• Applied Chemistry for Engineering
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• v.23 no.3
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• pp.313-319
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• 2012

In this work, the electroplating of copper was introduced on PAN-based carbon fibers for the enhancement of mechanical interfacial strength of carbon fibers-reinforced composites. The surface properties of carbon fibers were determined by scanning electron microscopy (SEM), X-ray photoelectron spectroscopy (XPS), X-ray diffraction (XRD), and contact angle measurements. Its mechanical interfacial properties of the composites were studied by interlaminar shear strength (ILSS) and critical stress intensity factor ($K_{IC}$). From the results, it was found that the mechanical interfacial properties of Cu-plated carbon fibers-reinforced composites (Cu-CFRPs) enhanced with increasing the Cu plating time, Cu content and COOH group up to Cu-CFRP-30. However, the mechanical interfacial properties of the Cu-CFRPs decreased dramatically in the excessively Cu-plated CFRPs sample. In conclusion, the presence of Cu particles on carbon fiber surfaces can be a key factor to determine the mechanical interfacial properties of the Cu-CFRPs, but the excessive Cu content can lead the failure due to the interfacial separation between fibers and matrices in this system.

• Journal of the Microelectronics and Packaging Society
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• v.25 no.4
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• pp.75-81
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• 2018

The effect of $Ar-N_2$ plasma treatment on Cu surface as one of solutions to realize reliable Cu-Cu wafer bonding was investigated. Structural characteristic of $Ar-N_2$ plasma treated Cu surface were analyzed using X-ray diffraction, X-ray photoelectron spectroscopy, atomic force microscope. Ar gas was used for a plasma ignition and to activate Cu surface by ion bombardment, and $N_2$ gas was used to protect the Cu surface from contamination such as -O or -OH by forming a passivation layer. The Cu specimen under high Ar partial pressure plasma treatment showed more copper oxide due to the activation on Cu surface, while Cu surface after high $N_2$ gas partial pressure plasma treatment showed less copper oxide due to the formation of Cu-N or Cu-O-N passivation layer. It was confirmed that nitrogen plasma can prohibit Cu-O formation on Cu surface, but nitrogen partial pressure in the $Ar-N_2$ plasma should be optimized for the formation of nitrogen passivation layer on the entire surface of Cu wafer.

• Journal of Environmental Health Sciences
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• v.36 no.6
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• pp.480-495
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• 2010

This study evaluated the distribution of the concentrations of nano-particles and heavy metals (08-Pb, Cr, Zn, As, Fe, 09-Pb, Cr, Zn, Cu, Ni, Mn) in Seoul, Chungnam A and Gwangyang from August to December, in 2008 5 times each in the Seoul area, 5 times in and Chungnam A area and from August to November, in 2009 14 times in the Chungnam A area, 8 times in the Gwangyang area. The examined results showed high concentration level from $PM_1$ through $PM_{0.1}$ in all three areas. These results were obtained the concentration of particles by diameter and statistically significant in Stage5 (1.0-0.56 ${\mu}m$) from the result of conducting Kruskal-Wallis H test (p < 0.05). In the case of the heavy metal concentration included in 0.10-0.056 ${\mu}m$, 0.056 ${\mu}m$, the lead concentration of Chungnam Asan area was 6.49 ng/$m^3$ and 9.93 ng/$m^3$, which was higher than 3.05 ng/$m^3$ and 4.22 ng/$m^3$ of Seoul, respectively. The concentration of iron in Seoul was 9.28 ng/$m^3$ and 13.24 ng/$m^3$, that appeared higher than 2.38 ng/$m^3$ and 3.23 ng/$m^3$ of Chungnam A area, respectively. The concentration level was similar to other metals except lead and iron in Chungnam A area and Seoul. From the concentration of heavy metal included in 0.10-0.056 ${\mu}m$, 0.056 ${\mu}m$, the lead concentration of Chungnam A area was 0.31 ng/$m^3$ and 0.12 ng/$m^3$ while Gwangyang was 0.28 ng/$m^3$, 0.06 ng/$m^3$. Thus Chungnam A area showed higher lead concentration than Gwangyang. The manganese concentration of Chungnam A area was 0.12 ng/$m^3$ and 0.03 ng/$m^3$ while Gwangyang was 0.21 ng/$m^3$ and 0.08 ng/$m^3$. Therefore, the concentration of Gwangyang appeared higher than that of Chunnam A area. These two metals showed statistically significant in 0.056 ${\mu}m$ (p < 0.05, p < 0.01). Among the concentration of heavy metal in all regions, the result demonstrated that the order of higher concentration is arsenic > iron > zinc > chrome > lead > nickel > copper > manganese.

