• 제목/요약/키워드: nano-silver ink

검색결과 39건 처리시간 0.028초

Application of Inkjet Technology in Flat Panel Display

  • Ryu, Beyong-Hwan;Choi, Young-Min
    • 한국정보디스플레이학회:학술대회논문집
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    • 한국정보디스플레이학회 2005년도 International Meeting on Information Displayvol.II
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    • pp.913-918
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    • 2005
  • It is expected that the inkjet technology offers prospect for reliable and low cost manufacturing of FPD (Flat Panel Display). This inkjet technology also offers a more simplified manufacturing process for various part of the FPD than conventional process. For example, recently the novel manufacturing processes of color filter (C/F) in LCD, or RGB patterning in OLED by inkjet printing method have been developed. This elaborates will be considered as the precious point of manufacturing process for the mass production of enlarged-display panel with a low price. On this point of view, we would like to review the status of inkjet technology in FPD, with some results on forming micro line by inkjet patterning of suspension type silver nano ink as below. We have studied the inkjet patterning of synthesized aqueous silver nano-sol on interface-controlled ITO glass substrate. Furthermore, we designed the conductive ink for direct inkjet patterning on bare ITO glass substrate. The first, the highly concentrated polymeric dispersant-assisted silver nano sol was prepared. The high concentration of batch-synthesized silver nano sol was possible to 40 wt%. At the same time the particle size of silver nanoparticles was below $10{\sim}20nm$. The second, the synthesized silver nano sol was inkjet - patterned on ITO glass substrate. The connectivity and width of fine line depended largely on the wettability of silver nano sol on ITO glass substrate, which was controlled by surfactant. The relationship was understood by wetting angle. The line of silver electrode as fine as $50{\sim}100\;{\mu}m$ was successfully formed on ITO glass substrate. The last, the direct inkjet-patternable silver nano sol on bare ITO glass substrate was designed also.

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잉크젯 프린팅 기술을 이용한 나노 금속잉크의 인쇄회로기판용 미세배선 형성 (Micro Patterning of Nano Metal Ink for Printed Circuit Board Using Inkjet Printing Technology)

  • 박성준;서상훈;정재우
    • 한국정밀공학회지
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    • 제24권5호
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    • pp.89-96
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    • 2007
  • Inkjet printing has become one of the most attractive manufacturing techniques in industry. Especially inkjet printing technology will soon be part of the PCB (Printed Circuit Board) fabrication processes. Traditional printing on PCB includes screen printing and photolithography. These technologies involve high costs, time-consuming procedures and several process steps. However, by inkjet technology manufacturing time and production costs can be reduced, and procedures can be more efficient. PCB manufacturers therefore willingly accept this inkjet technology to the PCB industry, and are quickly shifting from conventional to inkjet printing. To produce the printed circuit board by the inkjet technology, it must be harmonized with conductive nano ink, printing process, system, and inkjet printhead. In this study, micro patterning of conductive line has been investigated using the piezoelectric printhead driven by a bipolar voltage signal is used to dispense 20-40 ${\mu}m$ diameter droplets and silver nano ink which consists of 1 to 50 nm silver particles that are homogeneously suspended in an organic carrier. To fabricate a conductive line used in PCB with high precision, a printed line width was calculated and compared with printing results.

습식환원법으로 제조한 은나노 잉크의 환경 전과정 평가 (Environmental Life Cycle Assessments on Nano-silver Inks by Wet Chemical Reduction Process)

  • 이영상;홍태환
    • 청정기술
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    • 제21권2호
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    • pp.85-89
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    • 2015
  • 다양한 전자부품에 활용되는 금속 잉크 기술은 전자부품산업의 주요 기술로 자리매김하였으며 이에 대한 연구 개발이 점차 증가하고 있다. 그 중에서 실버 잉크는 뛰어난 전도성과 안정성을 가지고 있어서 전자부품산업에 오랫동안 이용되어 왔으며 최근에는 입자 크기를 나노 크기로 분산시킨 실버 나노 잉크를 개발하여 디스플레이, 전자태그, 반도체와 연성회로 기판 등에 사용되는 전자소재로써 각광받고 있다. 그러나 이러한 전자산업기기의 첨단화는 제품의 생산량과 소비량을 증가시켜 제조 공정 중에 발생되는 환경오염 물질과 사용하고 버려지는 제품들에 의해 심각한 환경 문제를 가져올 것으로 예상된다. 따라서 본 연구에서는 습식환원법에 의해 제조된 실버나노 잉크의 제조 공정이 환경에 미치는 영향을 전과정평가(life cycle assessment, LCA) 기법을 이용하여 평가하였다. 전과정 평가 소프트웨어로는 GaBi 6를 사용하였고, 유관기관으로부터 받은 실버 나노 잉크의 제조 공정 데이터를 참고하여, 인벤토리를 구축하였으며 전과정목록분석(international organization for standardization, ISO) 14040, 14044 규격의 4단계에 걸쳐 LCA를 수행하였다.

