• 생태와환경
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• 제37권4호통권109호
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• pp.462-468
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• 2004

하천의 환경성 평가에서 부착조류 조사는 주로 비이동성 기질(돌, 식물, 모래, 점토 및 식물체 등)에 누적된 영향을 반영한 반면에 이동성 기질을 이용한 연구는 전무한 실정이었다. 본 연구는 소하천 생태계에서 어류 표피에 부착된 미세조류의 종조성과 군집구조를 파악하여 서식처 환경을 분석 평가하고자 시도하였다. 현장 조사에서 우점한 어류는 계류성 어종에 속하는 갈겨니 (Zacco temmincki)와 피라미 (Zacco platypus)이었고, 상대도수는 각각 62%, 19%를 차지하였다. 어류는 광역이동의 대표적인 생물로서 기존의 한 장소에 고정된 부착생물의 기질과는 비교가 될 수 있었고,어류에 부착된 미세조류의 구성으로 볼 때 하천 상하류 구간의 현재 특성을 잘 반영하였다. 부착 미세조류는 규조류가 주류를 이루었고, 다른 분류군도 소수 관찰되었다. 또한, 생태학적 측면에서 하천의 건강성을 평가하는데 유용한 기초자료로 활용될 수 있을 것으로 판단되며 향후 수환경 평가의 생물학적 도구로 제시하고자 한다.

• 마이크로전자및패키징학회지
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• 제17권4호
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• pp.49-60
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• 2010

최근 휴대폰, PDA 등과 같은 모바일 전자 기기들의 사용이 급증하면서 다기능, 고성능, 초소형의 패키지가 시장에서 요구되고 있다. 따라서 사용되는 패키지의 크기도 더 작아지고 얇아지고 있다. 패키지에 사용되는 실리콘 다이 및 기판의 두께가 점점 얇아지면서 휨 변형, 크랙 발생, 및 기타 여러 신뢰성 문제가 크게 대두되고 있다. 이러한 신뢰성 문제는 서로 다른 패키지 재료의 열팽창계수의 차이에 의하여 발생된다. 따라서 초박형의 패키지의 경우 적절한 패키지물질과 두께 및 크기 등의 선택이 매우 중요하다. 본 논문에서는 현재 모바일 기기에 주로 사용되고 있는 CABGA, fcSCP, SCSP 및 MCP (Multi-Chip Package) 패키지에 대하여 휨과 응력의 특성을 수치해석을 통하여 연구하였다. 특히 휨 현상에 영향을 줄 수 있는 여러 중요 인자들, 즉 EMC 몰드의 두께 및 물성(탄성계수 및 열팽창 계수), 실리콘 다이의 두께와 크기, 기판의 물성 등이 휨 현상에 미치는 영향을 전반적으로 고찰하였다. 이를 통하여 휨 현상 메커니즘과 이를 제어하기 위한 중요 인자를 이해함으로써 휨 현상을 최소화 하고자 하였다. 휨 해석 결과 가장 큰 휨 값을 보인 SCSP에 대하여 실험계획법의 반응표면법을 이용하여 휨이 최소화되는 최적 조합을 구하였다. SCSP 패키지에서 휨에 가장 큰 영향을 미치는 인자는 EMC 두께 및 열팽창 계수, 기판의 열팽창계수, 그리고 실리콘 다이의 두께였다. 궁극적으로 최적화 해석을 통하여 SCSP의 휨을 $10{\mu}m$로 줄일 수 있음을 알 수 있었다.

• Transactions on Electrical and Electronic Materials
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• 제13권4호
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• pp.212-214
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• 2012

Both the electrically positive and negative particles in a cell of quick response-liquid powder display (QR-LPD) are surrounded by conductive electrodes on the upper and lower substrate and the dielectric materials of the barrier ribs. Particles in a cell are attached to or detached from the other materials by image force, electric field, Coulomb's force, and Van der Waals' force. Through these forces, the moving particles form an image but induce clumping phenomena. Particles having a large kinetic energy by a large q/m value crash into the opposite electrode with high speed at a large driving voltage and quickly lose electrically charged material. As a result, these particles are clumped and degrade panel performance. The clumped particles in a cell are observed by microscopic photographs and ascertained by a response time. When the bias voltage is increased to 0.68-0.76 $V/{\mu}m$, particle clumping occurs abruptly and the response time increases sharply. This particle clumping is similarly observed after the number of driving times at the driving voltage (0.42-0.64 $V/{\mu}m$).

