• Electrical & Electronic Materials
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• v.10 no.7
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• pp.706-712
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• 1997

AlN(Aluminium Nitride) thin films were prepared using by RF sputtering method on the Si(100) and Si(111) substrates as the parameters of the substrate temperature, RF power, sputtering duration and the $N_2$/Ar ratio and investigated by X-ray diffraction, IR spectrometry, n&k analyzer. For the Si(100) substrate, the AlN thin films of (101) orientation were obtained under the conditions of room temperature and the nitrogen of 60 vol.%. For the Si(111) substrate, the (002) AlN thin films were obtained under the nitrogen of 100 vol.%. In case of the thin film prepared in the condition of above 60 vol.% of the nitrogen, the average value of the surface roughness of the film was 151$\AA$. From the changes of the half widths of E$_1$[TO] phonon bands at the wavenumber of 680$cm^{-1}$ /, it were compared of the crystallinities of the films which were grown under the different conditions. The thicknesses of AlN films were decreased dramatically in the region of the nitrogen of 40~60 vol.%. Its due to the nitridation of the Al target surface and getting low of the sputtering yield by the $N_2$/Ar ratio being increased.

• Proceedings of the IEEK Conference
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• 2000.06b
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• pp.32-35
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• 2000

Oxide-nitride-oxide(ONO) structures were formed by sequential radio frequency reactive magnetron sputtering method. The chemical composition and structure of these films were studied by using of secondary ion mass spectroscopy(SIMS) and Auger electron spectroscopy(AES) SIMS and AES experiments show the existence of nitridation at the SiO$_2$/Si substrate. The electrical characteristics of ONO films were evaluated by I-V and high frequency C-V measurements When the ONO films were annealed at 90$0^{\circ}C$ for 30 sec in $N_2$ ambient, the breakdown voltage increased and flat-band voltage decreased under high electric field.

• Korean Journal of Crystallography
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• v.3 no.1
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• pp.44-52
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• 1992

The effect of sintering atmosphere on the final properties and phase change of Ti (C, N) Cr3c2 ceramics was investigated. In the case of sintering in vacuum and N2 atmosphere, densely packed sintered body was obtained. In Ar atmosphere, however, densification was much decreased compared to sintering in vacuum and Na. XRD analysis showed that in vacuum atmosphere Cr3c2 phase was changed to Cr7c3 Phase whereas in N2 and Ar atmosphere phase change was not occurred. That is, for vacuum sintering, the formation of defects in Ti(C, N) structure occurred through de-nitridation process, and it promotes the diffusion of C in Cr3c2 and raises the densification effects. But in the case of N2 atmosphere, densification phenomenon was considered to be due to sintering mechanism that enabled formation of free carbon and removal of oxygen by free carbon and existence of carbon in the grain boundary.

• Korean Journal of Materials Research
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• v.24 no.4
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• pp.194-200
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• 2014

Metallic Cr film coatings of $1.2{\mu}m$ thickness were prepared by DC magnetron sputter deposition method on c-plane sapphire substrates. The thin Cr films were ammoniated during horizontal furnace thermal annealing for 10-240 min in $NH_3$ gas flow conditions between 400 and $900^{\circ}C$. After annealing, changes in the crystal phase and chemical constituents of the films were characterized using X-ray diffraction (XRD) and energy dispersive X-ray photoelectron spectroscopy (XPS) surface analysis. Nitridation of the metallic Cr films begins at $500^{\circ}C$ and with further increases in annealing temperature not only chromium nitrides ($Cr_2N$ and CrN) but also chromium oxide ($Cr_2O_3$) was detected. The oxygen in the films originated from contamination during the film formation. With further increase of temperature above $800^{\circ}C$, the nitrogen species were sufficiently supplied to the film's surface and transformed to the single-phase of CrN. However, the CrN phase was only available in a very small process window owing to the oxygen contamination during the sputter deposition. From the XPS analysis, the atomic concentration of oxygen in the as-deposited film was about 40 at% and decreased to the value of 15 at% with increase in annealing temperature up to $900^{\circ}C$, while the nitrogen concentration was increased to 42 at%.

• Journal of the Korean Ceramic Society
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• v.25 no.3
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• pp.261-267
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• 1988

$\beta$-Sialon powder was prepared by the reduction-nitridation reaction from the mixture of Wando Pyrophyllite and carbon black at 135$0^{\circ}C$ in $N_2$ atmosphere. $\beta$-SiC powder was added to the prepared $\beta$-Sialon powder to make $\beta$-Sialon-SiC composite. The $\beta$-Sialon-SiC composites were sintered pressurelessly at 175$0^{\circ}C$ for 2h, using $Y_2O_3$ and $ZrO_2$(monoclinic) as sintering aids. Comparatively higher values of the fracture toughness (3.8 MN/㎥/2), M.O.R. (470 MN/$m^2$) and vickers microhardness (13.7 MN/$m^2$) were obtained when 10 wt% $Y_2O_3$ was added as a sintering aid. The improved fracture toughness and M.O.R. are assumed to be the results of crack deflection and crack branching by the second phase SiC particles.

