• 한국전자파학회논문지
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• 제16권2호
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• pp.154-160
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• 2005

여파기는 현대 무선통신에 있어 필수 불가결한 소자이다. 본 논문에서는 LTCC 다층기술을 이용한 IEEE 802.1la WLAN 송수신기 에 응용될 수 있는 소형 대역통과 여파기를 설계, 제작하였다. 2단의 대역통과 여파기의 등가회로를 도출하기 위하여 대역통과와 J-인버터 변환을 Chebyshev 저역통과 프로토타입 여파기에 적용하였다. 병렬 L-C공진기는 복잡하며 고주파에서 인덕터의 기생 성분을 조정하기가 용이하지 않으므로 단락된 $\lambda/4$ 스트립라인 공진기 구조를 이용하였다. 각 수동소자는 서로 다른 층에 위치하고 있으며, 비아를 통하여 상호연결되어 있으며 내부 접지면에 의하여 격리되어 있다. 제작된 여파기는 $2.51\times2.27\times1.02\;mm^3$이며 6층으로 구성되어 있다. 측정된 여파기는 -2.25 dB의 삽입손실과 220 MHz의 대역폭, 5.7 GHz에서 -32.25 dB의 감쇄 특성을 나타내었으며 0.9 ns의 군지연 특성을 나타내었다.

• 마이크로전자및패키징학회지
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• 제10권1호
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• pp.19-24
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• 2003

본 연구에서는 LTCC(Low Temperature Co-firing Ceramic) 기술을 기반으로 한 적층 공정을 이용하여 최근 시장 수요가 증가하고 있는 2.4 GHz ISM(Industrial Science and Medical) 대역의 대역통과 필터를 제작하였다. 또한 제안된 설계방식은 사이즈의 초소형 필터의 구현이 가능케 하였다. $lambda/4$ 공진기의 한쪽에 부하 캐패시터를 적절히 형성시켜 공진기의 길이를 짧게 하는 효과와 더불어 공진기의 Q값과 저지대역 감쇄특성을 향상시킬 수 있었다. 제안된 필터는 결합 스트립 공진기의 커플링 계수와 외부단자 Q(Qe)값을 요구 사양에 맞게 최적화하여 이를 3차원 구조로 설계하였다. 제작된 대역통과 필터는 시뮬레이션을 통한 설계 값과 잘 일치하는 경향성을 보여주었다.

• 대한전자공학회논문지TC
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• 제45권12호
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• pp.128-132
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• 2008

본 논문에서는 LTCC(low temperature co-fired ceramic) 공정을 이용한 삽입된 수동 소자들을 갖는 필터 설계를 하였다. 우수한 성능과 소형화를 위해서 제안된 적층 구조의 기생 성분들은 제안된 회로 변환 과정을 통해 전체 필터 회로에서 긍정적인 효과를 갖도록 하였다. 그 결과 소형화된 저역 통과 필터는 다른 논문들의 소형화된 구조들에 비해 50프로 이상의 적은 두께를 갖을 뿐만 아니라 0.5 GHz와 5 GHz 사이에서 이상적인 저역 통과 필터의 응답을 보였다.

• 한국초전도ㆍ저온공학회논문지
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• 제9권1호
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• pp.18-21
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• 2007

Highly textured MgO template by ion-beam-assisted deposition(IBAD) was successfully fabricated using a continuous reel-to-reel(R2R) mode. To enlarge the deposition area, the previous IBAD system was modified into the system with 14-pass and five heating zone. Every processing step was carried out using this multi-turn IBAD system. The overall process consists of R2R electropolishing of a hastelloy C276 tape, deposition of $Al_2O_3$ diffusion barrier, $Y_2O_3$ seed layer, IBAD-MgO and homoepi-MgO layer. The IBAD-MgO templates were fabricated using the IBAD system with 216 cm-length deposition zone and 32 cm diameter ion source. The texture of MgO films developed during the IBAD process was monitored by in-situ reflection high energy electron diffraction(RHEED) to optimize the IBAD process. Recently, 100 m long IBAD-MgO tape with in-plane texture of $\Delta{\phi}<10^{\circ}$ was successfully fabricated using the modified IBAD system. In this report, the detailed deposition condition of getting a long length IBAD-MgO template with a good epitaxy is described.

