• Title/Summary/Keyword: miniaturization

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Fabrication and Verification of a Water Quality Sensor Equipped with Active RFID Function for Real Time Location (위치추적용 능동형 RFID 기능을 장착한 수질 측정 센서의 제작 및 검증)

  • Jung, Young-Sub;Chang, Hun;Kim, Jin-Young;Kang, Joon-Hee
    • Journal of Korean Society for Geospatial Information Science
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    • v.17 no.1
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    • pp.113-120
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    • 2009
  • Through the automatic sensing of the environment, USN technology can give the best services. In this work, we have developed an active RFID system and examined its performance. By implementing it into water quality sensors, we constructed a system that can detect diverse indoor/outdoor environment and provide information about the pollution level obtained from the temperature and PH sensors. Our RF system had an internal Print-on-PCB antenna for the miniaturization of the tag. We used a RF transceiver CC2510 chipset of TI company to realize the active RFID function. By using RSSI constants obtained, we performed the evaluation of real time location accuracy with a software written in Labview. Among 10 arbitrary locations, we obtained average measurement errors of 1.69 m in x axis and 1.66 m in y axis. This technology can be applied to logistics, environmental monitoring, prevention of missing children and various applications.

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Simple Miniaturization Method of a Microstrip Patch Antenna (마이크로스트립 패치 안테나의 효율적 소형화 기법)

  • 이병제;이호준;강기조;김남영;이종철;김종환
    • The Journal of Korean Institute of Electromagnetic Engineering and Science
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    • v.11 no.6
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    • pp.920-928
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    • 2000
  • In this paper, using newly proposed size reduction technique, the aperture coupled microstrip patch antenna for a repeater system in a mobile communication cellular band (824~849 MHz) is developed with a wide bandwidth, small size, light weight, and low cost. The resonant frequency of microstrip antennas is related to the electric field distribution of the radiating patch. The field strength of $TM_{01}$ mode of a rectangular patch antenna is strongest at each of the extremities of the radiating patch, but negligible at center. Therefore, the size of a patch antenna can be effectively minimized by inserting the narrow rectangular dielectric into just under the edges of the resonant Patch. This Paper also proposes the bandwidth improvement technique by using under-coupling technique with a tuning stub. The VSWR is less than 1.5 : 1 for the whole cellular band. The simulation tool was HFSS, Agilent Technologies, Inc.

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Sectorial Form UWB Antenna with a CPW-fed Uni-Planar (CPW 급전 단일 평면 부채꼴형 UWB 안테나 설계 및 제작)

  • Kim, Nam;Son, Gui-Bum;Park, Sang-Myeong
    • The Journal of Korean Institute of Electromagnetic Engineering and Science
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    • v.18 no.3 s.118
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    • pp.305-314
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    • 2007
  • In this paper, we suggested a CPW-fed UWB antenna with uni-planar sectoral structure. The area where radiation device face ground is designed to have the shape of tapered slot based on exponential function. We modified a rectangular bow-tie dipole structure antenna and thus formed a multi-resonant mode. From this, we expanded the impedance bandwidth and made a feature satisfying VSWR of less than 2 between $3.1\sim10.6GHz$. The test result showed that the return loss less than -10 dB was met in the full-band UWB system and maximum gain of $0.9\sim3.1dB$ was made with the half-power beamwidth of $40.1\sim89.9^{\circ}$ on XY plane(Theta, $Phi=90^{\circ}$) and the full band. By using CPW-fed structure with no ground on the back of the substrate, the suggested antenna is easy to design and its miniaturization is also possible.

Compact Triple-Mode Bandpass Filter Using a Cylindrical Dielectric Resonator (원통형 삼중모드 유전체 공진기를 이용한 대역 통과 여파기의 설계)

  • Jang, Geon-Ho;Park, Nam-Shin;Kim, Byung-Chul;Lee, Don-Yong;Won, Jung-Hee;Wang, Xu-Guang
    • The Journal of Korean Institute of Electromagnetic Engineering and Science
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    • v.26 no.1
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    • pp.30-38
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    • 2015
  • In this paper, the design of a compact triple-mode bandpass filter using a high-Q cylindrical dielectric resonator is proposed. In detail, the triple $TE_{01{\delta}}$ modes along three orthogonal axes are used and novel coupling structure in the metallic enclosure is adopted to introduce the coupling between the resonant modes. Due to the cross coupling, the proposed bandpass filter has an asymmetric frequency response with flexible three transmission zeros, one of which can be located very close to the passband edge to provide an extremely sharp skirt characteristic with low insertion loss. The proposed filter is about 60 % miniaturized compared with conventional single-mode dielectric resonator filter. The proposed bandpass filter design is validated by the circuit and 3D EM simulations and measurements compared to the target specifications.

