• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2003.10a
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• pp.277-280
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• 2003

It was investigated that the "ㄱ" type angle product could be bended with a curvature during extrusion by extru-bending process. The bending process for the "ㄱ" type angle product can be developed by the hot metal extru-bending machine with the two punches moving in the different velocity. Because of non-symmetry of product, it is important to design the ruled surface contour of dies cavity for the welding and bending with two billets. So it is designed that the multi-hole container has two non-symmetric holes and non-symmetric contour of dies entrance. The results of the experiment show that "ㄱ" type angle product can be bended by the extrusion process and that the curvature of the product can be controlled by the velocity of punch and that the defects such as the distortion of section and the thickness change of the product and the folding and wrinkling of the product did not happen after the bending processing by the extrusion bending machine.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2003.10a
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• pp.101-106
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• 2003

Recent electronic equipment becomes smaller, more functional, and more complex. According to these trends, LTCC(low temperature co-fired ceramic) has been emerged as a promising technology in packaging industry. It consists of multi-layer ceramic sheet, and the circuit has 3D structure. In this technology via hole formation plays an important role because it provides an electric path for the packaging interconnection network. Therefore via hole quality is very important for ensuring performance of LTCC product. Via holes are formed on the green sheet that consists of ceramic(before sintering) layer and PET(polyethylene Terephthalate) one. In this paper we found the correlation between hole quality and process condition such as ceramic thickness, and tool size. The shear behavior of double layer sheet by micro hole punching which is different from that of single layer one was also discussed.

• Journal of the Korean Vacuum Society
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• v.2 no.4
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• pp.474-479
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• 1993

Submicron contact hole filling with aluminum alloys has been achieved with a multistep metallization method, which utilizes a metal " flow" or self-diffusion process at elevated temperatures after the metal was sputter-deposited. A multi-chamber, modular sputtering system was employed to deposit aluminum alloys and subsequently to anneal the deposited metal films under vacuum at high temperatures. The film were deposited on 200 mm wafers with planar, dc magnetron sputtering sources without anysubstrate bias. The basic process steps studied for the multistep metallization include an initial layer deposition at low temperatures less than $100^{\circ}C$, and an annealin gstep at elevated temperatures, between 450 and $550^{\circ}C$. The degree of planarization or step coverage was dependent strongly upon the temperature and time of the flow step and complete filling of the submicron contacts with aluminum alloys was achieved. Responsible mechanisms for the enhancement in step coverge and factros determining uniform and reproducible flow of aluminum alloys during the high temperauture step are discussed.discussed.

• Transactions of the Korean Society for Noise and Vibration Engineering
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• v.19 no.7
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• pp.693-698
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• 2009

Various acoustic tests were carried out to investigate the acoustic performance of diesel engine exhaust silencers. In order to consider flow effects, the test facility was set up composed of fan, duct and silencer. Using the test facility, insertion loss tests were carried out to improve the acoustic performance in the low-frequency ranges. Through a series of tests, it was found out that the array resonators having multi-perforated holes inside the exhaust silencer, might be very effective in the low frequency range. Consequently, the hybrid-type silencer which is the combination of reflective silencer with array resonators and conventional absorptive silencer, was proposed and its high performance in the low-frequency range was also verified.

• Journal of Biomedical Engineering Research
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• v.12 no.1
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• pp.9-18
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• 1991

A micro- computer system has been designed to evaluate the performance of commercial infant incubator and to develope the temperature controller of new incubator. The measure- ment system used a hybrid of analog electronics for amplification, integration, and switches and micro-computer for data storage, data display, and control of relay. This approach has been applied to measure the warm-up time, temperature stability, open/close door and port- holes, and temperature distribution on the mattress. The micro-computer provides on-line ac cess of multi-point temperature data, simplifies the analog part of the circuit and gives the flexibility.