• Journal of the Korean Chemical Society
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• v.61 no.1
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• pp.29-33
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• 2017

Formation of Au particles in nonstoichiometric $Cu_{2-x}{^I}Cu{_2}^{II}O_{3-{\delta}}$ ($x{\approx}0.20$; ${\delta}{\approx}0.10$) oxide from aniline + hydrochloric acid mixtures and chloroauric acid in the ratios 30 : 1; 60 : 1; 90 : 1 (S1-S3) by volume and 0.01 mol of copper acetate, $Cu(OCOCH_3)_2.H_2O$, in each case is performed by sol-gel growth. Powder x-ray diffraction (XRD) results show Au particles are dispersed in tetragonal nonstoichiometric dicopper (I) dicopper (II) oxides, $Cu_{2-x}{^I}Cu{_2}^{II}O_{3-{\delta}}$ ($x{\approx}0.20$; ${\delta}{\approx}0.10$). Average crystallite sizes of Au particles determined using Scherrer equation are found to be in the approximate ranges ${\sim}85-140{\AA}$, ${\sim}85-150{\AA}$ and ${\sim}80-150{\AA}$ in S1-S3, respectively which indicate the formation of Au nano-micro size particles in $Cu_{2-x}{^I}Cu{_2}^{II}O_{3-{\delta}}$ ($x{\approx}0.20$; ${\delta}{\approx}0.10$) oxides. Hysteresis behaviour at 300 K having low loop areas and magnetic susceptibility values ${\sim}5.835{\times}10^{-6}-9.889{\times}10^{-6}emu/gG$ in S1-S3 show weakly ferromagnetic nature of the samples. Broad and isotropic electron paramagnetic resonance (EPR) lineshapes of S1-S4 at 300, 77 and 8 K having $g_{iso}$-values ${\sim}2.053{\pm}0.008-2.304{\pm}0.008$ show rapid spin-lattice relaxation process in magnetic $Cu^{2+}$ ($3d^9$) sites as well as delocalized electrons in Au ($6s^1$) nano-micro size particles in the $Cu_{2-x}{^I}Cu{_2}^{II}O_{3-{\delta}}$ ($x{\approx}0.20$; ${\delta}{\approx}0.10$) oxides. Broad and weak UV-Vis diffuse reflectance optical absorption band ~725 nm is assigned to $^2B_{1g}{\rightarrow}^2A_{1g}$ transitions, and the weak band ~470 nm is due to $^2B_{1g}{\rightarrow}^2E_g$ transitions from the ground state $^2B_{1g}$(${\mid}d_{x^2-y^2}$>) of $Cu^{2+}$ ($3d^9$) ions in octahedral coordination having tetragonal distortion.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.17 no.9
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• pp.718-723
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• 2016

The use of the scroll compressor in the air conditioning of medium-sized vehicles has increased because of its low torque fluctuation, high energy efficiency and low noise. In addition, the main components of the compressor have been changed from steel to aluminum to reduce its weight, following studies on the constituent materials. The processing precision of the fixed scroll and orbiting involute scroll wrap of the scroll compressor must be below $10{\mu}m$. To ensure this, the surface roughness and contour tolerance are measured. To improve the hardness of the orbiting scrolls using aluminum subjected to anodizing treatment and as the base material, we used a sealing treatment and measured the resulting characteristics. The aluminum materials were made of an Al-Mg-Cu based alloy including small amounts of Ni, Fe, and Zn. The surface roughness was less than $3{\mu}m$ and the processing accuracy was within $10{\mu}m$. Also, the hardness of the nanodiamonds with CNTs used in the sealing treatment was more than 450. This was found to improve the hardness of the material by 50% or more compared to the water sealing treatment and there was little difference between the use of carbon nanotubes and nanodiamonds as sealing materials.