• 융복합기술연구소 논문집
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• 제1권2호
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• pp.6-15
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• 2011

This paper reports the design and fabrication of a micro-electro-mechanical-system(MEMS)-based electrostatic angular microactuator for a dual-stage servo. The proposed actuator employs a novel electrode pattern named "skewed electrode array(SEA)" scheme. It is shown that SEA has better linearity than a parallel plate type actuator and stronger force than a comb-drive based actuator. The moving and the fixed electrodes are arranged to make the driving force perpendicular to the rotating moment of arm. By changing the electrode overlap length, the magnitude of electrostatic force and stable displacement will be changed. In order to optimize the design, an electrostatic FE analysis was carried out and an empirical force model was established for SEA. A new assembly method which will allow the active electrodes to be located beneath the slider was developed. The active electrodes are connected by inner and outer rings lifted on the base substrate, and the inner and outer rings are connected to platform on which the slider locates. Electrostatic force between active electrodes and platform can be used for exiting out of plane modes, so this provides the possibility of the flying height control. A microactuator that can position the pico-slider over ${\pm}0.5{\mu}m$ using under 20 volts for a 2 kHz fine-tracking servo was designed and fabricated using SoG process.

• 한국정밀공학회지
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• 제24권12호
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• pp.95-103
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• 2007

This paper presents a liquid cooling concept for heat rejection of high power electronic devices existing in notebook computers etc. The design, fabrication, and performance of the planar ECF pump and farced-liquid cooling system are summarized. The electro-conjugate fluid (ECF) is a kind of dielectric and functional fluids, which generates jet flows (ECF-jets) by applying static electric field through a pair of rod-like electrodes. The ECF-jet directly acts on the working fluid, so the proposed planar ECF pump needs no moving part, produces no vibration and noise. The planar ECF pump, consists of a pump housing and electrode substrate, achieves maximum flow rate and output pressure of $5.5\;cm^3/s$ and 7.2 kPa, respectively, at an applied voltage of 2.0 kV. The farced-liquid cooling system, constructed with the planar ECF pump, liquid-cooled heat sink and thermal test chip, removes input power up to 80 W keeping the chip surface temperature below $70\;^{\circ}C$. The experimental results demonstrate that the feasibility of forced-liquid cooling system using ECF is confirmed as an advanced cooling solution on the next-generation high power electronic devices.

• Journal of Electrical Engineering and Technology
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• 제1권1호
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• pp.110-113
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• 2006

A high rate deposition sputtering process of magnesium oxide thin film in oxide mode has been developed using a 20 kW unipolar pulsed power supply. The power supply was operated at a maximum constant voltage of 500 V and a constant current of 40 A. The pulse repetition rate and the duty were changed in the ranges of $10\sim50$ kHz and $10\sim60%$, respectively. The deposition rate increased with rising incident power to the target. Maximum incident power to the magnesium target was obtained by the control of frequency, duty and current. The deposition rate of a moving state was 9 nm m/min at the average power of 1.5 kW. This result shows higher deposition rate than any other previous work involving reactive sputtering in oxide mode. The thickness uniformities over the entire substrate area of $982mm{\times}563mm$ were observed at the processing pressure of $2.8\sim9.5$ mTorr. The thickness distribution was improved at lower pressure. This technique is proposed for application to a high through-put sputtering system for plasma display panels.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2008년도 추계학술대회A
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• pp.1098-1102
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• 2008

To increase the ink transfer rate in the micro-gravure-offset printing, the liquid transfer process between two separating plates is investigated. During the liquid transfer process, in which one plate is fixed and the other one moves vertically, a sessile droplet is separated into two droplets. The volume ratio of the two droplets depends on the contact angles of the two plates. In a numerical study of the ink transfer processes, liquid transfer between two parallel separating plates and between a trapezoidal cavity and an upward moving plate are simulated, as models of the printing of ink from the offset pad onto the substrate and the picking up of ink from the gravure plate by the offset pad, respectively. Also, in experimental study, to obtain various surface contact angles, chemical treatment, plasma treatment, and electrowetting- on-dielectric (EWOD) surface are considered. The transfer rate between two plates is calculated by analyzing the droplet images. From the results, the optimal surface contact angles of the units of the micro-gravure-offset printing can be characterized.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2014년도 제46회 동계 정기학술대회 초록집
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• pp.256.2-256.2
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• 2014