• 한국수자원학회:학술대회논문집
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• 한국수자원학회 2007년도 학술발표회 논문집
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• pp.58-66
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• 2007

This paper introduces the new generic dynamic neuro-fuzzy local modeling system (DNFLMS) that is based on a dynamic Takagi-Sugeno (TS) type fuzzy inference system for complex dynamic hydrological modeling tasks. The proposed DNFLMS applies a local generalization principle and an one-pass training procedure by using the evolving clustering method to create and update fuzzy local models dynamically and the extended Kalman filtering learning algorithm to optimize the parameters of the consequence part of fuzzy local models. The proposed DNFLMS is applied to develop the inference model to forecast the flow of Waikoropupu Springs, located in the Takaka Valley, South Island, New Zealand, and the influence of the operation of the 32 Megawatts Cobb hydropower station on springs flow. It is demonstrated that the proposed DNFLMS is superior in terms of model accuracy, model complexity, and computational efficiency when compared with a multi-layer perceptron trained with the back propagation learning algorithm and well-known adaptive neural-fuzzy inference system, both of which adopt global generalization.

• 한국세라믹학회지
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• 제40권10호
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• pp.961-966
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• 2003

BiN $b_{0.975}$S $b_{0.025}$ $O_4$저온 동시 소결 세라믹 후막 및 적층 세라믹(Multi-Layer Ceramic, MLC) 공정 기술을 이용한 소형 마이크로파 필터를 설계 및 제작하였다. MLC 칩 대역 통과 필터(BPF)는 소형화와 낮은 가격이라는 장점을 가지고 있다. 제안된 필터는 stripline 공진기와 결합 캐패시터로 구성되며, IMT-2000용 단말기의 수신단 통과 대역에 적합하며 통과 대역 아래쪽 저지 대역에 감쇠극이 형성되도록 설계하였다. 상용 마이크로파 회로 및 구조 설계 tool를 이용하여 제안된 MLC칩 대역 통과 필터의 공진기 전자기적 결합량 변화 및 결합 캐패시턴스에 따른 필터의 주파수 특성, 특히 감쇠극의 위치 변화에 대해 살펴보았다. 제작된 MLC 칩 BPF의 주파수 특성은 시뮬레이션 결과와 매우 일치하였다.

• 한국재료학회지
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• 제22권8호
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• pp.403-408
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• 2012

A sample of ultra low carbon IF steel was processed by six-layer stack accumulative roll-bonding (ARB) and annealed. The ARB was conducted at ambient temperature after deforming the as-received material to a thickness of 0.5 mm by 50% cold rolling. The ARB was performed for a six-layer stacked, i.e. a 3 mm thick sheet, up to 3 cycles (an equivalent strain of ~7.0). In each ARB cycle, the stacked sheets were, first, deformed to 1.5 mm thickness by 50% rolling and then reduced to 0.5 mm thickness, as the starting thickness, by multi-pass rolling without lubrication. The specimen after 3 cycles was then annealed for 0.5 h at various temperatures ranging from 673 to 973 K. The microstructural evolution with the annealing temperature for the 3-cycle ARB processed IF steel was investigated in detail by transmission electron microscopy observation. The ARB processed IF steel exhibited mainly a dislocation cell lamella structure with relatively high dislocation density in which the subgrains were partially observed. The selected area diffraction (SAD) patterns suggested that the misorientation between neighboring cells or subgrains was very small. The thickness of the grains increased in a gradual way up to 873 K, but above 898 K it increased drastically. As a result, the grains came to have an equiaxed morphology at 898 K, in which the width and the thickness of the grains were almost identical. The grain growth occurred actively at temperatures above 923 K.