Chemical Mechanical Planarization of Cu Hybrid Structure by Controlling Surfactant (계면활성제 함량 조절을 통한 구리 하이브리드 구조물의 화학 기계적 평탄화)

  • Jang, Soocheon;An, Joonho;Park, Jaehong;Jeong, Haedo
    • Korean Journal of Materials Research
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    • v.22 no.11
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    • pp.587-590
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    • 2012
  • Recently, the demand for the miniaturization of package substrates has been increasing. Technical innovation has occurred to move package substrate manufacturing steps into CMP applications. Electroplated copper filled trenches on the substrate need to be planarized for multi-level wires of less than $10{\mu}m$. This paper introduces a chemical mechanical planarization (CMP) process as a new package substrate manufacturing step. The purpose of this study is to investigate the effect of surfactant on the dishing and erosion of Cu patterns with the lines and spaces of around $10/10{\mu}m$ used for advanced package substrates. The use of a conventional Cu slurry without surfactant led to problems, including severe erosion of $0.58{\mu}m$ in Cu patterns smaller than $4/6{\mu}m$ and deep dishing of $4.2{\mu}m$ in Cu patterns larger than $14/16{\mu}m$. However, experimental results showed that the friction force during Cu CMP changed to lower value, and that dishing and erosion became smaller simultaneously as the surfactant concentration became higher. Finally, it was possible to realize more globally planarized Cu patterns with erosion ranges of $0.22{\mu}m$ to $0.35{\mu}m$ and dishing ranges of $0.37{\mu}m$ to $0.69{\mu}m$ by using 3 wt% concentration of surfactant.

Monitoring and Controlling Uniformity of Plasma Emission Intensity for IGZO Sputtering Process (IGZO박막 증착 공정에서 플라즈마 방출광 모니터링 및 플라즈마 균일도 제어)

  • Choi, Jinwoo;Hwang, Sang Hyuk;Kim, Woo Jae;Shin, Gi Won;Kwon, Heui Tae;Jo, Tae Hoon;Woo, Won Gyun;Cha, Sung Duk;An, Byung Chul;Park, Wan Woo;Do, Jae Chul;Kwon, Gi-Chung
    • Journal of the Semiconductor & Display Technology
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    • v.15 no.4
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    • pp.27-32
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    • 2016
  • In recent years, various researches have been conducted to improve process yields in accordance with miniaturization of semiconductor. APC(Advanced Process Control) is considered one of the methods to increase in process yields. APC is a process control technology that maintains optimal process conditions and improves the reliability of results by controlling and formulating the relationship among the various process parameters and results. We built up an optical diagnostic system with a three-channel spectrometer. The system detects signals those represent the changes of specific emission peaks intensity versus each reference and converts it into MFC control signals to get back the changes to the reference state. Controlling the MFC continues until the specific peak intensity changes into the normal state. Through this device, we tested a APC automatically responding to process changes during the plasma process. We could control gas flow while sputtering process on going and improve uniformity of plasma intensity with this system. Finally, we have got results those enhance the plasma intensity non-uniformity to 7.7% from 15.5%. Also, found unexpected oxygen flow what is estimated to be come out from IGZO target.

Wideband Annular Ring Slot Microstrip Antenna with Concentric Radiating Structure (동심원 복사구조를 갖는 광대역 원형 링슬롯 마이크로스트립 안테나)

  • Shin, Ho-Sub;Kim, Nam;Rhee, Seung-Yeop;Ahn, Bierng-Chearl
    • Journal of the Institute of Electronics Engineers of Korea TC
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    • v.40 no.9
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    • pp.384-391
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    • 2003
  • The wideband annular ring slot antenna with concentric radiating structure and low impedance feedline has been presented. This antenna has been analyzed in compensation for FR-4 substrate with relative permittivity 4.3 and thickness 1 mm. As the measured 10 dB impedance bandwidth of the proposed antenna is 127.2%(2.17∼9.76 GHz), its bandwidth is much broader than maximum 82% bandwidth of a conventional annular ring slot antenna. Experimental results from 2 to 10 GHz are shown to be in good agreement with the simulation. And this antenna has a high gain above 4 dBi from 2 GHz to 10 GHz as well as a 24% size reduction and 42% area reduction than a circular slot antenna.

