• 한국재료학회지
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• 제28권8호
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• pp.466-473
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• 2018

Nickel oxide(NiO) thin films, nanorods, and carbon nanotube(CNT)/NiO core-shell nanorod structures are fabricated by sputtering Nickel at different deposition time on alumina substrates or single wall carbon nanotube templates followed by oxidation treatments at different temperatures, 400 and $700^{\circ}C$. Structural analyses are carried out by scanning electron microscopy and x-ray diffraction. NiO thinfilm, nanorod and CNT/NiO core-shell nanorod structurals of the gas sensor structures are tested for detection of $H_2S$ gas. The NiO structures exhibit the highest response at $200^{\circ}C$ and high selectivity to $H_2S$ among other gases of NO, $NH_3$, $H_2$, CO, etc. The nanorod structures have a higher sensing performance than the thin films and carbon nanotube/NiO core-shell structures. The gold catalyst deposited on NiO nanorods further improve the sensing performance, particularly the recovery kinetics.

• 전기화학회지
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• 제17권1호
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• pp.26-29
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• 2014

The corrosion behavior of stainless steel 304 (SS 304), titanium, nickel and aluminium is studied by immersion and anodic polarization tests in non-aqueous electrolytes. Tetraethyl ammonium tetrafluoroborate is used as a supporting electrolyte in the three kinds of solvents. The immersion test shows that chemical corrosion rate in propylene carbonate-based electrolyte is lower than those in acetonitrile- or ${\gamma}$-butyrolactone-based electrolytes. Surface analyses do not reveal any corrosion product formed after the immersion test. In the anodic polarization tests, a higher concentration of supporting electrolyte gives a higher current density. In addition, a higher temperature increases the current density in the active region and reduces the potential range in the passive region. SS 304 shows the highest corrosion potential while Al shows the lowest corrosion potential and the highest current density in all studied conditions. Based on the conducted corrosion tests, the corrosion resistance of metal substrates in the organic solvents can be sorted in descending order as follows: SS 304 - Ti - Ni - Al.

• 한국응용과학기술학회지
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• 제27권1호
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• pp.44-49
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• 2010

본 논문에서는 6,13-bis (triisopropylsily lethynyl)-pentacene (TIPS-pentacene) 유기 박막 트랜지스터에 니켈 버퍼층을 적층했을 때의 효과를 연구하였다. 니켈 (Nickel) / 은(Silver) 소스 드레인 전극은 은 (Silver) 전극이 단독으로 쓰일 때 보다 에너지 레벨차이를 줄여 캐리어의 주입이 더 잘되도록 도와주므로써 전기적 특성을 향상 시켜준다. 또한 유기 게이트 절연체의 추가로 TIPS-pentacene 은 규칙적 배열된 형태를 가지므로써 소자 성능의 향상을 가지고 온다. 제작한 유기박막트랜지스터 에서 $0.01\;cm^2$의 포화영역 이동도를 얻을 수 있었으며, 또한 드레인 전압을 50 V로 하고 게이트 전압을 20 V에서 -50 V 까지 인가하였을 때 $2{\times}10^4$의 전멸 비를 얻을 수 있었다. 이러한 결과를 polyethylene terephthalate (PET) 기판을 이용한 유연한 OTFTs 에 적용시켜본 결과 유리기판위에 제작했을 때와 비슷한 성능을 얻음을 확인하였다.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2008년도 추계학술대회 논문집 Vol.21
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• pp.276-276
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• 2008

Transparent and conducting indium tin oxide (ITO) and ITO/Nickel/ITO(INI) multilayered films were prepared on glass substrates by a magnetron sputtering without intentional substrate heating. The RF(13.56MHz) and DC power were applied to ITO and Nickel target, respectively. The thickness of ITO, Ni and ITO films were kept constantly at 50, 5 and 45 nm. In order to consider the effect of post deposition vacuum annealing in vacuum on the physical and optoeletrical properties of INI films, optical transmittance, electrical resistivity, crystallinity of the films were analyzed. From the observed result, it may conclude that the optoelectrical properties of the INI films were dependent on the post deposition annealing. For the INI films annealed at $300^{\circ}C$, the films have a polycrystalline structure with (110), (200), (210), (211) and (300). The resistivity of the films were $4.0\times10^{-4}{\Omega}cm$ at room temperature. As the annealing($300^{\circ}C$), resistivity decreased to $2.8\times10^{-4}{\Omega}cm$. And also the optical transmittance decreased from 79 to 70 % at 550nm.

