• Journal of the Korean Applied Science and Technology
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• v.36 no.1
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• pp.348-354
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• 2019

Dipalmitoyl phosphatidyl choline(DPPC), Polyphenol Derivatives, and Hematoxylin-Eosin were directly sonicated in acidic condition for 6 minutes to give clear stock solutions. Absorbtion properties of Polyphenol Derivatives in lecithin vesicle of Diphalmitoyl phosphatidyl choline system at $25^{\circ}C$ have been studied by absorbtion spectroscopy. The equilibrium of Polyphenol Derivatives between monomer and dimer in lecithin vesicles have been existed at low concentration of Polyphenol Derivatives, but oligomer has been formed in vesicle at high concentration of lecithin vesicles. By adding Bacteriorhodopsin(BR) to constant concentration of Polyphenol Derivatives decreased the absorbtion ratio(${\alpha}/{\beta}$) of Polyphenol Derivatives was increased during phase transition of dipalmitoyl phosphatidyl choline. In the presence of column eluted lamella vesicle and mixture of uni- and multilamella aggregates. The differences of rate between column eluted- and mixture were observed, therefore column eluted lamella reaction was represented more catalytic effect. The phase transition temperature of hydrolysis on Dipalmitoyl phosphatidyl choline and Polyphenol Derivatives were measured higher than it of Dipalmitoyl phosphatidyl choline and no Polyphenol Derivatives.

• Applied Chemistry for Engineering
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• v.22 no.6
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• pp.623-626
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• 2011

Various poly(amic acid)s were synthesized from PMDA/BPDA/p-PDA/ODA with different mole ratios and effectively converted into 4-component polyimide films by thermal imidization. The chemical structures and thermo-mechanical properties of polyimide films were examined using Fourier transform infrared spectroscopy (FT-IR), thermo-gravimetric analyzer (TGA), thermo-mechanical analyzer (TMA), dynamic mechanical analyzer (DMA) and universal tensile machine (UTM). The tensile strength, modulus, and thermal properties of polyimides films increased with the amount of rigid PMDA and p-PDA, while the elongation and moisture absorption of polyimide films increased with the amount of flexible BPDA and ODA. One of 4-component polyimide films exhibited a similar coefficient of thermal expansion (CTE) value to that of copper when it was composed of PMDA : BPDA : p-PDA : ODA with the ratio of 5 : 5 : 4 : 6. Thus, this polyimide film could be useful for a base film for flexible copper clad laminates (FCCL) of flexible printed circuit boards.

• Clean Technology
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• v.15 no.3
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• pp.172-179
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• 2009

The thermoplastic polyurethane waste (TPU-S) with good tensile properties, hardness, NBS abrasion resistance, specific gravity and low wet coefficient of kinetic friction was melt-blended with ethylene propylene diene monomer rubber (EPDM) with high wet slip resistance and low mechanical properties to form EPDM/TPU-S blend films, and their composition-property relationship was investigated to find the optimum composition for shoe outsole material. The properties except the wet slip resistance increased with increasing TPU-S contents in the blend. All the properties except elongation at break, specific gravity and the wet coefficient of kinetic friction in the range of $0{\sim}65\;wt%$ of TPU-S did not attain the values predicted by the simple additive rule. The optimum weight ratio of EPDM/TPU-S for the application to the typical shoe outsole material was found to be 30/70.

• Korean Chemical Engineering Research
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• v.49 no.1
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• pp.75-82
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• 2011

Five different composition UV-cured poly(urethane acrylate-co-acrylic acid) (PU-co-AA) films have been prepared by reacting isophorone diisocyanate(IPDI), polycaprolactone triol(PCLT), 2-hydroxyethyl acrylate(HEA), and different weight ratio trimethylolpropane triacrylate(TMPTA) and acrylic acid(AA) as diluents, and characterized using a Fourier transform infrared spectroscopy(FT-IR). The adhesion properties onto the stainless steel, morphology, mechanical hardness, and electrical property of UV-cured PU-co-AA films were investigated as a function of acrylic acid(AA) content. All the PU-co-AA films are structure-less and the molecular ordering and packing density decreased with increasing content of AA due to the flexible structure and -COOH side chains in AA. The crosscut test showed that PU-co-AA films without AA and with low content of AA showed 0% adhesion(0B) and the adhesion of PU-co-AA films in the range of 40-50% AA increased dramatically as the content of AA increases. The pull-off measurements showed that the adhesion force of PU-co-AA films to stainless steel substrate varied from 6 to 31 kgf /$cm^2$ and increased linearly with increasing AA content. The mechanical hardness also decreased as the content of AA increases. This may come from relatively linear and flexible structure in AA and low crystallinity in PU-co-AA films with higher content of AA. The higher AA-containing PU-co-AA films showed higher dielectric constant due to the increase of polarization by introducing AA monomer. In conclusion, the physical properties of UV-cured PU-co-AA films are strongly dependent upon the content of AA and the incorporation of AA in polyurethane acrylate is very useful way to increase the adhesion strength of UV-curable polymers on the stainless steel substrate.

• Journal of dental hygiene science
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• v.15 no.3
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• pp.259-264
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• 2015

For this experiment, specimen was manufactured by injecting polymer and monomer into silicon mold with volume ratio of 2.5:1 based on ISO 20795-2 so that average thickness, width and length of specimen would be maintained as 3.3 mm, 10.0 mm and 65.0 mm, respectively depending on spray on technique. Specimen was divided into 3 groups ($25^{\circ}C$, $40^{\circ}C$, $70^{\circ}C$) depending on polymerization temperature and 10 specimen was manufactured for each group and it was polymerized in water tank of ${\pm}1^{\circ}C$ under the setting condition of polymerization time of 15 minutes and pressure of 3 bar. After keeping specimen in distilled water of $37^{\circ}C$ for over 48 hours before experiment, flexural strength (FS) and elasticity modulus (EM) of specimen being tested by using Intron (3344; Instron; Instron). SPSS ver. 16.0 was used for analysis and post-hoc test of Scheffe was performed after using one-way ANOVA. When comparing mean value of FS of resin for orthodontics, it was represented in the range of 71.500 MPa for $25^{\circ}C$ group, 74.920 MPa for $40^{\circ}C$ group and 76.880 MPa for $70^{\circ}C$ group and difference was shown in the order of $25^{\circ}C$ group <$40^{\circ}C$ group <$70^{\circ}C$ group but such difference was not significant statistically (p=0.052). Result of EM mean value of resin for orthodontics was more polymerization temperature was high, the more was significant difference represented in the order of $25^{\circ}C$ group <$40^{\circ}C$ group <$70^{\circ}C$ group (p<0.039).