial resolution, etc. This paper describes a new nondestructive evaluation method based on an original magneto-optical inspection system, which uses a magneto-optical sensor, LMF, and an improved magnetization method. The improved magnetization method has the following characteristics: high observation sensitivity, independence of the crack orientation, and precise transcription of the geometry of a complex crack. The use of vertical magnetization enables the visualization of the length and width of a crack. The inspection system provides the images of the crack, and shows a possibility for the computation of its depth.

• Proceedings of the KSME Conference
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• 2003.11a
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• pp.1442-1447
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• 2003

Computer is a very powerful machine which is widely using for data processing, DB construction, peripheral device control, image processing etc. Consequently, many researches and developments have progressed for high performance processing unit, and other devices. Especially, the core units such as semiconductor parts are rapidly growing so that high-integration, high-performance, microminiat turization is possible. The packaging in the semiconductor industry is very important technique to de determine the performance of the system that the semiconductor is used. In this paper, the inspection of the inner defects such as delamination, void, crack, etc. in the semiconductor packages is studied. ESPI which is a non-contact, non-destructive, and full-field inspection method is used for the inner defect inspection and its results are compared with that of C-Scan method.