• Progress in Superconductivity
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• 제7권1호
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• pp.64-68
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• 2005

We fabricated Ni-based alloy substrates for YBCO coated conductor using powder metallurgy. Tungsten and copper were selected as alloy elements due to their mutual solubility to the base element of nickel. The alloying elements were mixed with nickel using ball milling and dried in air. The powder mixtures were packed in a rubber mold, cold isostatic pressed 200 MPa and made into rods. The compacted rods were sintered at $1150^{\circ}C$ for 6 hours for densification. It was confirmed by neutron diffraction experiment that W and Cu atoms made complete solid solution with Ni. Lattice constant of nickel alloy increased by $0.004{\AA}$ for 1at. $\%$ W in Ni-W alloy, $0.0006{\AA}$ for 1 at. $\%$ Cu in Ni-W-Cu alloy.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2014년도 제46회 동계 정기학술대회 초록집
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• pp.181.1-181.1
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• 2014

Supercapacitor is attracting growing attention for a promising energy conversion and storage device because of its desirable electrochemical properties such as rapid charge-discharge rate, high power density and long cycle life. Three-dimensional (3D) metal nanostructure has been widely studied since it can provide efficient charge transport along the 3D network in many device applications. In this work, we fabricated well-ordered 3D nickel (Ni) nanostructures using 3D-arrayed polystyrene nano-opal substrates. We also fabricated half-cell supercapacitors by electrodepositing $RuO_2$ onto these nanostructured Ni current collectors and investigated their morphological and electrochemical properties.

• 대한금속재료학회지
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• 제46권11호
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• pp.762-769
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• 2008

Hydrogenated amorphous silicon(a-Si : H) layers, 120 nm and 50 nm in thickness, were deposited on 200 $nm-SiO_2$/single-Si substrates by inductively coupled plasma chemical vapor deposition(ICP-CVD). Subsequently, 30 nm-Ni layers were deposited by E-beam evaporation. Finally, 30 nm-Ni/120 nm a-Si : H/200 $nm-SiO_2$/single-Si and 30 nm-Ni/50 nm a-Si:H/200 $nm-SiO_2$/single-Si were prepared. The prepared samples were annealed by rapid thermal annealing(RTA) from $200^{\circ}C$ to $500^{\circ}C$ in $50^{\circ}C$ increments for 30 minute. A four-point tester, high resolution X-ray diffraction(HRXRD), field emission scanning electron microscopy (FE-SEM), transmission electron microscopy (TEM), and scanning probe microscopy(SPM) were used to examine the sheet resistance, phase transformation, in-plane microstructure, cross-sectional microstructure, and surface roughness, respectively. The nickel silicide on the 120 nm a-Si:H substrate showed high sheet resistance($470{\Omega}/{\Box}$) at T(temperature) < $450^{\circ}C$ and low sheet resistance ($70{\Omega}/{\Box}$) at T > $450^{\circ}C$. The high and low resistive regions contained ${\zeta}-Ni_2Si$ and NiSi, respectively. In case of microstructure showed mixed phase of nickel silicide and a-Si:H on the residual a-Si:H layer at T < $450^{\circ}C$ but no mixed phase and a residual a-Si:H layer at T > $450^{\circ}C$. The surface roughness matched the phase transformation according to the silicidation temperature. The nickel silicide on the 50 nm a-Si:H substrate had high sheet resistance(${\sim}1k{\Omega}/{\Box}$) at T < $400^{\circ}C$ and low sheet resistance ($100{\Omega}/{\Box}$) at T > $400^{\circ}C$. This was attributed to the formation of ${\delta}-Ni_2Si$ at T > $400^{\circ}C$ regardless of the siliciation temperature. An examination of the microstructure showed a region of nickel silicide at T < $400^{\circ}C$ that consisted of a mixed phase of nickel silicide and a-Si:H without a residual a-Si:H layer. The region at T > $400^{\circ}C$ showed crystalline nickel silicide without a mixed phase. The surface roughness remained constant regardless of the silicidation temperature. Our results suggest that a 50 nm a-Si:H nickel silicide layer is advantageous of the active layer of a thin film transistor(TFT) when applying a nano-thick layer with a constant sheet resistance, surface roughness, and ${\delta}-Ni_2Si$ temperatures > $400^{\circ}C$.

