• 제목/요약/키워드: multi layer multi pass

검색결과 53건 처리시간 0.029초

NIR 협대역 투과 필터 응용을 위한 LED 실리콘 봉지재 위에 직접 E-beam으로 증착 된 SiO2/TiO2 다층 박막 설계 및 제작 (Design and Fabrication of SiO2/TiO2 Multi Layer Thin Films on Silicon Encapsulation of LED Deposited by E-beam Evaporation for NIR Narrow Band Pass Filter Application)

  • 김동표;김경섭;김구철;정중채
    • 한국전기전자재료학회논문지
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    • 제35권2호
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    • pp.165-171
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    • 2022
  • The SiO2/TiO2 multilayer thin films used for narrow band pass filter were fabricated using E-beam evaporation method. The narrow band pass filter was used to enhance the resolution of spectroscopy and sensor applications with near infrared (NIR) light source. The narrow band pass filter with multilayer thin films were designed with Essential Macleod program. The multilayers of SiO2/TiO2 with 32 layers were deposited on the silicon encapsulation of IR with peak wavelength (λp) of 660 nm and NIR LEDs with λp of 830 nm, 880 nm, and 955 nm. After NIR light passed through the narrow band pass filter, the full width of half maximum of 33.4~48.6 nm became narrow to 20~24 nm owing to the absorption of photons with short or long wavelength of designed band of 20 nm. The SiO2/TiO2 band pass filter fabricated in this study can be used for sensor, optoelectronics, and NIR spectroscopy applications.

다층 평면형 초고주파 필터의 설계 (A Design of Multi-layer Planar Type Microwave Filter)

  • 이홍섭;황희용
    • 정보통신설비학회논문지
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    • 제4권1호
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    • pp.31-36
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    • 2005
  • In this paper, a planar type bandpass filter in multilayered PCB is presented. The multilayered PCB structure has some advantages on fabricating microwave devices such as the size reduction and ability of tight coupling by folding or embedding. The proposed BPF has two transmission zeros at the both sides of the center frequency by using independent electric and magnetic coupling structure. The designed BPF with four layer teflon PCBs of dielectric constant 2.94 has dimensions of 24x20x1.524 in mm, center frequency of 2.47GHz and bandwidth of about l00MHz. A good agrement is achieved between the measured result and the simulated one. The influences of air gaps between the layers are also analyzed and presented.

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LPF가 집적화된 Rx/Tx 스위치 모듈에 관한 연구 (A Study on the Rx/Tx Switch Module with integrated Low Pass Filter)

  • 송재성;민복기;정순종;김인성
    • 대한전기학회논문지:전기물성ㆍ응용부문C
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    • 제54권5호
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    • pp.185-189
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    • 2005
  • This paper focuses on the design for Rx/Tx switch module of GSM(global standard mobile) band, characterization of a miniature, low power and dual-band implementation of the front-end switch module with low-pass filer And the effort to make agreement between the simulated design and the measured data for these solutions takes the place through accumulated design and manufacturing data library. We present the design, modeling and measurement of switch module integrating GSM Rx/Tx switching circuit and LPF(low pass filter) on a LTCC(low temperature co-fired ceramic) substrate. For GSM application, insertion and return loss of the low pass filter designed was less than 0.3 dB which was less than 12.7 dB at 900 MHz. The LTCC switch module contained 10 embedded passives and 3 surface mount components integrated on 4.6$\times$4.8$\times$1.2 mm, 6-layer multi-layer integrated circuit. The insertion loss of switch module measured at 900 MHz was 11 dB. In both of the design approach yielded excellent agreement between measured and simulated results.

LTCC 기술을 이용한 RF Switch Module의 집적화에 관한 연구 (A study on the integration of Rf switch module using LTCC technology)

  • 김지영;김인성;민복기;송재성;서영석;남효덕
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2004년도 하계학술대회 논문집 Vol.5 No.2
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    • pp.710-713
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    • 2004
  • The design, simulation, modeling and measurement of a low temperature co-fired ceramic (LTCC) RF switch module for GSM applications is presented in this paper. RF switch module is constructed using a Rx/Tx switching circuit and integrated low pass filter. The low pass filter function was designed to operate in th GSM band. Insertion and return loss of the low pass filter were designed less than 0.3 dB and better than 12.7 dB at 900 MHz. The RF switch module contained 10 embedded passives and 3 surface mount components integrated on $4.6{\times}4.8{\times}1.2$ nm, 6-layer multi-layer integrated circuit. The insertion loss of switch module was measured at 900 MHz was 11 dB.

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감쇠극을 갖는 적층형 세라믹 칩 필터의 설계 (Design of Multilayer Ceramic Chip Band Pass Filter with an Attenuation Pole)

  • 강종윤;심성훈;최지원;박용욱;이동윤;윤석진;김현재
    • 한국전기전자재료학회논문지
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    • 제16권8호
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    • pp.740-743
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    • 2003
  • A multi-layer ceramic (MLC) chip type band-pass filter (BPF) is presented. The MLC chip BPF has the benefits of low cost and small size. The BPF consists of coulped stripline resonators and coupling capacitors. The BPF is designed to have an attenuation pole at below the passband for a receiver band of IMT-2000 handset. The computer-aided design technology is applied for analysis of the BPF frequency characteristics. The passband and attenuation pole depend on the coupling between resonators and coupling capacitance. The frequency characterics of the passband and attenuation pole are analyzed with the variation of the coupling between resonators and coupling capacitance. An equivanlent circuit and structure of MLC chip BPF are proposed. The frequency characteristics of the BPF is well acceptable for IMT-2000 application.