• Journal of the Microelectronics and Packaging Society
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• v.28 no.2
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• pp.29-37
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• 2021

The effect of Ar/N₂ two-step plasma treatment on the quantitative interfacial adhesion energy of low temperature Cu-Cu bonding interface were systematically investigated. X-ray photoelectron spectroscopy analysis showed that Ar/N₂ 2-step plasma treatment has less copper oxide due to the formation of an effective Cu4N passivation layer. Quantitative measurements of interfacial adhesion energy of Cu-Cu bonding interface with Ar/N₂ 2-step plasma treatment were performed using a double cantilever beam (DCB) and 4-point bending (4-PB) test, where the measured values were 1.63±0.24 J/m² and 2.33±0.67 J/m², respectively. This can be explained by the increased interfacial adhesion energy according phase angle due to the effect of the higher interface roughness of 4-PB test than that of DCB test.

• Proceedings of the Materials Research Society of Korea Conference
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• 2009.11a
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• pp.29.2-29.2
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• 2009

구리는 낮은 비저항, 높은 열전도도, 우수한 electromigration(EM)저항특성 등을 바탕으로 차세대 nano-scale집적회로의 interconnect application에 적합한 금속재료로서 각광받고 있다. copper interconnect는 damascene process 를주로 이용하는데 CVD를 이용하면 step coverage가우수한 seed layer얻을 수 있어 고집적 소자의 구현이 가능하다. 최근에 비 균등화 반응(disproportionationreaction)을 이용하여 고 순도 구리박막을 제조하기위해 $\beta$-diketonate Cu(I) Lewis-base의 전구체를 많이 이용하는데 그중에서 hexafluoroacetylacetonate(hfac)Cu(I)vinyltrimethylsilane (VTMS)가 널리 이용되고 있다. 그러나 (hfac)Cu(I)(VTMS) 또는 유사계열의 전구체들은 열적안정성및 보관안정성이 부족하여 실제 양산공정에 적합하지 못한 단점이 있었다. 본 연구에 이용된 2가 전구체Cu(dmamb)2는 높은 증기압($70^{\circ}C$, 0.9torr)을 가지며 종래에 주로 이용하던 1가 전구체 (hfac)Cu(VTMS)에 비해 높은 활성화 에너지(~113 kJ/mol)를가짐으로서 열적안정성 및 보관안정성이 우수하다. 다른 한편으로 2가전구체는 안정성이 우수한 만큼 낮은 증기압을 극복하기 위해 리간드에 플루오르를 주로 치환하여 증기압을 높이는데 플루오르는 성장하는 박막의 접착력을약하게 하는 단점을 가진다. 하지만 본 연구에 사용된 Cu(dmamb)2는 리간드에 플루오르를 포함하지 않으며, 따라서 고품질의 박막을 용이한성장환경에서 제조할 수 있는 장점들을 제공한다. 비활성가스 분위기에서 2가전구체는 열에너지에 의해 리간드의 자가환원에따라 금속-리간드 분해가 발생한다. 하지만 수소분위기에서는수소가 환원제로 작용하여 리간드의 분해를 용이하게 하는 특징을 가지며 따라서 비활성분위기일 때 비해 낮은 성장온도를 가진다. 또한 수소는 잔류하는 리간드 및 불순물과 결합하여 휘발성화학종들을 생성하여 고순도의 구리박막제조를 가능하게한다.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2005.06a
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• pp.1507-1510
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• 2005

