• Title/Summary/Keyword: nitridation

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Dielectrical Characteristics of Ultrathin Reoxidized Nitrided Oxides by Rapid Thermal Process (급속 열처리 공정에 의한 초박막 재산화 질화산화막의 유전 특성)

  • 이용재;안점영
    • The Journal of Korean Institute of Communications and Information Sciences
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    • v.16 no.11
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    • pp.1179-1185
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    • 1991
  • Ultrathin Reoxidized Nitrided Oxides were formed by lamp heated rapid thermal annealing in oxyzen at temperatures of $1050^{\circ}C$-$1100^{\circ}C$ for 20, 40 seconds. The electrical characteristics of ultrathin films were evaluated by leakage current breakdown voltage. TDDB. FN tunneling. Nitridation and reoxidition condition dependence of charge trapping properties. i.e.. the flat band voltage shift $({\Delta}V_{FB})$ and the increase of charge-to-breakdown $(Q_{BD})$ induced by a high field stress where studied. As the results of analysis. rapid thermal reoxidation was achieved striking improvement of dielectric integrity, the charge to breakdown was increased and flat band voltage shift was reduced.

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Synthesis of Nano-size Aluminum Nitride Powders by Chemical Vapor Process (화학기상공정을 이용한 나노질화알루미늄 분말 합성)

  • Pee, Jae-Hwan;Park, Jong-Chul;Kim, Yoo-Jin;Hwang, Kwang-Taek;Kim, So-Ryong
    • Journal of Powder Materials
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    • v.15 no.6
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    • pp.496-502
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    • 2008
  • Aluminum nitride (AlN) powders were prepared by the chemical vapor synthesis (CVS) process in the $AlCl_{3}-NH_{3}-N_{2}$ system. Aluminum chloride ($AlCl_3$) as the starting material was gasified in the heating chamber of $300^{\circ}C$. Aluminum chloride gas transported to the furnace in $NH_{3}-N_{2}$ atmosphere at the gas flow rate of 200-400ml/min. For samples synthesized between 700 and $1200^{\circ}C$, the XRD peaks corresponding to AlN were comparatively sharp and also showed an improvement of crystallinity with increasing the reaction temperature. In additions, the average particle size of the AlN powders decreased from 250 to 40 nm, as the reaction temperature increased.

A study on the fabrication and properties of aluminum oxynitride spinel spinel(ALON) prepared by reaction sintering method (반응소결법을 이용한 Aluminum Oxynitride Spinel(ALON) 제조 및 특성연구)

  • 장복기;이종호;백용혁;문종하;신동선;임용무
    • Journal of the Korean Crystal Growth and Crystal Technology
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    • v.9 no.3
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    • pp.320-326
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    • 1999
  • Aluminum oxynitride spinel (ALON) was synthesized by the direct melt nitridation (DMN) process using aluminum metal and aluminium oxide. The amount of ALON increased with increasing the reaction sintering temperature. The specimen containing up to 10 wt% Al showed ALON phase only when heat-treated beyond $1750^{\circ}C$. Whereas the specimen composed of more than 12 wt% Al showed unreacted AlN phase. Bulk density of reaction-sintered specimen was increased with increasing sintering temperature, except the speimen containing unreacted AlN where the density slightly decreased when heat-treated beyond $1750^{\circ}C$, Transgranular fracture mode was observed predominantly in the specimen with higher Al content.

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Synthesis of $\alpha$-Sialon Ceramics from an Alkoxide and Their Mechanical Properties(II) (알콕사이드로 부터 $\alpha$-Sialon 세라믹스의 제조 및 기계적 성질(II))