• 대한안전경영과학회지
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• 제6권4호
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• pp.155-170
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• 2004

Among the semiconductor If-chips, unlike memory chips, a majority of Application Specific IC(ASIC) products are produced by customer orders, and meeting the customer specified due date is a critical issue for the case. However, to the one who understands the nature of semiconductor manufacturing, it does not take much effort to realize the difficulty of meeting the given specific production due dates. Due to its multi-layered feature of products, to be completed, a semiconductor product(called device) enters into the fabrication manufacturing process(FAB) repeatedly as many times as the number of the product specified layers, and fabrication processes of individual layers are composed with similar but not identical unit processes. The unit process called photo-lithography is the only process where every layer must pass through. This re-entrant feature of FAB makes predicting and planning of due date of an ordered batch of devices difficult. Parallel machines problem in the photo process, which is bottleneck process, is solved with restricted roll out algorithm. Roll out algorithm is a method of solving the problem by embedding it within a dynamic programming framework. Restricted roll out algorithm Is roll out algorithm that restricted alternative states to decrease the solving time and improve the result. Results of simulation test in condition as same as real FAB facilities show the effectiveness of the developed algorithm.

• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 2009년 추계학술발표대회
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• pp.37-37
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• 2009

Due to their high corrosion resistance and improved mechanical properties super-duplex stainless steel (SDSS) are extensively used in petrochemical plants such as facilities in modern oil platform and off-shore process equipment. It is well known that the best mechanical and corrosion resistance properties of super-duplex stainless steel are obtained with a microstructure having approximately equal amounts of austenite and ferrite. And it is also known that sigma($\sigma$), chi($\chi$), secondary austenite(${\gamma}2$), chromium carbides and nitride affected adversely their properties. Therefore these phases must be avoided. However, effects of succeeding weld thermal cycle on the change of microstructure of weldment at multi-pass weld were not seldom experimentally researched. Therefore in the present work, the change of weldmetal microstructure and the effect of microstructure on pitting corrosion property at $40^{\circ}C$ by succeeding each weld thermal cycle were researched. The thermal history of root side was measured experimentally and the change of microstructure of root weld according to thermal cycle of each weld layer was evaluated. And the relationship between microstructure of root weld and pitting corrosion property at $40^{\circ}C$ was also investigated. Results of the present work are show as below. 1. The ferrite contents of root weld are gradually reduced by succeeding weld thermal cycle. 2. The 2nd phases such as sigma($\sigma$), chi($\chi$), secondary austenite(${\gamma}2$), chromium carbides and nitride are increased gradually by succeeding weld thermal cycle. 3. The pitting corrosion was detected in root weld part and weight loss by pitting corrosion is increased in proportional to the time exposed over $600^{\circ}C$ of the root weld. 4. The succeeding weld thermal cycles affect the microstructure of the former weldments and promote the formation of 2nd phases. That is, the more succeeding welds are added, the more 2nd phases are gradually increased. Consequently, it is thougth that this adversely affects pitting corrosion property.

• Journal of Welding and Joining
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• 제28권4호
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• pp.18-25
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• 2010

Super-duplex stainless steels (SDSS) have a good balance of mechanical property and corrosion resistance when they consist of approximately equal amount of austenite and ferrite. The SDSS needs to avoid the detrimental phases such as sigma(${\sigma}$), chi(${\chi}$), secondary austenite(${\gamma}2$), chromium carbide & nitride and to maintain the ratio of ferrite & austenite phase as well known. However, the effects of the subsequent weld thermal cycle were seldom experimentally studied on the micro-structural variation of weldment & pitting corrosion property. Therefore, the present study investigated the effect of the subsequent thermal cycle on the change of weld microstructure and pitting corrosion property at $40^{\circ}C$. The thermal history of root side was measured experimentally and the change of microstructure of weld root & the weight loss by pitting corrosion test were observed as a function of the thermal cycle of each weld layer. The ferrite contents of root weld were reduced with the subsequent weld thermal cycles. The pitting corrosion was occurred in the weld root region in case of the all pitted specimen & in the middle weld layer in some cases. And the weight loss by pitting corrosion was increased in proportional to the time exposed at high temperature of the root weld and also by the decrease of ferrite content. The subsequent weld thermal cycles destroy the phase balance of ferrite & austenite at the root weld. Conclusively, It is thought that as the more subsequent welds were added, the more the phase balance of ferrite & austenite was deviated from equality, therefore the pitting corrosion property was deteriorated by galvanic effect of the two phases and the increase of 2nd phases & grain boundary energy.