A Study on the Design and Characteristics of thin-film L-C Band Pass Filter

  • Kim In-Sung;Song Jae-Sung;Min Bok-Ki;Lee Won-Jae;Muller Alexandru
    • KIEE International Transactions on Electrophysics and Applications
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    • 제5C권4호
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    • pp.176-179
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    • 2005
  • The increasing demand for high density packaging technologies and the evolution to mixed digital and analogue devices has been the con-set of increasing research in thin film multi-layer technologies such as the passive components integration technology. In this paper, Cu and TaO thin film with RF sputtering was deposited for spiral inductor and MOM capacitor on the $SiO_2$/Si(100) substrate. MOM capacitor and spiral inductor were fabricated for L-C band pass filter by sputtering and lift-off. We are analyzed and designed thin films L-C passive components for band pass filter at 900 MHz and 1.8 GHz, important devices for mobile communication system. Based on the high-Q values of passive components, MOM capacitor and spiral inductors for L-C band pass filter, a low insertion loss of L-C passive components can be realized with a minimized chip area. The insertion loss was 3 dB for a 1.8 GHz filter, and 5 dB for a 900 MHz filter. This paper also discusses a analysis and practical design to thin-film L-C band pass filter.

대규모 광학적 구현을 위한 TAG 신경회로망 모델 (TAG neural network model for large-sized optical implementation)

  • 이혁재
    • 한국광학회:학술대회논문집
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    • 한국광학회 1991년도 제6회 파동 및 레이저 학술발표회 Prodeedings of 6th Conference on Waves and Lasers
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    • pp.35-40
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    • 1991
  • In this paper, a new adaptive learning algorithm, Training by Adaptive Gain (TAG) for optical implementation of large-sized neural networks has been developed and its electro-optical implementation for 2-dimensional input and output neurons has been demostrated. The 4-dimensional global fixed interconnections and 2-dimensional adaptive gain-controls are implemented by multi-facet computer generated holograms and LCTV spatial light modulators, respectively. When the input signals pass through optical system to the output classifying layer, the TAG adaptive learning algorithm is implemented by a personal computer. The system classifies three 5$\times$5 input patterns correctly.

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熔接이음부의 形象 最適化에 關한 硏究 (A Study on the Optimization of Shape of Weld Joints)

  • 방한서;강성원
    • Journal of Welding and Joining
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    • 제15권4호
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    • pp.70-77
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    • 1997
  • Welding is one of the most important and popular joining techniques employed in structures. In spite of, weld designs depend on the rules and regulations. Moreover, the study to optimize a shape of welding joint not may be sufficient and systematic on the theoretical and experimental sides. Therefore, in this study, a computer program based on thermal elasto plastic theory is developed for optimizing(minimizing) shape of weld joints. By the results, study is made on the characteristics of the distributions of welding residual stresses and plastic strains, and their production mechanisms. Also, Various kinds of tests are carried out to find out mechanical characteristics due to shape of weld joints. As a result of this optimization(minimization) of weld joints, the productivity and the reliability will be improved.

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厚板 鋼構造物 熔接이음부의 熱分布 特性에 關한 硏究 (A Study on the Characteristics of Heat Distribution of Welded Joint on the Steel Structure with Thick Plate)

  • 방한서;김종명
    • Journal of Welding and Joining
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    • 제13권1호
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    • pp.138-144
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    • 1995
  • Recently, as the industrial structure tends to become large, the thickness of structural plate becomes thicker. Therefore, the thicker the plate of welded structure is, the larger the shape of welded joint. The effect of large heat input makes large heat affected zone(HAZ). These bring to complict welding residual stress and to weaken material, which may cause extremely harm to the safety of structures. Nevertheless, welding is design is regulated by the KS, JIS or standard in the resister of shipping such as KR, ABS or LR. However, these rules are based on rather experimental than theoretical. In this study, the computer program of heat conduction, considering un-steady state and quasi-steady state, is developed for optimizing(minimizing) a shape of welded joint. The characteristics of heat on the welded joints with various shapes are clarified by the results of the analyses.

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9% 니켈강 후판 용접부의 강도 및 잔류응력 (Welding Residual Stress and Strength of Thick 9% Nickel Steel Plate)

  • 김영균;김영완;김재훈
    • 동력기계공학회지
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    • 제18권4호
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    • pp.85-90
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    • 2014
  • In this paper, the transient thermal and residual stress analysis of the welding of 9% Ni steel plates using the FEA software ABAQUS are presented. The 9% Ni steel plates are welded manually with welding consumables of 70% Ni based Inconel type super-alloys (YAWATA WELD B (M)), producing a multi-pass/multi-layer butt weld. For these materials, temperature dependant mechanical and thermal material properties are used in the analysis. The back gouging is considered in welding process simulation. The FE thermal results are validated by comparing the real fusion profile and heat affected zone (HAZ). In addition, the continuous indentation test was conducted to measure the strength of base metal, HAZ and weld metal.