• Proceedings of the Korean Society of Precision Engineering Conference
• /
• 2003.06a
• /
• pp.1853-1856
• /
• 2003

Multi-layer printed circuit board(PCB) is being used widely for the product with relatively complex circuits such as TV, VTR and FAX. With the rapid enlargement of electronic and IT industry, the hole machining technology on multi-layer PCB is increasingly required to improve. Thus, the micro drilling with ultrasonic vibration can be a good method for hole machining. Unlike conventional drilling, ultrasonic vibration applied drilling introduces less wear and fracture of not only tool but also internal surface of workpiece due to little cutting resistance, thus, machinability can be improved. The experiment is conducted through the comparison between the results of conventional drilling and ultrasonic micro drilling as well as among each results by the variation according to not only feed rate of drill but also amplitude and frequency of ultrasonic vibration. The multi-layer PCB consists of 6 layers and ${\Phi}$0.3 diameter drill was used. As a result, it was found that the state of internal surfaces of holes on multiple layer PCBs is improved by the application of ultrasonic vibration.

• Proceedings of the KSME Conference
• /
• 2007.05a
• /
• pp.321-325
• /
• 2007

Recently, demands on thin multi-layer printed circuit boards(PCB) have been rapidly increased with broad spread of personal portable digital appliances such as multi-media. In case of mobile phone, however, the fact that PCBs have low flexural strength might cause defects. The purpose of this study is to improve the flexural strength by substituting the well-known GFRP(glass fiber reinforced plastic) for CFRP(carbon fiber reinforced plastic). Firstly, finite element simulation was carried out using ABAQUS to find out a unique CFRP layer that has a role to sustain the applied forces mainly in PCB. Secondly, three point bending tests were conducted with the newly designed CFRP PCB model to verify the improvement of the flexural strength. Consequently, it is shown that PCB layered with the CFRP on both outer sides of the board can be used to improve the flexural strength effectively.

• Proceedings of the KIPE Conference
• /
• 2003.07b
• /
• pp.781-784
• /
• 2003

In this paper, high density on-board dc/dc converter using multi-layer PCB is proposed. Recently, the communication system wants power supply of open-frame, high density and low profile. So experimental converter was consisted of 3.3V/30A Quarter Brick size DC/DC Converter. To power height limit, coil of transformer, choke and circuits were consisted of multi layer PCB. Besides to improve of efficiency, made secondary synchronous rectifier Mosfet driving circuit. So total efficiency could be improved.

• Journal of the Institute of Electronics Engineers of Korea SD
• /
• v.48 no.12
• /
• pp.73-81
• /
• 2011

As high speed digital systems continue to use components with faster edge rate and clock speeds, transmission of the digital information, it can bring about many troubles. The increasing requirement for controlled impedance PCBs becomes both a critical success factor and a design challenge to implement a system. Especially, the noise sources in high frequency digital systems include the noise in power supply, ground and packaging, and they destroy the fidelity of signals. Therefore PCB design with impendence matching is needed to improve fidelity of signal in H/W. In this paper, we have developed an impedance control and analysis tool for multi-layer PCB design, and simulates the tracks controlled impedance with the test coupon. So, it can save the design time and support the economical PCB design.

• The Transactions of the Korean Institute of Power Electronics
• /
• v.25 no.3
• /
• pp.162-170
• /
• 2020

In this paper, we report our study of the current measuring technique by implementing a pick-up coil in the PCB pattern instead of the current measuring sensor in a power converter using a WBG device. The proposed PCB pattern coil structure has a higher mutual inductance value than the conventional pattern by constructing the coil using the multi layer board. It has high sensitivity and is configured without additional process outside the PCB. In the current measurement, the integrator is measured by integrating the coil at the back end and the current waveform measured using proposed pick-up coil is confirmed by comparing it with the original current waveform through DPT simulation.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
• /
• v.17 no.11 s.114
• /
• pp.1089-1095
• /
• 2006

In this paper, the circuit analysis of three-dimensional bandpass filter with transmission zero in multi-layer printed circuit board is presented. The equivalent circuit of bandpass filter is evaluated by microwave network analysis. Compare to the established paper that have configured the circuit model of filter except the effect of distribute element, the proposed model can include the effect. As a result, the multi-layer PCB bandpass filter with transmission zero has designed by extracting mutual capacitance from electrical component inside inductor. The structure size is only $10mm{\times}20mm{\times}1.251mm$. Measured data of the bandpass filter indicate 1.9 dB of insertion loss and 28 dB of return loss at the center frequency of 1.84 GHz, as well as 43 dB attenuation at the refraction frequency of 2.78 GHz.

• The Transactions of the Korean Institute of Electrical Engineers B
• /
• v.52 no.9
• /
• pp.468-474
• /
• 2003

This paper describes the development of an open frame type high power density switching converter. It is based on the active clamp forward converter with synchronous rectifier, and packaged by using the open frame and multi-layer printed circuit board (PCB) technology to achieve the higher power density. Furthermore, the windings of transformer and inductor are also realized by multi-layer PCB so that it also contributes to achieve higher power density. Through the experiment on the prototype converter of 50[W], it is confirmed that power density of 50[W/i$n_3$] and maximum efficiency of over 91[%] are obtained.

• Proceedings of the Korean Society for Noise and Vibration Engineering Conference
• /
• 2002.05a
• /
• pp.78-81
• /
• 2002

Printed Circuit Boards for satellite are composed of multi-layered copper plate and glass epoxy. Each copper layer have the complicated and different pattern to operate correctly for its mission. Especially. copper layer give effect on the PCB stiffness seriously. But It can make more complicate to predict the exact stiffness of PCB. In KOMPSAT-2 program, too many type of PCB are used for each electronic unit, and they have different type of pattern of copper layer. Solar array regulator has two type of PCB and it will be considered for this study. In this study. we calculate the PCB board stiffness of KOMPSAT-2 SAR unit considering the concept of simplified representative volume element. It will be correlated with the test results under KOMPSAT-2 vibration environmental condition to increase the reliability of this study.

• Journal of The Institute of Information and Telecommunication Facilities Engineering
• /
• v.4 no.1
• /
• pp.31-36
• /
• 2005

In this paper, a planar type bandpass filter in multilayered PCB is presented. The multilayered PCB structure has some advantages on fabricating microwave devices such as the size reduction and ability of tight coupling by folding or embedding. The proposed BPF has two transmission zeros at the both sides of the center frequency by using independent electric and magnetic coupling structure. The designed BPF with four layer teflon PCBs of dielectric constant 2.94 has dimensions of 24x20x1.524 in mm, center frequency of 2.47GHz and bandwidth of about l00MHz. A good agrement is achieved between the measured result and the simulated one. The influences of air gaps between the layers are also analyzed and presented.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
• /
• v.17 no.6 s.109
• /
• pp.529-537
• /
• 2006

Multi-layer PCBs are of ien used In compact microwave circuit design as density of PCB layout is increased. In this paper, the crosstalk between coupled lines connected with vias in a 4-layer PCB is investigated theoretically based on the circiuit-concept approach. Coupled lines connected with vias in a 4-layer PCB are divided into three sections, which are coupled microstrip lines and upper via section, center via section, and lower via and coupled microstrip lines section, respectively. Each section is represented by ABCD matrix. By cascading these three ABCD matrices crosstalk between coupled lines connected with vias in a 4-layer PCB is approximately calculated. The validity of this theoretical approach is verified by comparing the calculated results with the simulated ones using HFSS.