• Journal of the Semiconductor & Display Technology
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• v.5 no.2 s.15
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• pp.1-5
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• 2006

The GaN thin film on the 8 periods InGaN/GaN multi-quantum well structure was grown on the sapphire substrate using metal-organic chemical vapor deposition. The nano-scaled triangular-lattice holes with the diameter of 150 nm were patterned on a polymethylmethacrylate blocking film using an electron beam nano-lithography system. The thin slab and two-dimensional photonic crystals with the thickness of 28 nm were fabricated on the GaN layer for the blue light diffraction sources. The photonic crystal with the lattice parameter of 460 nm enhances spectral intensity of photoluminescence indicating that the photonic crystals provides the source of nano-diffraction for the blue light of the 450-nm wavelength.

• The Bulletin of The Korean Astronomical Society
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• v.39 no.2
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• pp.115-115
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• 2014

First, We will briefly introduce early science results of AGN observations with KVN and KaVA. KaVA is the combined array of the Korean VLBI network (KVN) and VLBI Exploration of Radio Astronomy (VERA). These include KaVA monitoring of M87, Sgr A* and a few bright blazars and KVN Search for circular polarized Blazars. Furthermore, we will present our future plan of monitoring observation of Sgr A* and M87 with KaVA and Low Radio Power AGN multi frequency polarization survey with KVN. Because of the largeness of their centralsuper-massive black holes, we select them as top-priority sources of our key science program (KSP). The main science goals of the KaVA KSP are (1) mapping the velocity field of the M87 jet and testing magnetically-driven-jet paradigm, and (2) obtaining tightest constraints on physical properties of radio emitting region in Sgr A. High sensitivity achieved through simultaneous multifrequency phase referencing technique of KVN will allow us to explore Low Radio Power AGN cores which build majority of AGNs and therefore are important for undestanding the evolution of AGNs and of their hosts.

• Transactions of Materials Processing
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• v.13 no.1
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• pp.65-71
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• 2004

Recent electronic equipment becomes smaller, more functional, and more complex. According to these trends, LTCC(low temperature co-fired ceramic) has been emerged as a promising technology in packaging industry. It consists of multi-layer ceramic sheet, and the circuit has 3D structure. In this technology via hole formation plays an important role because it provides an electric path for the packaging interconnection network. Therefore via hole qualify is very important for ensuring performance of LTCC product. Via holes are formed on the green sheet that consists of ceramic(before sintering) layer and PET(polyethylene terephthalate) one. In this paper we found the correlation between hole quality and process condition such as PET thickness and ceramic thickness. The shear behavior of double layer sheet by micro hole punching which is different from that of single layer one was also discussed.

• The Transactions of the Korean Institute of Electrical Engineers C
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• v.49 no.8
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• pp.433-437
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• 2000

We fabricated switch module of ATM(Asynchronous Transfer Mode) exchange system with MCM-C(MultiChip Module Co-fired) technology and measured its electrical characteristics. Green tape was used as substrate and Au/Ag paste was used to form the interconnect layers. The via holes were made by drill and filled with metal paste usign screen method. After manufacturing the substrate, chips and passive components were assembled on the substrate. In electrical test, the module showed the output signal of 46.9MHz synchronized with input signal. In the view of substrate size reduction, the area of MCM switch module was 35% of conventional hybrid switch module.

• 한국지구물리탐사학회:학술대회논문집
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• 2007.06a
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• pp.245-250
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• 2007

The small loop EM method is a fast and convenient geophysical tool which can give shallow subsurface resistivity distribution. It can be a useful alternative of resistivity method in conductive environment. We applied the multi-frequency small loop EM method for the investigation of a soft ground landfill site which was constructed on a tideland since the resistivity of the survey area is extremely low. 3D resistivity distribution was obtained by merging 1D inversion results and shallow subsurface structure can be interpreted. By comparing the result with the drilling log and measured soil resistivity sampled at 16 drill holes, we can get lot of information such as groundwater level, thickness of landfill, salinity distribution, depth to the basement and etc.