최근 고출력 펄스 스퍼터링, HPPMS (high power pulsed magnetron sputtering)을 개선한 기술이 개발되고 있다. High power impulse magnetron sputtering (HIPIMS)이라고도 불려지는 이 기술은 Kouznetsov1) 에 의해 개발되었으며, 짧은 주기 동안 높은 peak power 밀도를 얻을 수 있기 때문에, 스퍼터링시 높은 이온화율을 만들 수 있다. 스퍼터 된 종들의 높은 이온화는 다양한 분야에서 기존 코팅 물질의 특성 개선 및 self-assisted 이온 증착 공정을 통해 우수한 박막을 제조하는데 기여되고 있다. 그러나 HIPIMS는 순간 전력 밀도가 MW수준으로 높아서 고융점, 고열전도도의 물질에만 적용할 수 있다는 단점을 가지고 있다). 최근에 HIPIMS를 대체하기 위해 modulated pulse POWER (MPP)가 개발되었다. 이것은 스퍼터 된 종들의 이온화율을 높일 수 있음과 동시에 여러 가지 물질에 적용할 수 있다고 보고하고 있다. MPP와 HIPIMS와의 차이점은 HIPIMS는 간단한 하나의 초고출력 펄스를 이용하는 반면에, MPP는 펄스 길이 3 ms 안에서 다양하게 조절이 가능하며, 한 전체 펄스 주기 안에서 다중 세트 펄스와 micro 펄스를 자유롭게 조합하여 인가할 수 있다는 장점이 있다. 본 실험에서는 In2O3 : SnO2의 조성비 10:1 wt% target을 사용하였으며, Ar:O2의 유량비는 10:1의 비율로, 기판의 온도를 올려 주지 않는 상태에서 실험을 하였다. Ar 유량을 40 sccm으로 고정시킨 후 O2의 유량을 2~6 sccm에 대하여 비교를 하였다. 박막의 두께를 100 nm로 이하로 하였을 때 비저항은 $7.6{\times}10-4{\Omega}cm$의 값을, 80% 이상의 투과도와 10 cm2/Vs 이상의 mobility를 얻을 수 있었다. 또한 박막 두께 150 nm로 고정, substrate moving에 따른 ITO 박막의 차이를 알아보았다. 비저항의 값은 $5.6{\times}10-4{\Omega}cm$의 값을, 80% 이상의 투과도와 15 cm2/Vs의 값을 얻었다.

• Structural Engineering and Mechanics
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• 제77권2호
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• pp.167-177
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• 2021

Due to various benefits such as unlimited degrees of freedom, environment adaptability, and safety for humans, engineers have used soft materials with hyperelastic behavior in various industrial, medical, rescue, and other sectors. One of the applications of these materials in the fabrication of bending soft actuators (SA) is that they have eliminated many problems in the actuators such as production cost, mechanical complexity, and design algorithm. However, SA has complexities, such as predicting and monitoring behavior despite the many benefits. The first part of this paper deals with the prediction of SA behavior through mathematical models such as Ogden and Darijani, and its comparison with the results of experiments. At first, by examining different geometric models, the cubic structure was selected as the optimal structure in the investigated models. This geometrical structure at the same pressure showed the most significant bending in the simulation. The simulation results were then compared with experimental, and the final gripper model was designed and manufactured using a 3D printer with silicone rubber as for the polymer part. This geometrical structure is capable of bending up to a 90-degree angle at 70 kPa in less than 2 seconds. The second section is dedicated to monitoring the bending behavior created by the strain sensors with different sensitivity and stretchability. In the fabrication of the sensors, silicon is used as a soft material with hyperelastic behavior and carbon fiber as a conductive material in the soft material substrate. The SA designed in this paper is capable of deforming up to 1000 cycles without changing its characteristics and capable of moving objects weigh up to 1200 g. This SA has the capability of being used in soft robots and artificial hand making for high-speed objects harvesting.

• 한국기계가공학회지
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• 제20권7호
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• pp.33-40
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• 2021

Current industrial flow is directed toward reducing the usage of raw materials by reusing parts, which is referred to as a circular economy (CE). Repair is one of the most value-added approaches in CE, which can be efficiently accomplished via additive manufacturing. The repair technology of metallic parts via the directed energy deposition process, which includes the selective removal and redeposition of damaged regions of metallic parts. Residual stress characteristics depend on the shape of the part and the shape of the redeposition region. The objective of this study is to investigate the effects of the radius and corner position of the substrate on the residual stresses for repair by using finite element analysis (FEA). The residual stress distribution of the 45° angle groove at the edge of the circular shape models on the outer and inner radii was analytically investigated. The analysis was accomplished using SYSWELD software by applying a moving heat source with defined material properties and cooling conditions integrated into the FEA model. The results showed a similar pattern of concentrated stress distribution for all models except the 40-mm and 60-mm radii, for which the maximum stress locations were different. The maximum residual stresses are high but lower than the yield strength, suggesting the absence of cracks and fractures due to residual stresses.