This study was carried out as a part of the research on the development of a maskless and electroless process for fabricating metal micro/nanostructures by using a nanoindenter and an electroless deposition technique. $2-\mu{m}-deep$ indentation tests on Ni and Cu samples were performed. The elastic recovery of the Ni and Cu was 9.30% and 9.53% of the maximum penetration depth, respectively. The hardness and the elastic modulus were 1.56 GPa and 120 GPa for Ni and 1.49 GPa and 100 GPa for Cu. The effect of single-point diamond machining conditions such as the Berkovich tip orientation (0, 45, and $90^{\circ}$) and the normal load (0.1, 0.3, 0.5, 1, 3, and 5 mN), on both the deformation behavior and the morphology of cutting traces (such as width and depth) was investigated by constant-load scratch tests. The tip orientation had a significant influence on the coefficient of friction, which varied from 0.52-0.66 for Ni and from 0.46-0.61 for Cu. The crisscross-pattern sample showed that the tip orientation strongly affects the surface quality of the machined area during scratching. A selective deposition of Cu at the pit-like defect on a p-type Si(111) surface was also investigated. Preferential deposition of the Cu occurred at the surface defect sites of silicon wafers, indicating that those defect sites act as active sites for the deposition reaction. The shape of the Cu-deposited area was almost the same as that of the residual stress field.

• Proceedings of the Materials Research Society of Korea Conference
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• 2011.10a
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• pp.43.2-43.2
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• 2011

Single-walled carbon nanotubes (SWCNT) are transparent in the visible and show conductivity comparable to copper, and are environmentally stable. SWCNT films have high flexibility, conductivity and transparency approaching that indium tin oxide (ITO), and can be prepared inexpensively without vacuum equipment. Transparent conducting Films (TCF) of SWCNTs has the potential to replace conventional transparent conducting oxides (TCO, e.g. ITO) in a wide variety of optoelectronic devices, energy conversion and photovoltaic industry. However, the sheet resistance of SWCNT films is still higher than ITO films. A decreased in the resistivity of SWCNT-TCFs would be beneficial for such an application. We fabricated SWCNT sheet with $KAuBr_4$ on PET substrate. Arc-discharge SWCNTs were dispersed in deionized water by adding sodum dodecyl sulfate (SDS) as surfactant and sonicated, followed by the centrifugation. The dispersed SWCNT was spray-coated on PET substrate and dried on a hotplate at $100^{\circ}C$. When the spray process was terminated, the TCF was immersed into deionized water to remove the surfactant and then it was dried on hotplate. The TCF film was then treated with AuBr4-, rinsed with deionized water and dried. The surface morphology of TCF was characterized by field emission scanning electron microscopy. The sheet resistance and optical transmission properties of the TCF were measured with a four-point probe method and a UV-visible spectrometry, respectively. $HNO_3$ treated SWCNT films with Au nano-particles have the lowest 61 ${\Omega}$/< sheet resistance in the 80% transmittance. Sheet resistance was decreased due to the increase of the hole concentration at the washed SWCNT surface by p-type doping of $AuBr_4{^-}$.

• Korean Journal of Materials Research
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• v.20 no.9
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• pp.472-477
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• 2010

$Al_2O_3$ has received wide attention with established use as a catalyst and growing application in structural or functional ceramic materials. On the other hand, the boehmite (AlO(OH)) obtained by sol-gel process has exhibited a decrease in surface area during phase transformation due to a decline in surface active site at high temperature. In this work, $Al_2O_3$-CuO/ZnO (ACZ) and $Al_2O_3$-CuO/CeO (ACC) composite materials were synthesized with aluminum isopropoxide, copper (II) nitrate hemi (pentahydrate), and cerium (III) nitrate hexahydrate or zinc (II) nitrate hexahydrate. Moreover, the Span 80 as the template block copolymer was added to the ACZ/ACC composition to make nano size particles and to keep increasing the surface area. The ACZ/ACC synthesized powders were characterized by Thermogravimetry-Differential Thermal analysis (TG/DTA), X-ray Diffractometer (XRD), Field-Emmision Scanning Electron Microscope (FE-SEM), Bruner-Emmett-Teller (BET) surface analysis and thermal electrical conductivity (ZEM-2:M8/L). An enhancement of surface area with the addition to Span 80 surfactant was observed in the ACZ powders from 105 $m^2$/g to 142 $m^2$/g, and the ACC powders from 103 $m^2$/g to 140 $m^2$/g, respectively.