  • 이홍림;윤창현
    • Journal of the Korean Ceramic Society
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    • v.28 no.3
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    • pp.189-196
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    • 1991
  • Si(OC2H5)4, commercial AlN and Y2O3 powder were used as the precusor of Si3N4, AlN, Y2O3, respectively. After Si3N4 powder was synthesized by carbothermal reduction and nitridation at 135$0^{\circ}C$ for 13h in N2 atmosphere, characteristics of synthesized powder and the ceramics sintered at 178$0^{\circ}C$ for 1h under 30MPa were investigated. In order to evaluate the reliability of sintered body, Weibull modulus was investigated. Premixing of carbon black as a reduction agent had no effect on Si(OH)4 formation, and Si3N4 powder synthesized from Si(OC2H5)4 was $\alpha$-Si3N4 single phase. Mechanical properties of sintered body were measured as follows : flexural strength ; 750MPa, fracture toughness ; 3.71Mn/3/2, hardness : 17.4GPa, thermal shock resistence temperature ; $600^{\circ}C$. Flexural strength at room temperature was 750MPa and was retained up to 110$0^{\circ}C$. The Weibull modulus of sintered body was 10.7.

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Thermal Shock and Hot Corrosion Resistance of Si3N4 Fabricated by Nitrided Pressureless Sintering (질화상압(NPS)법으로 제조한 질화규소의 열충격 저항성 및 내부식성 특성평가)

  • Kwak, Kil-Ho;Kim, Chul;Han, In-Sub;Lee, Kee-Sung
    • Journal of the Korean Ceramic Society
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    • v.46 no.5
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    • pp.478-483
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    • 2009
  • Thermal shock and hot corrosion resistance of silicon nitride ceramics are investigated in this study. Silicon nitrides are fabricated by nitride pressureless sintering (NPS) process, which process is the continuous process of nitridation reaction of Si metal combined with subsequent pressureless sintering. The results of thermal shock test show it sustains 400MPa of initial strength during test in the designated condition of ${\Delta}T=700{\sim}25^{\circ}C$ up to maximum 4,800 cycles. Hot corrosion tests also reveal that the strength degradation of NPS silicon nitride did not occur at $700^{\circ}C$ with an exposure in Ar, $H_2$, Na and K for 1,275 h.

Fabrication of β-SiAlONs by a Reaction-Bonding Process Followed by Post-Sintering

  • Park, Young-Jo;Noh, Eun-Ah;Ko, Jae-Woong;Kim, Hai-Doo
    • Journal of the Korean Ceramic Society
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    • v.46 no.5
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    • pp.452-455
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    • 2009
  • A cost-effective route to synthesize $\beta$-SiAlONs from Si mixtures by reaction bonding followed by post-sintering was investigated. Three different z values, 0.45, 0.92 and 1.87, in $Si_{6-z}Al_zO_zN_{8-z}$ without excess liquid phase were selected to elucidate the mechanism of SiAlON formation and densification. For RBSN (reaction-bonded silicon nitride) specimens prior to post-sintering, nitridation rates of more than 90% were achieved by multistep heating to $1400^{\circ}C$ in flowing 5%$H_2$/95%$N_2$; residual Si was not detected by XRD analysis. An increase in density was acquired with increasing z values in post-sintered specimens, and this tendency was explained by the presence of higher amounts of transient liquid phase at larger z values. Measured z values from the synthesized $\beta$-SiAlONs were similar to the values calculated for the starting compositions. Slight deviations in z values between measurements and calculations were rationalized by a reasonable application of the characteristics of the nitriding and post-sintering processes.

Effects of Debinding Atmosphere on Properties of Sintered Reaction-bonded Si3N4 Prepared by Tape Casting Method

  • Park, Ji-Sook;Lee, Sung-Min;Han, Yoon-Soo;Hwang, Hae-Jin;Ryu, Sung-Soo
    • Journal of the Korean Ceramic Society
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    • v.53 no.6
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    • pp.622-627
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    • 2016
  • The effects of the debinding atmosphere on the properties of sintered reaction-bonded $Si_3N_4$ (SRBSN) ceramics prepared by tape casting method were investigated. Si green tape was produced from Si slurry of Si powder, using 11.5 wt% polyvinyl butyral as the organic binder and 35 wt% dioctyl phthalate as the plasticizer. The debinding process was conducted in air and $N_2$ atmospheres at $400^{\circ}C$ for 4 h. The nitridation process of the debinded Si specimens was performed at $1450^{\circ}C$, followed by sintering at $1850^{\circ}C$ and 20 MPa. The results revealed that the debinding atmosphere had a significant effect on $Si_3N_4$ densification and thermal conductivity. Owing to the higher sintered density and larger grain size, the thermal conductivity of $Si_3N_4$ specimens debinded in air was higher than that of the samples debinded in $N_2$. Thus, debinding in air could be suitable for the manufacture of high-performance SRBSN substrates by tape casting.