Inkjet patterning of Aqueous Silver Nano Sol on Interface-controlled ITO Glass

  • Ryu, Beyong-Hwan;Choi, Young-Min;Kong, Ki-Jeong
    • 한국정보디스플레이학회:학술대회논문집
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    • 한국정보디스플레이학회 2005년도 International Meeting on Information Displayvol.II
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    • pp.1552-1555
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    • 2005
  • We have studied the inkjet patterning of synthesized aqueous silver nano-sol on interface-controlled ITO glass substrate. Furthermore, we designed the conductive ink for direct inkjet patterning on bare ITO glass substrate. The first, the highly concentrated polymeric dispersant-assisted silver nano sol was prepared by variation of molecular weight and control of initial nucleation and growth of silver nanoparticles. The high concentration of batch-synthesized silver nano sol was possible to 40 wt%. At the same time the particle size of silver nanoparticles was below $10{\sim}20nm$. The second, the synthesized silver nano sol was inkjet - patterned on ITO glass substrate. The connectivity and width of fine line depended largely on the wettability of silver nano sol on ITO glass substrate, which was controlled by surfactant. The relationship was understood by wetting angle. The fine line of silver electrode as fine as $50{\sim}100\;{\mu}m$ was successfully formed on ITO glass substrate. The last, the direct inkjet-patternable silver nano sol on bare ITO glass substrate was designed also.

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손상 감지 모니터링을 위한 탄소섬유 복합재료와 인쇄된 은 전극 사이의 접촉저항 평가 (Evaluation of Contact Resistance between Carbon Fiber/Epoxy Composite Laminate and Printed Silver Electrode for Damage Monitoring)

  • 전은범;;김학성
    • 비파괴검사학회지
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    • 제34권5호
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    • pp.377-383
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    • 2014
  • 위치 감응형 전극 네트워크(addressable conducting network, ACN)는 탄소섬유 복합재료와 전극 사이의 접촉저항을 통해 구조물의 손상 감지가 가능하다. 손상 감지를 위한 위치 감응형 전극 네트워크의 신뢰성을 향상시키기 위해서는 전극과 복합재료 사이의 접촉저항이 최소화되어야 한다. 본 연구에서는 은 나노 전극을 탄소섬유 복합재료 위에 인쇄전자기술을 이용하여 제작하였다. 은 전극이 형성된 복합재료는 은 나노 잉크의 소결온도와 복합재료의 표면거칠기에 따라 제작되었으며, 이에 따른 접촉저항을 측정하였다. 또한, 전자주사현미경(scanning electron microscope, SEM)을 통해 전극과 복합재료 사이의 계면을 관찰하였다. 본 연구를 통해, 은 나노 잉크의 소결온도가 $120^{\circ}C$, 복합재료의 표면거칠기가 0.230a일 때, $0.3664{\Omega}$의 최소 접촉저항을 나타냈다.

잉크젯 프린팅 된 실버잉크의 뭉침 현상에 대한 해석 (The analysis of bulging phenomenon for ink-jet printed silver inks)

  • 김명기;신권용;황준영;강경태;강희석;이상호
    • 대한전기학회:학술대회논문집
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    • 대한전기학회 2009년도 제40회 하계학술대회
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    • pp.1525_1526
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    • 2009
  • In this paper, we have studied the bulging phenomenon of ink-jet printed silver lines. The used silver inks are DGP-40LT-15C and DGH-55HTG of Advanced Nano Product (ANP) Company. We investigated the behavior of bulging by changing the polarity of the inks, the surface energy of substrate and droplet spacing in printing. The contact angle of the polar inks increased much more sensitively than the nonpolar ink as the surface energy of the substrate increases. In the case of the nonpolar ink, the bulging phenomenon occurred seriously as the droplet spacing decreased at the constant surface energy.

