• Journal of Electrical Engineering and Technology
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• v.9 no.5
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• pp.1719-1723
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• 2014

In this study, the microwave dielectric properties of nano spheroidization glass powders added $Ba(Zn_{1/3}Ta_{2/3})O_3$ ceramics prepared by solid state reaction have been investigated. Adding $(Ba_{0.4}Ca_{0.6})SiO_3$ nano spheroidization glass powders could effectively promote the densification even in the case of decreasing the sintering temperature. When the glass frit is 0.3 wt% and sintering is carried out at a temperature of $1500^{\circ}C$ for 6 hr, a temperature stable microwave dielectric ceramic could be obtained, which has a dielectric constant (${\varepsilon}_r$) of 30.2, a quality factor ($Q{\times}f_0$) of 124,000 GHz and a temperature coefficient of resonance frequency (${\tau}_f$) of $2ppm/^{\circ}C$.

• 한국정보디스플레이학회:학술대회논문집
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• 2006.08a
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• pp.973-976
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• 2006

In this paper, the inorganic multi-layer encapsulation of thin film was newly adopted to protect the organic layer from moisture and oxygen. Using the electron beam, Sputter, inorganic multi-layer thin-film encapsulation was deposited onto the Ethylene Terephthalate(PET) and their interface properties between inorganic and organic layer were investigated. In this investigation, the SiON $SiO_2$ and parylene layer showed the most suitable properties. Under these conditions, the water vapor transmission rate (WVTR) for PET can be reduced from level of $0.57g/m^2/day$ (bare substrate) to $1^{\ast}10^{-5}g/m^2/day$ after application of a SiON and $SiO_2$ layer. These results indicate that the $PET/SiO_2/SiON/Parylene$ barrier coatings have high potential for flexible organic light-emitting diode(OLED) applications.

• Corrosion Science and Technology
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• v.21 no.2
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• pp.111-120
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• 2022

To solve the corrosion problem of industrial equipment and other constructions containing metals, corrosion protection can be performed by using coating which provides a barrier between the metal and its environment. Coatings play a significant role in protecting irons and steels in harsh marine and acid environments. This study was conducted to identify an anti-corrosive epoxy coating for carbon steel composite with 0.1, 0.3, and 0.5 wt% concentrations of nanoparticles of SiO₂ using the dip-coating method. The electrochemical behavior was analyzed with open circuit potential (OCP) technics and polarization curves (Tafle) in 3.5 wt% NaCl and 5 vol% H₂SO₄ media. The structure, composition, and morphology were characterized using different analytical techniques such as X-ray Diffraction (XRD), Fourier Transform Infrared spectrum (FT-IR), and Scanning Electron Microscopy (SEM). Results revealed that epoxynano SiO₂ coating demonstrated a lower corrosion rate of 2.51 × 10^-4 mm/year and the efficiency of corrosion protection was as high as 99.77%. The electrochemical measurement showed that the nano-SiO₂ / epoxy coating enhanced the anti-corrosive performance in both NaCl and H₂SO₄ media.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.23 no.2
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• pp.86-92
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• 2013

$SF_6/O_2$ inductively coupled plasmas were employed to texture Si surface as a pretreatment for nanocrystalline diamond film growth. It was found that the $SF_6/O_2$ plasma texturing provided a very wide process window where normalized roughness values in the range of 2~16 could be obtained. Significantly improved nucleation densities of ${\sim}6.5{\times}10^{10}cm^{-2}$ compared to conventional mechanical abrasion were achieved after seeding for the textured Si substrate.

• Journal of Power System Engineering
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• v.15 no.6
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• pp.67-72
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• 2011

In the present study, crack healing effect and residual stress of $Al_2O_3$ ceramics were investigated by changing the sintering temperature and heat treatment conditions. And also it was investigated that the influence of different filler loadings of nano-sized SiC particles on the crack healing behavior of $Al_2O_3$ ceramics. The test samples were characterized by three point bend flexural tests to evaluate their mechanical properties. The morphological changes were studied by FE-SEM and EDS. The test results indicated that the $Al_2O_3$ with nano-sized SiC ceramics sintered at $1800^{\circ}C$ were showed highest density. Sintering temperature at $1800^{\circ}C$, the bending strength of heat treatment in air atmosphere specimens showed about 42 % increment in comparison to the un-heat treated specimens. The cracked specimens can be healed by heat treatment in vacuum atmosphere but the crack healing effect of $Al_2O_3$ ceramics, which is heat treated in air atmosphere was higher than that of heat treated in vacuum atmosphere. $Al_2O_3$ with 30 wt% of SiC ceramics indicated higher crack healing ability than that with 15 wt% of SiC ceramics. The FE-SEM images showed that the median cracks and pores were disappeared after heat treatment in air.

• Journal of the Korea Organic Resources Recycling Association
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• v.32 no.1
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• pp.21-29
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• 2024

In this study, EMC(Epoxy molding compound) waste from the semiconductor molding process is recycled and synthesized into silica nanoparticles, which are then applied as abrasive materials contains CMP(Chemical mechanical polishing) slurry. Specifically, silanol precursor is extracted from EMC waste according to the ultra-sonication method, which provides heat and energy, using ammonia solution as an etchant. By employing as-extracted silanol via a facile sol-gel process, uniform silica nanoparticles(e-SiO₂, experimentally synthesized SiO₂) with a size of ca. 100nm are successfully synthesized. Through physical and chemical analysis, it was confirmed that e-SiO₂ has similar properties compared to commercially available SiO₂(c-SiO₂, commercially SiO₂). For practical CMP applications, CMP slurry is prepared using e-SiO₂ as an abrasive and tested by polishing a semiconductor chip. As a result, the scratches that are roughly on the surface of the chip are successfully removed and turned into a smooth surface. Hence, the results present a recycling method of EMC waste into silica nanoparticles and the application to high-quality CMP slurry for the polishing process in semiconductor packaging.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.11a
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• pp.157-158
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• 2007

Effects of post-metallization anneal (PMA) on interface trap characteristics of Si-$SiO_2$ are studied. The conventional PMA method utilizes forming gas anneal, where 10% hydrogen in nitrogen atmosphere is used. A new PMA method utilizes hydrogen rich PECVD- silicon nitride $(SiN_x)$ film as a hydrogen diffusion source and a out-diffusion blocking layer. It can be shown through charge pumping current measurement that the new PMA is indeed effective to decrease Si-$SiO_2$ interface trap density.

• Proceedings of the Korean Vacuum Society Conference
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• 2003.08a
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• pp.119-119
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• 2003

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2010.03b
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• pp.31-31
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• 2010

Nano particles (10nm $SiO_2$) were silane-treated in order to modify the surface characteristics in a epoxy nanocomposite. Then, micro particles ($3{\mu}m$ SiO2) were poured into the epoxy nanocomposite using various mixing process and epoxy/micro-and-nanomixed composites (EMNC) were prepared. The thermal (Tg) and mechanical (tensile and flexural strength) properties were measured by DSC, DMA and UTM and the data was estimated by Weibull plot.

• 한국정보디스플레이학회:학술대회논문집
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• 2007.08b
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• pp.1305-1307
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• 2007

We show that the electrical properties of organic thinfilm transistors(OTFTs) can be enhanced by controlling the morphology of interface between screen printed electrodes and gate dielectrics. Modified surface of the insulator layer($SiO_2$) affect on the interface energy of electrode on $SiO_2$ layer. Contact angle measurement and FT-IR spectrum shows that the interface is properly modified. OTFTs device with high efficiency has been realized through modification of interface layer.