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Kim H.I.;Kang C.G.
- Proceedings of the Korean Society of Precision Engineering Conference
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- 2005.06a
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- pp.1337-1340
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- 2005
A rheology casting technology has some advantages compared with conventional forming processes such as die casting, squeeze casting and hot/cold forming. The liquid segregation is important on mechanical properties of materials using rheology casting. In this study, so, molecular dynamics simulations were performed for the control of liquid segregation. Because the dynamics of fluid flow about nano-scaled materials is completely different from continuum, molecular dynamics simulations were used. The behavior of particles was far from the truth according to boundary conditions in simple flow. But various movement of particles appear at two or more molecular simulations.
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Park, Junyoung
- Journal of the Korean Society of Manufacturing Process Engineers
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- v.8 no.1
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- pp.43-47
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- 2009
Recently, an approach for nano-scale material deformation has been developed that couples the atomistic and continuum approaches using Finite Element Method (FEM) and Molecular Dynamics (MD). However, this approach still has problems to connect two approaches because of the difference of basic assumptions, continuum and atomistic modeling. To solve this problem, an alternative way is developed that connects the QuasiMolecular Dynamics (QMD) and molecular dynamics. In this paper, we suggest the way to make and validate the MD-QMD coupled model.
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Choe, Deok-Gi;Kim, Ji-Un
- Transactions of the Korean Society of Mechanical Engineers A
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- v.24 no.4 s.175
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- pp.830-838
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- 2000
The paper addresses an application of molecular dynamics technique for fracture mechanics. Molecular dynamics simulation is an atomistic approach, while typical numerical methods such as finite element methods are macroscopic. Using the potential functions, which express the energy of a molecular system, a virtual specimen with molecules is set up and the trajectory of every molecule can be calculated by Newton's equation of motion. Several three-dimensional models with various types of cracks are considered. The stress intensity factors, the sizes of plastic zone as well as the dislocation emission are sought to be compared with the analytical solutions, which result in good agreement.
https://doi.org/10.22634/KSME-A.2000.24.4.830 인용 PDF

Lee, Gyoo-Yeong;Lee, Jun-Ha;Kim, Tae-Eun
- Journal of the Korean Institute of Electrical and Electronic Material Engineers
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- v.25 no.7
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- pp.569-573
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- 2012
We investigated the speed change of the diamond spherical abrasive during the substrate surface polishing under the pad compression by using classical molecular dynamics modeling. We performed three-dimensional molecular dynamics simulations using the Morse potential functions for the copper substrate and the Tersoff potential function for the diamond abrasive. As the compressive pressure increased, the indented depth of the diamond abrasive increased and then, the speed of the diamond abrasive along the direction of the pad moving was decreased. Molecular simulation result such as the abrasive speed decreasing due to the pad pressure increasing gave important information for the chemical mechanical polishing including the mechanical removal rate with both the pad speed and the pad compressive pressure.
https://doi.org/10.4313/JKEM.2012.25.7.569 인용 PDF KSCI