• 한국환경농학회지
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• 제36권3호
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• pp.217-221
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• 2017

BACKGROUND: For the food safety of cultivated mushroom, information on the safety of agricultural by-products imported as medium substrates for mushroom cultivation is urgently needed. Therefore, this study was performed to detect the presence of heavy metals, residual pesticides, and nutrient component in the imported medium substrates. METHODS AND RESULTS: Six kinds of medium substrates imported from nine countries from 2015 to 2017 were investigated. A mercury analyzer MA-2000 and an inductively coupled plasma spectrometer OPTIMA 7000DV were used to analyze mercury, lead, arsenic, copper, nickel and cadmium. All of these heavy metals were detected at lower level than heavy metal tolerance standard level of by-product fertilizer in Korea. When 246 kinds of residual pesticides were examined by GC and HPLC, imidacloprid, thiamethoxam and carbendazim were detected from Egyptian beet pulp, Indian cottonseed meal and cottonseed hull, respectively. The content of nutrient components (water, crude ash, crude fat, crude protein and crude fiber) varied among imported countries and the medium substrates. CONCLUSION:The presence of heavy metals and residual pesticides in imported medium substrates for mushroom cultivation was confirmed. For the safe production of mushroom, this study shows that imported medium materials for mushroom cultivation need to be managed through continuous monitoring.

• 한국연소학회지
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• 제8권2호
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• pp.27-33
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• 2003

Synthesis of carbon nanomaterials on a metal substrate by an ethylene fueled inverse diffusion flame was illustrated. Stainless steel plates were used for the catalytic metal substrate. The effects of catalyst metal particles were investigated through $Fe(NO_3){_3}$ (ferric nitrate, nonahydrate) and $Ni(NO_3){_2}$ (nickel nitrate, hexahydrate). Carbon nanotubes and nanofibers with diameters of $30{\sim}70nm$ were found on the substrate for the case of using SUS304 substrates only and using them with metal nitrates. In case of using metal nitrates, due to the easy activation of the metal particles, the formation and growth of carbon nanomaterials were occurred in the lower temperature region than that of using SUS304 substrates only.

• 접착 및 계면
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• 제4권2호
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• pp.10-20
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• 2003

This paper is relative to the electroless deposition of nickel or copper films on polyimide and polytetrafluoroethylene substrates. First, it is presented an original approach of the electroless process which consists in grafting nitrogenated functionalities on the polymer surfaces via plasma or VUV-assisted treatments operating in a nitrogen-based atmosphere ($NH_3$, $N_2$), and then in catalysing the grafted surfaces in an aqueous tin-free, Pd(+2)-based solution. Adhesion of the Pd(+2) catalytic species on polymer surfaces is explained by the formation of strong covalent bonds between these species and the grafted nitrogenated groups. Second, it is show how a fragmentation test performed in conjunction with electrical measurements can be used to characterize the practical adhesion of the electroless coatings deposited on flexible polymer substrates, and to evidence the influence of some experimental parameters (plasma treatment time and nature of the gas phase).