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Film Coating and Micro - Pattering Process of Nano-particle Conductive Ink System by Using ESD Method

  • 양종원;조상현;신나리;김진열
    • 한국재료학회:학술대회논문집
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    • 한국재료학회 2011년도 춘계학술발표대회
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    • pp.238.1-238.1
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    • 2011
  • 본 연구에서는 non-contact deposition method의 일환인 ESD (electroctatic deposition)의 박막공정을 이용하여 Conductive layer 위에 Gold nanoparticles 및 Silver nanoparticles 등 organic/inorganic nano particle conductive ink system의 단분산 2D 박막을 제조를 연구하였다. ESD head를 통해 여러가지 organic / inorganic nano particle conductive ink system을 Deposition하였으며 분산도가 높고 균일한 단분산의 2차원 박막 구조를 얻을 수 있었으며, 전도성 PEDOT과의 Hybridization을 통해 균일상의 표면 Morphology를 갖는 고 전도성 투명 필름을 제작하였다. ESD technique를 이용하는 박막공정 기술은 나노입자 및 나노구조물의 박막화 패턴화를 포함하는 새로운 Deposition 기술로써 이를 응용하여 금속 나노입자의 2차원의 패턴화된 박막 구현을 통해 유기반도체 및 전자소자에의 응용성을 증거할 수 있었다.

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인쇄기법을 이용한 후막 캐패시터 제작 (Fabrication of Thick Film Capacitors with Printing Technology)

  • 이혜미;신권용;강경태;강희석;황준영;박문수;이상호
    • 대한전기학회:학술대회논문집
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    • 대한전기학회 2007년도 Techno-Fair 및 추계학술대회 논문집 전기물성,응용부문
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    • pp.100-101
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    • 2007
  • Polymer thick film capacitors were successfully fabricated by using ink-jet printing and screen printing technology. First, a bottom electrode was patterned by ink-jet printing of a nano-sized silver ink. Next, a dielectric layer was formed by the screen printing, then a top electrode was pattern by ink-jet printing of a nano-sized silver ink. The printed area of the dielectric layers were changed into $2{\times}2m^2$and $4{\times}2m^2$, and also the area of the electrodes were patterned with $1{\times}1mm^2$ and $1{\times}3mm^2$. The thickness of the printed dielectric layer was ranged from 1.1 to $1.4{\mu}m$. The analysis of capacitances verified that the capacitances was proportional to the area of the printed electrode. The capacitances of the fabricated capacitors resulted in one third of the calculated capacitances.

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초발수 현상을 이용한 나노 잉크 미세배선 제조 (Fabrication of Micro Pattern on Flexible Substrate by Nano Ink using Superhydrophobic Effect)

  • 손수정;조영상;나종주;최철진
    • 한국분말재료학회지
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    • 제20권2호
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    • pp.120-124
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    • 2013
  • This study is carried out to develop the new process for the fabrication of ultra-fine electrodes on the flexible substrates using superhydrophobic effect. A facile method was developed to form the ultra-fine trenches on the flexible substrates treated by plasma etching and to print the fine metal electrodes using conductive nano-ink. Various plasma etching conditions were investigated for the hydrophobic surface treatment of flexible polyimide (PI) films. The micro-trench on the hydrophobic PI film fabricated under optimized conditions was obtained by mechanical scratching, which gave the hydrophilic property only to the trench area. Finally, the patterning by selective deposition of ink materials was performed using the conductive silver nano-ink. The interface between the conductive nanoparticles and the flexible substrates were characterized by scanning electron microscope. The increase of the sintering temperature and metal concentration of ink caused the reduction of electrical resistance. The sintering temperature lower than $200^{\circ}C$ resulted in good interfacial bonding between Ag electrode and PI film substrate.

The ink jet printing of high conductivity circuits on various substrates using polymer capped nano-particle silver

  • Edwards, Charles O.;Howarth, James;James, Anthony
    • 한국정보디스플레이학회:학술대회논문집
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    • 한국정보디스플레이학회 2005년도 International Meeting on Information Displayvol.I
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    • pp.814-816
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    • 2005
  • In this paper, we describe how specially developed polymer capped, nano-particle silver inks can be used to print circuitry for applications like displays, RFID antennas and "disposable electronics". The requirements of printing on temperature sensitive flexible substrates (such as polymer films and papers) that require low temperature curing is also discussed.

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