Growth of SiC film on SiNx/Si Structure (SiNx/Si 구조를 이용한 SiC 박막성장)

  • Kim, Gwang-Cheol;Park, Chan-Il;Nam, Gi-Seok;Im, Gi-Yeong
    • Korean Journal of Materials Research
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    • v.10 no.4
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    • pp.276-281
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    • 2000
  • Silicon carbide(SiC) films were grown on modified Si(111) surface with a SiNx in the NH$_3$surrounding. Thickness of SiC films was decreased with increasing of the nitridation time. Also, voids having crystal defects were removed at interface of SiC/Si according to growth parameters. SiC films were grown on SiNx/Si substrate of 100, 300 and 500nm thickness. SiC films were deposited along [111] direction and columnar grains of SiC crystal. The void-free film was observed in the interface of SiC/SiNx. This result suggests that fabrication of SiC devices are applied to SiNx replacing silicon oxide in SOI structure.

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Synthesis of Si3N4 from Domestic Silica-stone by Direct Nitriding Method (규석광으로부터 직접 질화법에 의한 질화규소의 합성)

  • Sohn Yong-Un;Joo Sung-Min;Chung Hun-Saeng
    • Korean Journal of Materials Research
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    • v.14 no.5
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    • pp.358-362
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    • 2004
  • $Si_3$$N_4$ ceramics have been identified as one of the promising structural ceramics. This study has been carried out to investigate of the synthetic behaviors of $Si_3$$N_4$ derived from domestic silica-stone by direct nitriding method. The silicon nitridation reaction has been studied in the temperature range of $1300~1550^{\circ}C$. Below the $1400^{\circ}C$, the nitriding rate was measured to be 16%. For the temperatures higher than the $1400^{\circ}C$, $\beta$-$Si_3$$N_4$ phase was formed mainly, and the nitriding rate showed above 98%. With the increasing of sample weight of silicon powder, the nitriding rate and $\beta$-$Si_3$$N_4$ phase increased at $1400^{\circ}C$ for 2 hours. The shape and particle size of$ Si_3$$N_4$ powder synthesized at $1400^{\circ}C$ for 2 hours showed the irregular angular-type and 10 $\mu\textrm{m}$, respectively.

Febrication of $Si_3-N_4$ Bonded SiC Ceramics (질화규소에 의한 SiC 소결체의 제조에 관한 연구)

  • 정주희;김종희
    • Journal of the Korean Ceramic Society
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    • v.20 no.1
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    • pp.63-69
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    • 1983
  • It is know that $Si_3-N_4$ bonded SiC has almost all the valuable properties needed for the high temperature material and thus has bery wide range of applicability. Si powder and two different sized SiC powder were used as the raw mateials. Specimens were prepared by heating the green compact mode of the raw materials with polyvinyl alcohol binder in the nitrogen atmosphere. The bond-ing of SiC particles is brought about with the formation of reaction bonded silicon nitride phase between the particles he influences of the variation of the relative amounts of the raw materials and the amount of the organic binder on the density and the bend strength of the specimens were investigated. It was shown that the calculation of the amount of the nitridation of Si is somewhat complicated matter since some portion of the organic binder reacts with the Si during the firing process. Fixing the Si amount to 20w/o the distributions of the size of the SiC particles that gives the maximum density and the maximum strnegth were obtained through experiments. It was observed that the two distributions were not equal to each other. As the amount of Si increased the amount of Si reacted with nitrogen and the strength increased. The fracture mode was intergranular for the most part and the transgranular fracture was scarcely observed.

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