High Efficiency Magnetic Resonance Wireless Power Transfer System and Battery Charging Chip (자기 공진 방식의 고효율 무선 전력 전송 시스템 및 배터리 충전 칩)

  • Youn, Jin Hwan;Park, Seong Yeol;Choi, Jun Rim
    • Journal of the Institute of Electronics and Information Engineers
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    • v.52 no.6
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    • pp.43-49
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    • 2015
  • In this paper, we propose enhanced wireless power transfer system based on magnetic resonance for portable electronic device charging. Resonators were designed and fabricated for efficiency improvement and miniaturization through electromagnetism simulation using HFSS(High Frequency Structure Simulator). Impedance matching network is employed to minimize reflections that is caused by difference between input impedance and output impedance. Receiver IC that consist of rectifier and Low Drop Out(LDO) regulator were designed and fabricated to reduce power loss. This chip is implemented in $0.35{\mu}m$ BCD technology. A maximum overall efficiency of 73.8% is determined for the system through experimental verification.

A feedback cancellation algorithm with time delay and time-varying decorrelation filter for digital hearing aid (시간 지연과 시변 상관성 제거 필터를 이용한 디지털보청기용 궤환제거 알고리즘)

  • Lee, Sang-Min;Park, Young;Jung, Se-Young;Kim, In-Young;Kim, Sun-I
    • Journal of the Institute of Electronics Engineers of Korea SC
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    • v.42 no.4 s.304
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    • pp.45-50
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    • 2005
  • In digital hearing aid system, one of the main problems is acoustic feedback which is known as howling because of miniaturization md high-gain amplification. In this paper, we proposed a feedback cancellation algorithm for hearing aid using time delay and time-varying decorrelation filter. The proposed algorithm has a kind of adaptive filter structure, which is combined with time delay and time-varying decorrelation filter to improve feedback cancellation. An all pass filter was implemented as the time-varying decorrelation filter using low frequency modulator. From the result of computer simulation, it is verified that the proposed algorithm has good ability to cancel feedback.

Consideration of Optimized Thickness of Dielectric Layers in Miniaturization of Microwave Devices and Application of Aerosol Deposition Method (마이크로파 소자의 소형화에 있어서 유전체 막의 최적화 두께에 대한 고찰 및 Aerosol Deposition Method의 적용)

  • Kim, Yoon-Hyun;Lee, Dae-Seok;Lee, Ji-Won;Choi, Yoon-Seok;Lee, Young-Jin;Nam, Song-Min
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2008.06a
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    • pp.349-349
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    • 2008
  • 유비쿼터스 시대를 맞이하여 현재의 전자제품은 고주파 환경에서의 소형화된 마이크로파 소자를 요구하고 있다. 현재 구현되고 있는 마이크로파 소자의 형태는 여러 가지 전송선로 중에 하나로서 금속의 그라운드면 위에 유전체 막을 형성하고 그 위에 금속선을 정밀하게 패터닝하여 각 종 소자를 연결하는 microstrip line의 형태가 많이 사용된다. 이러한 microstrip line 형태의 소자를 설계할 시에 소자 자체의 구조나 유전체 막이 그 소자의 성능을 크게 좌우한다. 여기서 유전체 막은 신호선과 그라운드면 간의 전자파를 집중시켜주어 방사손실을 줄여주는 역할을 한다. 유전체 막의 두께는 소자의 전체적인 크기를 결정하는 요인이 된다. 이는 유전체 막의 두께가 감소할 경우 50 $\Omega$ 임피던스 매칭을 위해 막 위에 형성되는 소자들의 선폭도 동시에 줄여야 하므로 소자의 소형화도 가능 하여진다. 하지만 유전체 막의 두께가 감소할 경우 전자파가 유전체 막에 집중되지 못하여 방사손실이 커지게 되고 소자의 성능이 저하된다. 이런 점을 고려할 때 소자의 소형화를 만족시키면서 동시에 소자의 성능을 유지할 수 있는 유전체 막의 최적화 두께에 대한 연구가 필요하다. 볼 연구에서는 유전체 막의 최적화 두께를 제시하기 위해 대표적 마이크로파 소자인 Edge-Coupled Filter에 대하여 3-D Electromagnetic Simulator로 설계하고 유전체 막의 두께와 Filter 성능 간의 관계를 연구하였다. Filter의 성능은 유지하도록 하면서 유전체 막의 두께를 감소시켜 나간 결과, 약 30 ~ 40 ${\mu}m$ 의 최적화 두께를 얻을 수 있었다. 한편 30 ~ 40 ${\mu}m$ 두께의 후막 공정을 고려할 때 기존의 성막공정으로는 성막시간, 공정의 난이도, 공정온도 등의 면에서 난점이 존재하며 이러한 점들을 극복할 수 있는 Aerosol Deposition Method의 적용 가능성에 대해서 연구하였다.

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