• Proceedings of the Korean Vacuum Society Conference
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• 2000.02a
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• pp.104-104
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• 2000

MOS소자의 크기가 작아짐에 따라 gate 유전막의 두께 또한 얇아져야 한다. 두께가 얇아짐에 따라 gate 유전막으로써 기존의 SiO2는 direct tunneling으로 인해 높은 누설전류를 수반한다. 그래서 높은 유전상술르 가지는 물질들에 대한 연구의 필요성이 대두되고 있다. 그중 CVD-Ta2O5는 차세대 MOSFET소자기술에 있어서 높은 유전상수($\varepsilon$r+25)와 우수한 step coverage 때문에 각광을 받고 있는 물질중에 하나이다. 본 연구에서는 Ta2O5를 gate를 유전막으로 사용하고 RTN처리와 wet oxidation을 접목시켜 이들의 전기적인 특성을 향상시킬 수 있었다. p-형 wafer 위에 D2와 O2를 사용하여 SiO2(100 )를, NH3를 이용하여 Nitridation(10 )을 전처리로써 각각 실시하였고 그 위에 MOCVD방법으로 Ta2O5를 80 성장시켰다. 첫 번째 시편은 45$0^{\circ}C$ 10min동안 wet oxidation을 시켰고, 두 번째 시편은 $700^{\circ}C$ 60sec동안 NH3 분위기에서 RTN 처리를 하였다. 세 번째 시편은 동일조건으로 RTN 처리후 wet oxidation을 하였다. 그 후 각각의 시편을 capacitor를 제작하고 그 전기적 특성을 관찰하였다. Wet oxidation만을 시킨 시편은 as-deposited Ta2O5 시편에 비해서 -1.5V에서 누설전류는 약 2~3 order정도 감소되었고 accumulation 영역에서의 capacitance 값은 oxide층의 성장(5 )을 무시하면 거의 변화하지 않았다. RTN처리만 된 시편의 경우는 -1.5V에서 누설전류는 2~3order 정도 증가되었지만, accumulation 영역에서 capacitance 값은 거의 2qwork 증가하였다. 이 두가지 공정을 접목시킨 즉 RTN 처리후 wet oxidation 처리된 시편의 경우는 as-deposited Ta2O5 시편에 비해서 -1.5V에서 누설전류는 1 order 정도 감소하였고, accumulation 지역에서의 capacitance 값은 약 2배 증가하였다. 즉 as deposited Ta2O5 시편의 accumulation 지역의 capacitance 값은 12.8 fF/um2으로써 그 유효두께는 27.0 이었지만, RTN 처리후에 wet oxidation 시킨 시편의 accumulation 지역의 capacitance값은 21.2fF/um2으로써 그 유효두께는 16.3 이 되었다. 결론적으로 as deposited Ta2O5 시편에 RTN 처리후 wet oxidation을 실시한 결과 capacitance 값이 약 2배정도 증가하였고 누설전류는 약 1 order 정도 감소됨을 확인하였다.

• Journal of the Korean Ceramic Society
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• v.26 no.6
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• pp.771-782
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• 1989

Synthesis of $\beta$-Sialon powder was attempted with carbothermal reduction of porous glass. The porous glass was prepared by heat and hydrothermal treatments of 9.32 Li2O.46.5B2O3.37.2SiO2.6.98Al2O3 glass. Carbon pyrolyzed from propane gas was deposited on the porous glass, thereafter activated carbon was added as reducing agents. The synthesized $\beta$-Sialon powder was pressureless sintered at 175$0^{\circ}C$ for 1hr in N2 atmosphere. The characterization of the $\beta$-Sialon powder was performed with XRD, BET, SEM and particle size analysis. The sinterability and mechanical properties of the sintered bodies were investigated in terms of bulk density, M.O.R., fracture toughness, morphology of microstructure and etc. The reduction effect of deposited carbon was better than that of activated carbon mechanically added. The formation of SiC was precominant over that of Si2ON2 and $\beta$-Sialon owing to low partial pressure of N2 inside the pore, wehreas on the surface of porous glass the formation of Si2ON2 and $\beta$-Sialon were predominant. Thereafter, SiC reduced unreacted glass to be $\beta$-Sialon. Single phase of $\beta$-Sialon(Z=1.92) was obtained from PGA porous glass having the largest pore radius by the simultaneous reduction and nitridation method at 145$0^{\circ}C$ for 5hrs. The bulk density, M.O.R., and KIC of the sitered body are 3.17g/cc, 434.4MPa and 4.1MPa.m1/2, respectively.

