• Journal of Advanced Marine Engineering and Technology
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• 제29권1호
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• pp.34-41
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• 2005

An experimental study of molecular motions on a liquid-vapor interface is limited due to micro-scale characteristics of a system with an angstrom or a nanometer size Therefore, in recent, many studies for micro-scale systems have been conducted by a computer simulation because it is free from experimental limitations. In this study, through the molecular dynamic (MD) method. molecular behavior was clarified on a liquid-vapor interface and a criterion to distinguish between liquid and vapor was suggested by a potential energy and the number of neighboring molecules. At an interface. the potential energy of a molecule was increased but the number of neighboring molecules was decreased when the molecule moved into a vapor region from a liquid region, and vice versa.

• 한국결정성장학회지
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• 제12권5호
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• pp.253-258
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• 2002

나노 복합체는 제 2상의 크기가 나노 사이즈인 복합체를 의미한다. 이러한 복합체는 제 2상이 마이크론 사이즈인 경우와 다른 독특한 특성을 나타내는 것으로 보고되며, 특별히 기계적 특성이 많이 향상되는 것으로 보고되고 있다. 하지만 이러한 나노 복합체가 전자세라믹 재료의 특성을 어떻게 변화시키는지에 대한 연구는 아직 미비한 편이다 본 연구에서는 PNN-PZT/Ag나노복합체를 고온 고압 소결법에 의하여 제조하였으며, 미세구조적, 유전적 특성에 대하여 고찰하였다.

• 한국공작기계학회:학술대회논문집
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• 한국공작기계학회 2002년도 춘계학술대회 논문집
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• pp.422-428
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• 2002

In this study, actuator, sensor, guide, power transmission element and control method are considered for ultra-precision positioning apparatus. Through previous process, single plane X-Y stage with ultra-precision positioning is manufactured. Global stage for the purpose of materialization with robust system, is combined by using AC servo motor and ball screw and rolling guide. And ultra-precision positioning system is developed by micro stage with elastic hinge type and piezo element. global servo and micro servo for the purpose of materialization positioning accuracy with nm(nanometer) are controlled simultaneously by using incremental encoder and laser interferometer as displacement measurement sensor. Through previous process, ultra-precision positioning system (100mm stroke and ${\pm}$ 10nm positioning accuracy) with single plane X-Y stage are materialized.

• 한국생산제조학회지
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• 제21권2호
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• pp.246-251
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• 2012

Pulse electrochemical polishing process has been used to improve mechanical properties such as surface roughness and corrosion resistance on conductive metallic materials. In addition, pulse electrochemical polishing process with various frequency may produce a lustrous, smoother, deburred and cleaned surface on workpiece. The aim of this paper is to study surface characteristics of pulse electrochemical polishing for various frequency conditions using AFM to verify localized surface variation in nanometer scale.

• 한국정밀공학회지
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• 제26권2호
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• pp.118-125
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• 2009

This paper reports the size classification of nanoparticles as well as electrical tuning techniques for the cut-off diameter and collection efficiency. Classifying particles < 100 nm in diameter is quite a technical challenge using a virtual impactor with the cut-off diameter being determined geometrically. However, the proposed virtual impactor can classify particles <100 nm and tune the cut-off diameter by electrically accelerating the particles. The cut-off diameter of the proposed device was tuned from 15 to 50nm.

• 한국정밀공학회지
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• 제23권1호
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• pp.97-104
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• 2006

ELID(Electrolytic In-process Dressing) grinding is an excellent technique for mirror grinding of various advanced metallic or nonmetallic materials. A polishing process is also required for elimination of scratches present on ELID grinded surfaces. MAP(Magnetic Assisted Polishing) has been used as polishing method due to its high polishing efficiency and to its resulting in a superior surface quality. This study is describing an effective fabrication method combining ELID and MAP of nano-precision mirror grinding for glass-lens molding mould. It also presents some techniques for achieving the nanometer roughness of the hard metals, such as WC-Co, which are extensively used in precision tooling material.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2005년도 춘계학술대회 논문집
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• pp.515-518
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• 2005

현재 정밀한 길이를 측정하기 위해서는 광 간섭계를 이용한 측정기술이 주로 사용되어지고 있다. 이러한 광 간섭계의 발전과 더불어 이보다 더 높은 분해능을 얻기 위해 광파장보다 1000배 정도 짧은 엑스선을 이용한 변위 측정 기술개발이 진행되고 있다. 본 연구에서는 이러한 엑스선을 이용한 간섭계를 제작하고, 광 간섭계와 결합된 광/엑스선 복합간섭계를 구성하여 광 간섭계가 안고 있는 자체의 비선형성이 제거된 정밀 변위 측정 시스템을 구성하였다. 그 응용으로써, 제작된 광/엑스선 복합간섭계를 이용하여 나노미터 영역에 서 사용하는 transducer의 비선형성을 측정하였다.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2002년도 춘계학술대회 논문집
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• pp.203-206
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• 2002

One of the ever-increasing demands on the performances of heterodyne interferometers is to improve the measurement resolution, of which current state-of-the-art reaches the region of sub-nanometers. We propose a new scheme of phase-measuring electronics that reduces the measurement resolution without further increase in clock speed. Our scheme adopts a super-heterodyne technique that lowers the original beat frequency to a level of 1 MHz by mixing it with electrically generated reference signal. The technique enables us to measure the phase of Doppler shift with a resolution of 1.58 nanometer at a sampling rate of 1 MHz. To avoid the undesirable decrease in the maximum measurable speed caused by the lowered beat frequency, a special from of frequency up-down counting technique is combined with the super-heterodyning. This alloys performing required phase unwrapping simply by using programmable digital gates without 2$\pi$ ambiguities up to the maximum velocity of 2.35 m/s.

• Tribology and Lubricants
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• 제26권4호
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• pp.219-223
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• 2010

Despite the increasing need of nanometer-scale accuracy in abrasive machining using ultrasmall particles such as abrasive jet and chemical mechanical polishing(CMP), the process mechanism is still unknown. Based on the background, research on the effects of various process parameters on the machined surface at abrasive machining was motivated and performed by using finite element analysis where the effect of slurry fluid flow involved. The effect of particle shape on the machined surface during particle-surface collision was discussed in this paper. The results from FEA simulation revealed that any damage or defect generation on machined surface by the impact may occur only if the particle has enough impact energy. Therefore, it could be concluded that generation of the defects and damage on the wafer surface after CMP process was mainly due to direct contact of the 3 bodies, i.e., pad-particle-wafer.

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2003년도 춘계학술대회논문집
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• pp.448-451
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• 2003

This study describes a new maskless nano-fabrication technique of Si (100) using the combination of nanometer-scale mechanical forming by nano-indenter XP and KOH wet etching. First the surface of a Si (100) specimen was machined by using the nano-machining system, which utilizes the mechanism of the nano-indenter XP. Next, the specimen was etched by KOH solution. After the etching process, the convex structure or deeper hole is made because of masking or promotion effect of the affected layer generated by nano-machining. On the basis of this interesting fact, some sample structures were fabricated.