• 한국분말야금학회:학술대회논문집
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• 한국분말야금학회 2006년도 Extended Abstracts of 2006 POWDER METALLURGY World Congress Part 1
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• pp.36-37
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• 2006

This study aims to investigate the usage of nano-scale particles in a micro metal injection molding ($\mu$-MIM) process. Nanoscale particle is effective to improve transcription and surface roughness in small structure. Moreover, the effects of hybrid micro/nano particles, Cu/Cu and SUS/Cu were investigated. Small dumbbell specimens were produced using various feedstocks prepared by changing binder content and fraction of nano-scale Cu particle (0.3 and $0.13{\mu}m$ in particle size). The effects of adding the fraction of nano-scale Cu powder on the melt viscosity of the feedstock, microstructure, density and tensile strength of sintered parts were discussed.

• 대한화학회지
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• 제56권1호
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• pp.159-163
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• 2012

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2004년도 추계학술대회 논문집
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• pp.355-358
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• 2004

In this study, the deformation characteristics of grain-size controlled rheology materials surfaces were investigated as a part of the research on the surface crack prediction in semi-solid formed automobile components. The microstructure of rheology Al-Si alloys consists of primary and eutectic regions. In eutectic regions the crack initiation begins with initial fracture of the eutectic silicon particles and inside other intermetallic phases. Nano-deformation characteristics in the eutectic and primary region of semi-solid aluminum alloys (356 alloy and 319 alloy) were investigated through the nanoindentation/scratch experiments and the AFM observation.

• 한국분말재료학회지
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• 제11권4호
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• pp.341-347
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• 2004

In the study, a hybrid constitutive model for densification of metallic powders was applied to cold isostatic pressing. The model is based on a pressure-dependent plasticity model for porous materials combined with a dislocation density-based viscoplastic constitutive model considering microstructural features such as grain size and inter-particle spacing. Comparison of experiment and calculated results of microscale and nanoscale Cu powders was made. This theoretical approach is useful for powder densification analysis of various powder sizes, deformation routes and powder processing methods.

• 한국표면공학회지
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• 제44권4호
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• pp.137-143
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• 2011

The internal stress and magnetic properties (coercivity and squareness) of Ni-Fe nano thin film synthesized by electrodeposition method were studied as a function of acidic chloride bath conditions (composition and temperature) and current density. Fe deposition patterns were different depending on the temperature of the solution, the stress of film decreased with increasing the solution temperature, and the depending on the amount of Fe deposition showed a parabolic shape. The grain size of film was inversely proportional to stress of thin film. The internal stress of thin film and magnetic properties were deeply relevant, and the stress of thin film had a relationship with bath conditions and grain size of the thin film surface.

• 한국재료학회지
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• 제14권11호
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• pp.795-801
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• 2004

The injection molded Fe sintered bodies were fabricated using two kinds of Fe powders haying 50 nm and $3\sim5{\mu}m$ in diameter. In the using of Fe powder having 50 nm in diameter, the comparatively dense bodies ($94\sim97\%$) were obtained even at low sintering temperature ($600\sim700^{\circ}C$), while in the sintered bodies ($1000^{\circ}C$) using $3\sim5{\mu}m$ Fe powder, their relative densities showed low values about $93\%$, although they were strongly depend on the sintering temperature and volume ratio of Fe powder and binder. In the sintered bodies using of 50 nm Fe powders, the volume shrinkage and grain size increased as the sintering temperature increased, but the values of hardness decreased. In the sample sintered at $650^{\circ}C$, the values of relative density, volume shrinkage and grain size were $96\%,\;37\%\;and\;0.97{\mu}n$, respectively and the minimum value of wear depth was obtained due to combination of fine grain and comparatively high density.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2004년도 추계학술대회 논문집 Vol.17
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• pp.416-420
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• 2004

Varistors based on M.Matsuoka were prepared from ZnO nanopowders, every one of which had bar type and about less 100nm length. The compact green disks were conventionally sintered in air for 2 hours at a temperature of $1050^{\circ}C$. The Varistors with nonlinear coefficient ${\alpha}=45$, leakage current $I_{\ell}=2{\times}10^{-7}A/cm^2$, operating voltage 9000v/cm, and average grain size $3{\mu}m$ were obtained. The advantages of the samples were due to greater structural homogenity, higher density, smaller grain size.

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2007년도 추계학술대회 논문집
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• pp.25-26
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• 2007

At the time when nanostructured materials (NSMs) are becoming a major focus of materials research, the attention of researchers is turning more to their mechanical performance. In contrast with conventional coarse grained materials, which are either strong or ductile, but rarely both at the same time, it is expected that with NSMs both high strength and ductility can be achieved and confirmed by several experimental studies. In spite of the significant interest and efforts in the mechanical properties of NSMs, deformation mechanisms during plastic deformation as well as elastic deformation are not well established yet. In this talk, the deformation mechanisms of NSMs under various grain sizes, temperatures and strain rates were investigated. It is based on recent modelling that appears to provide a conclusive description of the phenomenology and the mechanisms underlying the mechanical properties of NSMs. Based on the theoretical model that provides an adequate description of the grain size dependence of elasticity and plasticity covering all grain size range from coarse down to the nanoscale, the tensile deformation response of NSMs, especially focusing on the deformation mechanisms was investigated.

• 한국신뢰성학회지:신뢰성응용연구
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• 제14권1호
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• pp.11-19
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• 2014

A colloidal silica slurry has been manufactured by mixing nano silica powders having different grain size to improve the reliability of Sapphire wafer CMP process. The main reliability problem of CMP process such as the breaking of wafer can be prevented by reducing the size of particles in a slurry. While existing commercial colloidal silica slurries are usually made of single grain size silica powder of about 120nm, in the present study 40nm and 100nm silica powders are mixed to achieve a similar removal rate. The new colloidal silica slurry showed wafer removal rate of $3.04{\mu}m/120min$ while that of a commercial colloidal silica slurry was $3.03{\mu}m/120min$. The roughness was less than $4{\AA}$ and scratch was 0. It is also expected that the reduction of the size of nano silica particles can improve the dispersion stability and prolong the useful life of the slurry.

• 한국세라믹학회지
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• 제34권4호
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• pp.406-412
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• 1997

Al2O3/SiC hybrid-composite has been fabricated by the conventional powder process. The addition of $\alpha$-Al2O3 as seed particles in the transformation of ${\gamma}$-Al2O3 to $\alpha$-Al2O3 provided a homogeneity of the microstructure. The grain growth of Al2O3 are significantly surpressed by the addition of nano-size SiC particles. Dislocation were produced due to the difference of thermal expansion coefficient between Al2O3 and SiC and piled up on SiC particles in Al2O3 matrix, resulting in transgranular fracture. The high fracture strength of the composite was contributed to the grain refinement and the transgranular fracture mode. The addition of SiC platelets to Al2O3/SiC nano-composite decreased the fracture strength, but increased the fracture toughness. Coated SiC platelets with nitrides such as BN and Si3N4 enhanced fracture toughness much more than non-coated SiC platelets by enhancing crack deflection.