• Journal of the Korean Ceramic Society
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• v.20 no.3
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• pp.211-216
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• 1983

This work aims at characterizing silicon grains and its compacts. In order to remove iron silicon grains were washed with 5N hydrochloride at 60-7$0^{\circ}C$ for 170 hrs, and then followed the chemical analysis by atomic absorption spectrophotometer X-ray diffraction analysis SEM observation and specific surface area determination by B. E. T. Mixtures of graded silicon particles with two or three different sizes were made into packings by mechanical vibration. The mixtures were used to make compacts with 10 mm in diameter and 70mm in length by isostatically pressing at 1, 208 kg/$cm^2$ (20 kpsi) and 4, 255kg/$cm^2$ (60 kpsi) respectively. Bulk densities of packings and compacts were measured. A slip made of magnesium nitrate solution and fine silicon particles was spray-dried and then decomposed at 30$0^{\circ}C$ for the purpose of coating the uniform layer of magnesium oxide on the surface of particles. The results obtained are as follows: (1) About two thirds of iron content could be removed from silicon by washing silicon powders with hydrochloride. (2) Uniform layer of magnesium oxide on the surface of silicon could be prepared by spray-drying suspension and by decomposing it. (3) B. E. T. specific surface area of fine silicon particles was 2, 826.753$m^3$/kg. (4) In the binary system with two sizes of 40-53$\mu\textrm{m}$ particles and <10$\mu\textrm{m}$ particles the maximum bulk density of packing was 55% of theoretical value and that of compacts made at the pressure of 4, 255 kg./$cm^2$ (60 kpsi) was 73% of theoretical value. (5) In the ternary system with three sizes the maximum bulk density of packing was 1.43 g/$cm^3$and that of compacts was 1.80g/$cm^3$which is equivalent to 77.6% of theoretical value. The composition of the closest compact was consisted of 50% of 40-53$\mu\textrm{m}$ particles 20% of 10-30$\mu\textrm{m}$ particles and 30% of <10$\mu\textrm{m}$ parti-cles.

• Korean Journal of Materials Research
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• v.23 no.2
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• pp.104-111
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• 2013

In this study, GaN powders were synthesized from gallium oxide-hydroxide (GaOOH) through an ammonification process in an $NH_3$ flow with the variation of $B_2O_3$ additives within a temperature range of $300-1050^{\circ}C$. The additive effect of $B_2O_3$ on the hexagonal phase GaN powder synthesis route was examined by X-ray diffraction (XRD), X-ray photoelectron spectroscopy (XPS) and Fourier transformation infrared transmission (FTIR) spectroscopy. With increasing the mol% of $B_2O_3$ additive in the GaOOH precursor powder, the transition temperature and the activation energy for GaN powder formation increased while the GaN synthesis limit-time ($t_c$) shortened. The XPS results showed that Boron compounds of $B_2O_3$ and BN coexisted in the synthesized GaN powders. From the FTIR spectra, we were able to confirm that the GaN powder consisted of an amorphous or cubic phase $B_2O_3$ due to bond formation between B and O and the amorphous phase BN due to B-N bonds. The GaN powder synthesized from GaOOH and $B_2O_3$ mixed powder by an ammonification route through ${\beta}-Ga_2O_3$ intermediate state. During the ammonification process, boron compounds of $B_2O_3$ and BN coated ${\beta}-Ga_2O_3$ and GaN particles limited further nitridation processes.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.06a
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• pp.99-99
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• 2008

To grow the large diameter GaN with high structure and optical quality has been obtained by hydride vapor phase epitaxy(HVPE) method. In addition to the nitridation of $Al_2O_3$ substrate, we also developed a "step-growth process" to reduce or to eliminate the bowing of the GaN substrate caused by thermal mismatch during cool down after growth. The as-grown 380um thickness and 75mm diameter GaN layer was separated from the sapphire substrate by laser-induced lift-off process at $600^{\circ}C$. A problem with the free-standing wafer is the typically large bowing of such a wafer, due to the built in the defect concentration near GaN-sapphire interface. A polished G-surface of the GaN substrate were characterized by room temperature Double crystal X-ray diffraction (DCXRD), photoluminescence(PL) measurement, giving rise to the full-width at half maximum(FWHM) of the rocking curve of about 107 arcsec and dislocation density of $6.2\times10^6/cm^2$.